{"title":"Millimeter-Wave On-Chip Ultrawideband Bandpass Filter on Coupled Line Based Bi-Path Topology Using GaAs Technology","authors":"Zhuowei Zhang;Gang Zhang;Kam-Weng Tam;Xin Zhou;Shichang Chen","doi":"10.1109/TCPMT.2024.3519369","DOIUrl":null,"url":null,"abstract":"In this article, using gallium arsenide (GaAs) technology, a revolutionary millimeter-wave on-chip ultrawideband (UWB) bandpass filter (BPF) with greatly enhanced operation performance is demonstrated for the first time. By utilizing quarter wavelength short-circuited lines with an open-circuited interdigital coupled line and a short-circuited combine coupled line, it is altered from the traditional wideband BPF structure to create a flexible coupled line based bi-path topology. In comparison to the traditional structure, the suggested topology can efficiently increase passband selectivity with more flexible transmission zeros (TZs), as well as two more transmission poles (TPs) for a flatter UWB passband and a larger return loss (RL) bandwidth. For verification, an on-chip UWB BPF prototype using 0.25-<inline-formula> <tex-math>$\\mu $ </tex-math></inline-formula>m GaAs pHEMT technology is designed, fabricated, and measured. The measurements show that it has a center frequency of 45.3 GHz with a fractional bandwidth (FBW) of 135%. A good agreement is found between the simulated and measured data.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 3","pages":"553-559"},"PeriodicalIF":2.3000,"publicationDate":"2024-12-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10804844/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Millimeter-Wave On-Chip Ultrawideband Bandpass Filter on Coupled Line Based Bi-Path Topology Using GaAs Technology
In this article, using gallium arsenide (GaAs) technology, a revolutionary millimeter-wave on-chip ultrawideband (UWB) bandpass filter (BPF) with greatly enhanced operation performance is demonstrated for the first time. By utilizing quarter wavelength short-circuited lines with an open-circuited interdigital coupled line and a short-circuited combine coupled line, it is altered from the traditional wideband BPF structure to create a flexible coupled line based bi-path topology. In comparison to the traditional structure, the suggested topology can efficiently increase passband selectivity with more flexible transmission zeros (TZs), as well as two more transmission poles (TPs) for a flatter UWB passband and a larger return loss (RL) bandwidth. For verification, an on-chip UWB BPF prototype using 0.25-$\mu $ m GaAs pHEMT technology is designed, fabricated, and measured. The measurements show that it has a center frequency of 45.3 GHz with a fractional bandwidth (FBW) of 135%. A good agreement is found between the simulated and measured data.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.