Naibo Zhang;Ze Yan;Ke Han;Guangyao Yang;Qiuquan Guo;Ruiliang Song;Zhongliang Deng;Jun Yang
{"title":"基于方向图可重构天线的集成广角扫描平面相控阵","authors":"Naibo Zhang;Ze Yan;Ke Han;Guangyao Yang;Qiuquan Guo;Ruiliang Song;Zhongliang Deng;Jun Yang","doi":"10.1109/TCPMT.2025.3559561","DOIUrl":null,"url":null,"abstract":"This article demonstrates an integrated wide-angle scanning planar phased array based on pattern reconfigurable antennas (PRAs). The PRA unit consists of four rotationally symmetrical elements with a dimension less than <inline-formula> <tex-math>$0.41~\\lambda \\times 0.41~\\lambda $ </tex-math></inline-formula>. By exciting different elements, the beam of the unit switches between four modes and has a 3 dB coverage of ±77°, which helps the antenna array achieve an expanded scanning range. The reconfigurable principle and bandwidth enhancement method of the compact antenna unit are analyzed; the radiation efficiency and the performances of the array are also discussed. The whole system of the phased array is integrated on a multilayer hybrid PCB board, which includes a <inline-formula> <tex-math>$4\\times 4$ </tex-math></inline-formula> reconfigurable antenna array, TR modules, 4-channel RF chips, a beam control circuit, and a power management circuit. The measured return loss of the antenna unit is less than −10 dB in the frequency range of 27–30 GHz, and the scanning range is from −68° to 68° with a maximum gain of 16.4 dBi. The gain fluctuation of the array in beam scanning is less than 2 dB, and the scanning range of −3 dB covers ±80°.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 6","pages":"1307-1318"},"PeriodicalIF":3.0000,"publicationDate":"2025-04-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"An Integrated Wide-Angle Scanning Planar Phased Array Based on Pattern Reconfigurable Antenna\",\"authors\":\"Naibo Zhang;Ze Yan;Ke Han;Guangyao Yang;Qiuquan Guo;Ruiliang Song;Zhongliang Deng;Jun Yang\",\"doi\":\"10.1109/TCPMT.2025.3559561\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This article demonstrates an integrated wide-angle scanning planar phased array based on pattern reconfigurable antennas (PRAs). The PRA unit consists of four rotationally symmetrical elements with a dimension less than <inline-formula> <tex-math>$0.41~\\\\lambda \\\\times 0.41~\\\\lambda $ </tex-math></inline-formula>. By exciting different elements, the beam of the unit switches between four modes and has a 3 dB coverage of ±77°, which helps the antenna array achieve an expanded scanning range. The reconfigurable principle and bandwidth enhancement method of the compact antenna unit are analyzed; the radiation efficiency and the performances of the array are also discussed. The whole system of the phased array is integrated on a multilayer hybrid PCB board, which includes a <inline-formula> <tex-math>$4\\\\times 4$ </tex-math></inline-formula> reconfigurable antenna array, TR modules, 4-channel RF chips, a beam control circuit, and a power management circuit. The measured return loss of the antenna unit is less than −10 dB in the frequency range of 27–30 GHz, and the scanning range is from −68° to 68° with a maximum gain of 16.4 dBi. The gain fluctuation of the array in beam scanning is less than 2 dB, and the scanning range of −3 dB covers ±80°.\",\"PeriodicalId\":13085,\"journal\":{\"name\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"volume\":\"15 6\",\"pages\":\"1307-1318\"},\"PeriodicalIF\":3.0000,\"publicationDate\":\"2025-04-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Components, Packaging and Manufacturing Technology\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10962166/\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10962166/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
An Integrated Wide-Angle Scanning Planar Phased Array Based on Pattern Reconfigurable Antenna
This article demonstrates an integrated wide-angle scanning planar phased array based on pattern reconfigurable antennas (PRAs). The PRA unit consists of four rotationally symmetrical elements with a dimension less than $0.41~\lambda \times 0.41~\lambda $ . By exciting different elements, the beam of the unit switches between four modes and has a 3 dB coverage of ±77°, which helps the antenna array achieve an expanded scanning range. The reconfigurable principle and bandwidth enhancement method of the compact antenna unit are analyzed; the radiation efficiency and the performances of the array are also discussed. The whole system of the phased array is integrated on a multilayer hybrid PCB board, which includes a $4\times 4$ reconfigurable antenna array, TR modules, 4-channel RF chips, a beam control circuit, and a power management circuit. The measured return loss of the antenna unit is less than −10 dB in the frequency range of 27–30 GHz, and the scanning range is from −68° to 68° with a maximum gain of 16.4 dBi. The gain fluctuation of the array in beam scanning is less than 2 dB, and the scanning range of −3 dB covers ±80°.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.