Millimeter-Wave Filtering Power Divider With Sharp Roll-Off Skirt Using Rectangular Waveguide-Spoof Surface Plasmon Polariton Structure

IF 3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Jianxing Li;Siyuan Lv;Weiyu He;Qinlong Li;Sen Yan;Kai-Da Xu
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引用次数: 0

Abstract

A full-metal millimeter-wave (mmWave) filtering power divider (FPD) featuring sharp roll-off skirt which employs rectangular waveguide (RW) spoof surface plasmon polariton (SSPP) structure is proposed in this article. Both upper and lower cut-off frequencies depend on the dimensions of RW-SSPP unit cells, realizing excellent filtering characteristic. The TE10 mode electromagnetic (EM) wave input in the RW is first converted to SSPP12 mode by loading double-sided RW-SSPP structure, which is finally transformed to two SSPP11 modes through single-sided RW-SSPP structure. To validate the proposed concept, a prototype is fabricated and measured. The proposed FPD achieves a wide 3-dB bandwidth from 22.1 to 27.5 GHz with a 30-dB shape factor (SF) of about 1.15, implying a sharp roll-off skirt. The measured return loss and insertion loss are less than 10 and 1 dB within the operation bandwidth, respectively. The measured phase and magnitude imbalances between the two output ports maintains below 11° and 0.68 dB, respectively.
采用矩形波导-欺骗表面等离子激元结构的毫米波滤波尖锐滚落裙边功率分压器
提出了一种采用矩形波导(RW)欺骗表面等离子激元(SSPP)结构的全金属毫米波(mmWave)滤波功率分压器(FPD)。上截止频率和下截止频率取决于RW-SSPP单元格的尺寸,实现了优异的滤波特性。输入RW的TE10模态电磁波首先通过加载双面RW- sspp结构转换为SSPP12模态,最后通过单面RW- sspp结构转换为两个SSPP11模态。为了验证提出的概念,制作了一个原型并进行了测量。所提出的FPD实现了22.1至27.5 GHz的宽3db带宽,30 db形状因子(SF)约为1.15,这意味着一个尖锐的滚下裙摆。测量到的回波损耗和插入损耗在工作带宽内分别小于10 dB和1 dB。两个输出端口之间测量的相位和幅度不平衡分别保持在11°和0.68 dB以下。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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