IEEE Transactions on Components, Packaging and Manufacturing Technology最新文献_第9页

Failure Mechanism and Reliability Research of Solder Layer Tilt in Double-Sided Cooling Power Modules 双面冷却电源模块焊层倾斜的失效机理与可靠性研究

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-30 DOI: 10.1109/TCPMT.2024.3447124

Guoliao Sun;Wen Jing;Siyuan Lu;Cheng Peng;Wenhui Zhu;Liancheng Wang

{"title":"Failure Mechanism and Reliability Research of Solder Layer Tilt in Double-Sided Cooling Power Modules","authors":"Guoliao Sun;Wen Jing;Siyuan Lu;Cheng Peng;Wenhui Zhu;Liancheng Wang","doi":"10.1109/TCPMT.2024.3447124","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3447124","url":null,"abstract":"The double-sided cooling (DSC) module introduces greater thermomechanical stress compared to single-sided cooling (SSC) modules, posing a significant threat to reliability. The manufacturing process is complex, requiring multiple sintering or reflow operations. Due to gravitational factors, this results in uneven thickness in the solder layer, further exacerbating the reliability issues. This article investigates the failure mechanism of the middle solder layer (SAC305) in flip-chip double-sided cooling (FCDSC) modules under thermal cycling conditions using a thermomechanical coupled model. The results indicate that when the solder layer tilt angle reaches 1.53°, the lifetime is reduced by 99.3%. Local viscoplastic strain in the solder at stress concentration areas is identified as a key factor in solder layer fatigue failure. Subsequent experiments confirm that fatigue cracks occur on the thinner side of the solder layer. There, the coarsening of the Ag3Sn eutectic phase is more severe, leading to reduced tensile strength, thus becoming a crack initiation site. Finally, the protrusions-spacer technique is proposed to control the evenness of the solder layer, with experiments demonstrating an average reduction in solder layer tilt by 79.7%.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 9","pages":"1585-1592"},"PeriodicalIF":2.3,"publicationDate":"2024-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142551996","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A New Differential Composite Probe With Parasitic Series Loops and High Sensitivity 一种新型高灵敏度寄生串联回路差分复合探头

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-30 DOI: 10.1109/TCPMT.2024.3487979

Lei Wang;Sha Tang;Tao Zhang;Zhangming Zhu

{"title":"A New Differential Composite Probe With Parasitic Series Loops and High Sensitivity","authors":"Lei Wang;Sha Tang;Tao Zhang;Zhangming Zhu","doi":"10.1109/TCPMT.2024.3487979","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3487979","url":null,"abstract":"In this work, a new differential composite probe with parasitic series loops is developed. The proposed probe consists of a U-shaped loop as the driving element, a pair of series dual loops as parasitic loops, and two striplines with two output sub-miniature-As (SMAs). First, a traditional U-shaped loop probe is utilized to test the electromagnetic fields (E and H) at the same time. Second, a pair of series dual loops as parasitic elements is inserted on both sides of the U-shaped loop to improve the detection sensitivity. The reason is that additional parasitic loops can receive more electromagnetic field components, which can increase the detection sensitivity. It is noticed that a pair of special connected via is used to connect the end of series dual loops with the middle U-shaped loop in a mirrored manner. To prevent unwanted electromagnetic modes, two rows of via fences next to these detection loops are introduced into the proposed probe. In addition, to demonstrate the unique features of the presented probe, the probe’s simulation model is simulated, fabricated, and measured based on a standard \u0000<inline-formula> <tex-math>$50~Omega $ </tex-math></inline-formula>\u0000 microstrip line. Measured results reveal that the presented differential composite probe can not only test the electromagnetic fields (E and H) at the same time but also have high detection sensitivity and low profile.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 11","pages":"1905-1911"},"PeriodicalIF":2.3,"publicationDate":"2024-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142777864","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Effect of Effective Curing Shrinkage of EMC on Strip Warpage During IC Encapsulation Process 集成电路封装过程中电磁兼容有效固化收缩对带材翘曲的影响

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-30 DOI: 10.1109/TCPMT.2024.3488009

