Design and Demonstration of Dual-Core Spiral Package-Embedded Inductors for Integrated Voltage Regulators

IF 3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Venkatesh Avula;Prahalad Murali;Madhavan Swaminathan
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引用次数: 0

Abstract

Novel package-embedded inductors utilizing a dual-core spiral topology, designed for improved performance in integrated power delivery systems, are presented in this article. The proposed inductor features a simple fabrication process, gapped magnetic cores for stable performance across varying operating conditions, and overlapping spiral windings in adjacent layers, achieving high inductance density. The proposed topology consists of a spiral-shaped conductor winding layer sandwiched between two magnetic core layers. The conductor and insulating dielectric layers separate the cores and act as an air gap for the magnetic flux of the spiral inductor. The air gap causes an increase in the saturation current performance of the inductor. In addition to the single spiral winding, two advanced spiral inductor configurations, namely, two spiral windings in series and parallel, are explored. To enable design, a physical model and analytical monomial expressions are provided for inductance calculation. To evaluate the performance of these designs, three inductor samples are fabricated with two different magnetic core materials and air gaps. Overall, package-embedded dual-core spiral inductors with a performance of 115-nH inductance with 5-A saturation current and 330-nH inductance with 3.5A saturation current, occupying a 9- $\text {mm}^{2}$ area and having efficiencies ranging from 75% to 80%, are demonstrated.
集成稳压器双芯螺旋封装嵌入式电感的设计与演示
利用双核螺旋拓扑的新型封装嵌入式电感,旨在提高集成电力输送系统的性能,在文章中提出。所提出的电感具有简单的制造工艺,在不同的工作条件下保持稳定性能的间隙磁芯,以及相邻层重叠的螺旋绕组,从而实现高电感密度。所提出的拓扑结构包括夹在两个磁芯层之间的螺旋形导体绕组层。导体和绝缘介质层将磁芯分开,并作为螺旋电感器磁通量的气隙。气隙使电感的饱和电流性能增加。除了单螺旋绕组外,还探索了两种先进的螺旋电感结构,即串联和并联两种螺旋绕组。为了便于设计,提供了一个物理模型和解析式来进行电感计算。为了评估这些设计的性能,用两种不同的磁芯材料和气隙制造了三个电感样品。总体而言,封装式双芯螺旋电感具有115-nH的5 a饱和电流和330-nH的3.5A饱和电流,占据9- $ $\text {mm}^{2}$的面积,效率范围为75%至80%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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