Aerosol-Jet Printed High-Q Quasi-Optical FSSs on Flex Substrates Using a Novel Parylene Lift-Off Process

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2024-12-23 DOI:10.1109/TCPMT.2024.3521292

Sambit Kumar Ghosh;Ethan Kepros;Premjeet Chahal

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引用次数: 0

Abstract

This article introduces a new method to fabricate low-loss terahertz (THz) frequency-selective surfaces (FSSs) on flexible substrates. The process involves the printing of periodic metallic patterns on glass substrate using aerosol-jet printing (AJP) technology and silver-based nanoparticle ink followed by a novel lift-off process using thin parylene-C. The printed structures on glass can be sintered at high temperatures to achieve high conductivity silver structures. These printed structures are lifted of using a thin (

$10~\mu $

m) parylene-C. Use of thin parylene-C reduces the effective dielectric losses. Several designs are demonstrated including parallel wire-grid and a tilted I-shaped polarizer, and a few THz FSS bandpass and band-stop filters. All the prototypes are designed, fabricated, and experimentally validated. The proposed FSSs can find applications in the next generation of low-loss THz flexible electronics.

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.