Millimeter-Wave Multilayer Ultrawideband Common-Mode Filters Using Defected Ground Structure

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-12-16 DOI:10.1109/TCPMT.2024.3517734

Yijun Weng;Wenjie Feng;Yongrong Shi;Guangxu Shen;Yunfei Cao;Yixi Tang;Haoshen Zhu;Lin-Sheng Wu;Wenquan Che;Quan Xue

引用次数: 0

Abstract

This article proposes two innovative millimeter-wave multilayer ultrawideband common-mode filters (CMFs). Microstrip lines and striplines are employed in CMFs to accomplish more comprehensive research. Common-mode (CM) suppression can be substantially strengthened by introducing a sandwich-like stack-up structure. The equivalent circuits expressed by the transmission line model are provided and analyzed. Analysis of electric/magnetic field is also given. For the proposed microstrip line CMF, a 13.04-GHz wide stopband response covering 17.91–30.95 GHz can be obtained. For the proposed stripline CMF, the 10-dB bandwidth can reach up to 20.12 GHz (17.39–37.51 GHz). Moreover, the differential-mode (DM) insertion loss of CMFs within 40 GHz is less than 3 dB. The proposed CMFs exhibit excellent DM matching level, ultrawide CM stopband bandwidth, low mode conversion level, and compact size.

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利用缺陷接地结构的毫米波多层超宽带共模滤波器

本文提出了两种创新的毫米波多层超宽带共模滤波器（CMF）。在 CMF 中采用了微带线和带状线，以完成更全面的研究。通过引入类似三明治的叠层结构，可大大加强共模（CM）抑制能力。提供并分析了由传输线模型表示的等效电路。还给出了电场/磁场分析。对于拟议的微带线 CMF，可以获得 13.04 GHz 的宽停止带响应，覆盖 17.91-30.95 GHz。对于拟议的带状线 CMF，10 分贝带宽可达 20.12 GHz（17.39-37.51 GHz）。此外，CMF 在 40 GHz 范围内的差模（DM）插入损耗小于 3 dB。所提出的 CMF 具有出色的 DM 匹配水平、超宽 CM 截止带宽、低模式转换水平和紧凑的尺寸。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.