利用时间门控技术表征低损耗板的复介电常数

IF 3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Bing Xue
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引用次数: 0

摘要

本文提出了一种评估亚太赫兹(THz)频率下低损耗介质板复介电常数的创新方法。与传统的自由空间技术不同,所提出的方法不需要精确的被测材料厚度知识(MUT)和参考平面校准。即使在单个样品中MUT厚度发生变化时,该方法也有效地降低了相关的估计不确定性。将该方法应用于厚有机玻璃和尼龙板在140 - 210 ghz频率范围内的介电常数估算,结果与已发表的文章吻合良好,且估算结果的不确定性较低。所提出的方法非常适合太赫兹频率下的介电常数表征,特别是在缺乏精确尺子或MUT厚度在单个样品中变化的情况下。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Complex Permittivity Characterization of Low-Loss SlabsUsing Time-Gating Technique
This letter presents an innovative method for assessing the complex dielectric constants of low-loss dielectric slabs at sub-terahertz (THz) frequencies. Differing from conventional free-space techniques, the proposed approach removes the need for precise thickness knowledge of the material under test (MUT) and reference plane calibration. Even when the MUT thickness varies in a single sample, the proposed method effectively reduces the relevant estimate uncertainty. When applying it to estimate the permittivity of thick plexiglass and nylon plates across the 140–210-GHz frequency range, it demonstrates good agreement with published articles and lower uncertainty of the estimates. The proposed method is well-suited for permittivity characterizations at THz frequencies, particularly in scenarios where precise rulers are lacking or MUT thickness varies in a single sample.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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