High-Selectivity Bandpass Filters With Low Loss and Reduced Size Based on HCILA Slow Wave Technology Encapsulated in Patch Cavities

IF 3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Hang Qian;De-Wei Zhang;Qing Liu;Xi Wang;Xiao-Ming Li;Hong-Hui Xu
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引用次数: 0

Abstract

In this letter, the novel low-loss and reduced-size single- and dual-mode (S-DM) slow wave rectangular patch resonators (SWRPRs) are proposed based on a hybrid capacitive–inductive-load array (HCILA). The SWRPRs are analyzed in detail, and a highly selective DM two-pole quasi-elliptic bandpass filter (BPF) is proposed. The in-band insertion loss (IL) and size of the BPF are significantly reduced due to the use of HCILA. Three- and four-pole BPFs are realized by S-DM SWRPRs, and the introduced additional finite transmission zero (FTZ) can be efficiently controlled by phase coupling. A four-pole BPF is designed, fabricated, and measured for the demonstration. Results indicate that the proposed patch BPF offers the benefits of reduced size, high selectivity, and low loss, thereby expanding the potential applications of patch circuits.
基于HCILA慢波封装贴片腔的低损耗小尺寸高选择性带通滤波器
在这封信中,提出了一种基于混合容感负载阵列(HCILA)的新型低损耗和小尺寸单双模(S-DM)慢波矩形贴片谐振器(swrpr)。详细分析了双极准椭圆带通滤波器,提出了一种高选择性双极准椭圆带通滤波器。由于使用HCILA, BPF的带内插入损耗(IL)和尺寸显着降低。三极和四极bpf由S-DM swrpr实现,引入的附加有限传输零(FTZ)可以通过相位耦合有效控制。为了演示,设计、制作和测量了一个四极BPF。结果表明,所提出的贴片BPF具有减小尺寸、高选择性和低损耗的优点,从而扩大了贴片电路的潜在应用。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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