Ian Hu;Yi-Rong Huang;Heng-Sheng Lin;Dao-Long Chen

{"title":"Effect of Effective Curing Shrinkage of EMC on Strip Warpage During IC Encapsulation Process","authors":"Ian Hu;Yi-Rong Huang;Heng-Sheng Lin;Dao-Long Chen","doi":"10.1109/TCPMT.2024.3488009","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3488009","url":null,"abstract":"Using numerical simulation to create a digital twin for process evaluation is vital for sustainable and intelligent manufacturing, which can predict manufacturing failures and design for optimization in advance. Material characterization plays a crucial role in a convinced numerical simulation creation. Encapsulation-induced warpage is a vital issue of integrated circuit (IC) packaging. A strip of flip-chip chip-scale package (fcCSP) was chosen as the test vehicle. A Moldex3D simulation model was developed to evaluate the encapsulating process from filling to curing to cooling. The effective curing shrinkage of epoxy molding compound (EMC) can be derived from the encapsulating process. The material properties of EMC, including effective curing shrinkage, thermal shrinkage, and viscoelasticity, are considered in the warpage simulation. The simulation result correlates well with the experiment result. Regarding package design, the effect of various factors on the warpage was investigated using Taguchi’s method. Several component sizes, material parameters, and process parameters were selected as the design factors, including the chip thickness, substrate core thickness, EMC thickness, EMC Young’s modulus, EMC coefficient of thermal expansion, EMC curing shrinkage, mold temperature, and transfer pressure. The evaluation results indicate that the material properties of EMC and mold temperature are the most critical parameters for warpage control of the IC package. This study demonstrates a digital twin for the encapsulating process and provides guidance for robust package design.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 11","pages":"2088-2097"},"PeriodicalIF":2.3,"publicationDate":"2024-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142777868","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thermomechanical and Compression Analyses for Large-Scale Co-Packaged Optics (CPO) Assembly 大规模共封装光学元件（CPO）组件的热力学和压缩分析

IF 2.3 3区工程技术

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-30 DOI: 10.1109/TCPMT.2024.3488003

Rui Cao;Huimin He;Fengze Hou;Rui Ma;Fengman Liu;Qidong Wang;Liqiang Cao

{"title":"Thermomechanical and Compression Analyses for Large-Scale Co-Packaged Optics (CPO) Assembly","authors":"Rui Cao;Huimin He;Fengze Hou;Rui Ma;Fengman Liu;Qidong Wang;Liqiang Cao","doi":"10.1109/TCPMT.2024.3488003","DOIUrl":"https://doi.org/10.1109/TCPMT.2024.3488003","url":null,"abstract":"With the development of artificial intelligence (AI) and other high-performance computing, the data transmission bandwidth in data centers has increased to 51.2 Tbps and will double every two years. The traditional pluggable optical modules have difficulty in satisfying the requirements. Co-packaged optics (CPO) integrates ASICs and optical engines (OEs) on the same substrate, providing a low energy loss and high throughput solution. However, the CPO structure is complicated and the package size is large. Therefore, the assembly-induced mechanical stresses and warpage of CPO are serious issues. In this article, assembly feasibility based on a \u0000<inline-formula> <tex-math>$200times 200$ </tex-math></inline-formula>\u0000 mm2 51.2-Tbps CPO was analyzed by a cross-scale simulation methodology with multiple mechanical stresses. First, the ASIC structure optimization of the CPO was carried out, and the CPO substrate was determined. Then, based on the above-optimized structure, the thermal reflow simulations of ASIC and mechanical compression simulations of OEs were conducted by the birth and death element method. The results showed that the stiffener ring in the ASIC package was optimized to be 3 mm in height and 15 mm in width. The 5-mm PCB was determined for the CPO substrate. The CPO substrate warpage under the socket after the thermal reflow was less than 0.05 mm and the maximum equivalent stresses of the ball grid array (BGA) in the whole assembly process were less than the yield strength of the SAC305 by submodel structure analysis. The socket terminal forces after mechanical compression were greater than 0.1 N. The analyzed results meet the process targets during the assembly of the CPO.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 11","pages":"2079-2087"},"PeriodicalIF":2.3,"publicationDate":"2024-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142777656","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

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IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information 电气和电子工程师学会《部件、封装和制造技术》期刊出版信息

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IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-30 DOI: 10.1109/TCPMT.2024.3471051

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IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors IEEE 《部件、封装和制造技术》期刊为作者提供的信息

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IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-30 DOI: 10.1109/TCPMT.2024.3471053

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IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-30 DOI: 10.1109/TCPMT.2024.3484209

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IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information 电气和电子工程师学会《元件、封装和制造技术》学会信息

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IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-30 DOI: 10.1109/TCPMT.2024.3484225

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IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information 电气和电子工程师学会《元件、封装和制造技术》学会信息

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IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-30 DOI: 10.1109/TCPMT.2024.3471055

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IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors IEEE 《部件、封装和制造技术》期刊为作者提供的信息

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IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-10-30 DOI: 10.1109/TCPMT.2024.3484223

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