Toward TSV-Compatible Microfluidic Cooling for 3D ICs

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-12-12 DOI:10.1109/TCPMT.2024.3516653

Geyu Yan;Euichul Chung;Erik Masselink;Shane Oh;Muneeb Zia;Bharath Ramakrishnan;Vaidehi Oruganti;Husam Alissa;Christian Belady;Yunhyeok Im;Yogendra Joshi;Muhannad S. Bakir

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引用次数: 0

Abstract

Cooling presents a significant challenge for high-performance 3-D integrated circuits (3D ICs). To this end, this research explores through-silicon via (TSV)-compatible micropin-fin heat sink (MPFHS) for high-power 3-D chip stacks. Copper TSVs with a diameter of

$5.2~\mu $

m and a high aspect ratio (HAR) of 29:1 are developed. An extensive experimental and computational investigation of the MPFHS under varying flow rates and power conditions was conducted, showing that the MPFHS maintains an average chip temperature below

$72~^{\circ }$

C, even with a total power dissipation of 500 W and a power density of 312 W/cm2 at a flow rate of 117 mL/min. The minimum total thermal resistance achieved was

$0.286~^{\circ }$

$\cdot $

cm2/W.

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兼容tsv的3D集成电路微流控冷却研究

冷却是高性能3D集成电路（3D ic）面临的重大挑战。为此，本研究探索了用于大功率3d芯片堆叠的通硅通孔（TSV）兼容微针翅片散热器（MPFHS）。研制了直径为$5.2~ $ μ $ m、高纵横比（HAR）为29:1的铜tsv。在不同流量和功率条件下对MPFHS进行了广泛的实验和计算研究，结果表明，在流量为117 mL/min、总功耗为500 W、功率密度为312 W/cm2的情况下，MPFHS的平均芯片温度保持在$72~^{\circ}$ C以下。得到的最小总热阻为$0.286~^{\circ}$ C $\cdot $ cm2/W。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.