Issam El Gmati;Yosra Gmati;Wided Amara;Ridha Ghayoula;Amor Smida;Mohamed Ibrahim Waly;Jaouhar Fattahi;Jamil Satouri
{"title":"A Novel 3-D-Printed Passive Microfluidic Temperature Sensor for Medical Applications","authors":"Issam El Gmati;Yosra Gmati;Wided Amara;Ridha Ghayoula;Amor Smida;Mohamed Ibrahim Waly;Jaouhar Fattahi;Jamil Satouri","doi":"10.1109/TCPMT.2025.3552029","DOIUrl":null,"url":null,"abstract":"The electrical response of a novel passive 3-D-printed temperature sensor could significantly broaden its scope of applications and enhance the integration of microelectro-mechanical system (MEMS) microfluidic-based laboratory-on-a-chip (LOC) technologies. This article introduces an innovative temperature sensor based on the microfluidic technology which is well-suited for medical applications. The sensor’s design and optimization were conducted using multiphysics modeling and finite element method (FEM) simulations, implemented through FreeFEM++ software. Samples were produced using stereolithographic 3-D printing. A metal carrier was constructed to secure the chips during tank heating and the flow visualization with a microscope. X-ray microtomography tests were performed on chips to compare real parts with CAD models. Filling tests were conducted to position the liquid within the microfluidic channel. Furthermore, several types of liquids were tested, and contact angle (CA) measurements were employed to characterize the microfluidic chip’s structural material (DS3000) and various liquids, aiding in discerning the dielectric liquid were applied also. Among the liquids tested, water emerged as the most promising for this type of temperature sensor. Volume expansion calculations for different temperature values were performed, revealing a measured linear thermal expansion exceeding <inline-formula> <tex-math>$40~\\mu $ </tex-math></inline-formula>m/°C within the range of <inline-formula> <tex-math>$20~^{\\circ }$ </tex-math></inline-formula>C–<inline-formula> <tex-math>$55~^{\\circ }$ </tex-math></inline-formula>C. This study paves the way for microfluidic devices capable of measuring low flow rates using a temperature effect, thereby providing access to 16 an electrical response.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 7","pages":"1432-1445"},"PeriodicalIF":3.0000,"publicationDate":"2025-03-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10929020/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The electrical response of a novel passive 3-D-printed temperature sensor could significantly broaden its scope of applications and enhance the integration of microelectro-mechanical system (MEMS) microfluidic-based laboratory-on-a-chip (LOC) technologies. This article introduces an innovative temperature sensor based on the microfluidic technology which is well-suited for medical applications. The sensor’s design and optimization were conducted using multiphysics modeling and finite element method (FEM) simulations, implemented through FreeFEM++ software. Samples were produced using stereolithographic 3-D printing. A metal carrier was constructed to secure the chips during tank heating and the flow visualization with a microscope. X-ray microtomography tests were performed on chips to compare real parts with CAD models. Filling tests were conducted to position the liquid within the microfluidic channel. Furthermore, several types of liquids were tested, and contact angle (CA) measurements were employed to characterize the microfluidic chip’s structural material (DS3000) and various liquids, aiding in discerning the dielectric liquid were applied also. Among the liquids tested, water emerged as the most promising for this type of temperature sensor. Volume expansion calculations for different temperature values were performed, revealing a measured linear thermal expansion exceeding $40~\mu $ m/°C within the range of $20~^{\circ }$ C–$55~^{\circ }$ C. This study paves the way for microfluidic devices capable of measuring low flow rates using a temperature effect, thereby providing access to 16 an electrical response.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.