通过电感耦合互连实现光子集成电路和电子集成电路的非接触集成

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-12-04 DOI:10.1109/TCPMT.2024.3511042

Tongchuan Ma;Liyiming Yang;Yanlu Li;Yuan Du

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引用次数: 0

摘要

本文介绍了一种通过电感耦合互连的光子集成电路（PICs）和电子集成电路（EICs）的创新非接触封装技术。这种方法的主要目的是增强发热电逻辑芯片和热敏光学干涉仪芯片之间的热隔离。通过电磁仿真验证了该非接触式收发器的可行性，该收发器实现了激光多普勒测振仪（LDV）到EIC的信息传输。此外，COMSOL进行的热模拟证明，与传统的3-D堆叠封装相比，这种封装配置可以将PICs的温度降低高达4.6~^{\circ}$ C，强调了其改善热性能的潜力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Noncontact Integration of Photonic IC and Electronic IC via Inductively Coupled Interconnects

This letter presents an innovative noncontact packaging technique for photonic integrated circuits (PICs) and electronic integrated circuits (EICs) through inductively coupled interconnects. The primary aim of this approach is to enhance thermal isolation between the heat-generating electrical logic die and the thermally sensitive optical interferometer die. The feasibility of this contactless transceiver, which fulfills information transmission from the laser Doppler vibrometry (LDV) to the EIC, is substantiated via electromagnetic simulations. Furthermore, thermal simulations conducted by COMSOL prove that this packaging configuration could potentially reduce the temperature of PICs by up to

$4.6~^{\circ }$

C when compared to the conventional 3-D stack packaging, underlining its potential for improved thermal performance.

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.