在超过100°C的恶劣环境中实现硅光子光收发器的高可靠性,超过十年的运行

IF 3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
K. Kurata;S. Kobayashi;T. Nakamura;K. Yashiki;T. Muto;M. Kuwata;D. Okamoto;Y. Hagihara;R. Pitwon
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引用次数: 0

摘要

在本文中,我们报告了一种硅光子微收发器的设计和性能,该收发器设计用于恶劣环境,包括105~^{\circ}$ C以上的高温环境和空间环境。此外,我们证明了微收发器模块已应用于浸入式冷却,由于其光学有源元件的新颖性,必须考虑另一种恶劣的环境条件。四通道“IOCore(注册商标)”微收发器采用1310纳米量子点(QD)激光系统,以32 GBd或更高的符号速率运行。5 × 5 mm的微收发器芯片得益于多模耦合接口,可实现低成本组装和高温下的坚固连接。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Achieving High Reliability in Silicon Photonics Optical Transceivers for Harsh Environments Over 100 °C in Excess of Ten-Year Operation
In this article, we report on the design and performance of a silicon photonics microtransceiver, which is designed to operate in harsh environments including high-temperature environments above $105~^{\circ }$ C and space environments. In addition, we demonstrated that the microtransceiver modules have been applied to immersion cooling, which must be considered another harsh environmental condition due to its novelty for optical active components. The four-channel “IOCore (Registered trademark)” microtransceiver incorporates a 1310-nm quantum dot (QD) laser system and operates at a symbol rate of 32 GBd and higher. The $5\times 5$ mm microtransceiver chip benefits from a multimode coupling interface for low-cost assembly and robust connectivity at high temperatures.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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