Lei Sang;Hui Tian;Wenlong Bi;Shengjie Zhao;Ping Li;Qiang Chen;Hao Tu
{"title":"A Flexible RF Link Enabled by the Redefinable Microwave Passive Components","authors":"Lei Sang;Hui Tian;Wenlong Bi;Shengjie Zhao;Ping Li;Qiang Chen;Hao Tu","doi":"10.1109/TCPMT.2025.3591150","DOIUrl":null,"url":null,"abstract":"To realize “FPGA-like” microwave components and enhance the reconfiguration ability of microwave links, this article proposes a redefinable microwave component that breaks the limitations of conventional microwave components with single functionality. The redefinable microwave components adopt a “combining tangram” design approach to identify the “greatest common divisor” among several microwave functional structures. The patch + gap structure is used as the multiplex unit, and the RF switches are used to control the current flow direction, forming different electromagnetic distributions, thus achieving dynamic reconfiguration of microwave functions. The resonant performance is adjusted using variable capacitors, enabling the reconfiguration of the performance. The test results of the sample indicate that the microwave passive component can achieve software-defined antenna, filtering, and coupling functions, with adjustable center frequencies for all three functions. Compared with commonly used antenna, filter, or coupler, the performance metrics of the redefinable microwave components have not decreased. Furthermore, the component has also been applied for practical validation in radar systems. The demonstration results show that the redefinable microwave component significantly improves the reconfiguration performance of the microwave link, enabling the microwave system to meet the requirements of multiple application scenarios such as imaging, communication, and distance measurement.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 9","pages":"1973-1985"},"PeriodicalIF":3.0000,"publicationDate":"2025-07-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11087648/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
To realize “FPGA-like” microwave components and enhance the reconfiguration ability of microwave links, this article proposes a redefinable microwave component that breaks the limitations of conventional microwave components with single functionality. The redefinable microwave components adopt a “combining tangram” design approach to identify the “greatest common divisor” among several microwave functional structures. The patch + gap structure is used as the multiplex unit, and the RF switches are used to control the current flow direction, forming different electromagnetic distributions, thus achieving dynamic reconfiguration of microwave functions. The resonant performance is adjusted using variable capacitors, enabling the reconfiguration of the performance. The test results of the sample indicate that the microwave passive component can achieve software-defined antenna, filtering, and coupling functions, with adjustable center frequencies for all three functions. Compared with commonly used antenna, filter, or coupler, the performance metrics of the redefinable microwave components have not decreased. Furthermore, the component has also been applied for practical validation in radar systems. The demonstration results show that the redefinable microwave component significantly improves the reconfiguration performance of the microwave link, enabling the microwave system to meet the requirements of multiple application scenarios such as imaging, communication, and distance measurement.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.