An Integrated Wide-Angle Scanning Planar Phased Array Based on Pattern Reconfigurable Antenna

IF 3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Components, Packaging and Manufacturing Technology Pub Date : 2025-04-10 DOI:10.1109/TCPMT.2025.3559561

Naibo Zhang;Ze Yan;Ke Han;Guangyao Yang;Qiuquan Guo;Ruiliang Song;Zhongliang Deng;Jun Yang

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引用次数: 0

Abstract

This article demonstrates an integrated wide-angle scanning planar phased array based on pattern reconfigurable antennas (PRAs). The PRA unit consists of four rotationally symmetrical elements with a dimension less than

$0.41~\lambda \times 0.41~\lambda $

. By exciting different elements, the beam of the unit switches between four modes and has a 3 dB coverage of ±77°, which helps the antenna array achieve an expanded scanning range. The reconfigurable principle and bandwidth enhancement method of the compact antenna unit are analyzed; the radiation efficiency and the performances of the array are also discussed. The whole system of the phased array is integrated on a multilayer hybrid PCB board, which includes a

$4\times 4$

reconfigurable antenna array, TR modules, 4-channel RF chips, a beam control circuit, and a power management circuit. The measured return loss of the antenna unit is less than −10 dB in the frequency range of 27–30 GHz, and the scanning range is from −68° to 68° with a maximum gain of 16.4 dBi. The gain fluctuation of the array in beam scanning is less than 2 dB, and the scanning range of −3 dB covers ±80°.

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基于方向图可重构天线的集成广角扫描平面相控阵

本文介绍了一种基于方向图可重构天线的集成广角扫描平面相控阵。PRA单元由四个旋转对称单元组成，尺寸小于$0.41~\lambda \乘以$0.41~\lambda $。通过激发不同的元件，该单元的波束在四种模式之间切换，具有±77°的3db覆盖范围，这有助于天线阵列实现扩大的扫描范围。分析了紧凑型天线单元的可重构原理和带宽增强方法；讨论了阵列的辐射效率和性能。整个相控阵系统集成在多层混合PCB板上，其中包括4 × 4可重构天线阵列、TR模块、4通道射频芯片、波束控制电路和电源管理电路。在27 ~ 30 GHz频率范围内，天线单元的回波损耗小于−10 dB，扫描范围为−68°~ 68°，最大增益为16.4 dBi。波束扫描时阵列增益波动小于2 dB，−3 dB的扫描范围为±80°。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

4.70

自引率

13.60%

发文量

203

审稿时长

3 months

期刊介绍： IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.