关系型SI/ pi数据库用于PCB设计自动化和性能预测的数据驱动方法

IF 3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Til Hillebrecht;Tommy Weber;Johannes Alfert;Christian Schuster
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引用次数: 0

摘要

将机器学习(ML)方法引入印刷电路板(pcb)的设计过程中,推动了对大量现成数据的需求。本文解决了工程师寻找ml就绪数据的问题,这些数据可以很容易地重用和组合,通过在关系数据库中以规范化格式存储定义参数来增强PCB设计。实现了搜索和过滤功能,快速获取相关数据。该数据库包含用于解决各种不同的信号完整性(SI)和功率完整性(PI)相关问题的数据。描述了数据库结构的细节、必要的数据转换步骤、当前存储的数据集及其统计分析。该数据库能够自动化到机器学习代理可以与之交互的程度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Relational SI/PI-Database for a Data-Driven Approach to PCB Design Automation and Performance Prediction
The introduction of machine learning (ML) methods into the design process of printed circuit boards (PCBs) drives the need for large quantities of readily available data. This article addresses the problems of engineers to find ML-ready data that can be easily reused and combined to enhance PCB design by storing the defining parameters in a normalized format within a relational database. It implements search and filter functions to obtain relevant data quickly. The database contains data that were used to address a variety of different signal integrity (SI)- and power integrity (PI)-related problems. Details of the database structure, necessary data conversion steps, currently stored datasets, and a statistical analysis thereof are described. This database is capable of being automated to a degree that ML agents can interact with it.
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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