T. Kwon, Sang-Hoon Lee, Tae-Seon Kim, Hoe-Jin Lee, Young-Kwan Park, Taek-Soo Kim, Seok-Jin Kim, J. Kong
{"title":"Performance improvement for high speed devices using E-tests and the SPICE model","authors":"T. Kwon, Sang-Hoon Lee, Tae-Seon Kim, Hoe-Jin Lee, Young-Kwan Park, Taek-Soo Kim, Seok-Jin Kim, J. Kong","doi":"10.1109/ISQED.2001.915269","DOIUrl":"https://doi.org/10.1109/ISQED.2001.915269","url":null,"abstract":"In order to improve the chip performance, a design or a process optimization occurs occasionally at the manufacturing stage. However modifying the design and the process through the real wafer processing of fabrication increases the time to market. This paper describes an efficient simulation approach for a new IC process centering method based on the SPICE model and E-tests (i.e., threshold voltage and saturation current). This methodology enables obtaining the optimal E-tests for improving the performance of high speed devices, before changing the real process conditions. In addition, the Response Surface Method (RSM) is used as a significant statistical tool for this new procedure. The validity and efficiency of this approach are proven by applying it to an IC process design centering problem for ALPHA CPU.","PeriodicalId":110117,"journal":{"name":"Proceedings of the IEEE 2001. 2nd International Symposium on Quality Electronic Design","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134642786","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Design on ESD protection circuit with very low and constant input capacitance","authors":"Tung-Yang Chen, M. Ker","doi":"10.1109/ISQED.2001.915233","DOIUrl":"https://doi.org/10.1109/ISQED.2001.915233","url":null,"abstract":"Effective on-chip ESD design to solve the ESD protection challenge on the analog pins for high-frequency or current-mode applications is studied. The device dimension of ESD clamp devices in analog ESD protection circuit can be reduced to have a much small input capacitance for high-frequency applications, but it can still sustain a high HBM and MM ESD level. To find the optimized device dimensions and layout spacings on ESD clamp devices, a design model is developed to keep the input capacitance as constant as possible (within 1% variation).","PeriodicalId":110117,"journal":{"name":"Proceedings of the IEEE 2001. 2nd International Symposium on Quality Electronic Design","volume":"289 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122784050","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Using the boundary scan delay chain for cross-chip delay measurement and characterization of delay modeling flow","authors":"J. Schmid, Timo Schüring, Christoph Smalla","doi":"10.1109/ISQED.2001.915253","DOIUrl":"https://doi.org/10.1109/ISQED.2001.915253","url":null,"abstract":"For ASICs/SOCs/lCs it is often very important to have an easily accessible delay measurements path for several reasons. The delay of a long path running across the whole chip through lots of instances (inverters, MUXes) makes it possible to measure the final process parameters of an ASIC/IC within the best and worst case production process window. This information is very important for production testing and assembly at the vendor site. But very often this information is also necessary at circuit pack level, system test level and even in the field - when in the case of problems (functionality, timing, debugging) it should be known which \"quality level\" the ASIC/IC device has reached. Also for characterization of the delay modeling during the different design phases (estimation, floorplanning, trial and final layout) such a dedicated delay path may help in qualifying the delay models. We propose to use a new standard methodology to address these issues by definition of a dedicated delay path. It is called \"Boundary Scan Delay Chain\" (BSDC). We use the Boundary Scan data register according to IEEE1149.1 to get a delay chain across the chip. Only a slight modification of the boundary scan cell (e.g. BC 1, BC 4) is necessary. The resulting new functionality still conforms to IEEE1149.1.","PeriodicalId":110117,"journal":{"name":"Proceedings of the IEEE 2001. 2nd International Symposium on Quality Electronic Design","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125577912","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Soft core based model of a microcomputer family","authors":"N. Q. Trung, K. Siekierska","doi":"10.1109/ISQED.2001.915232","DOIUrl":"https://doi.org/10.1109/ISQED.2001.915232","url":null,"abstract":"A significant trend towards developing soft core based designs has been observed for the last few years. The emphasis is on reduction of time to market and bridging the growing gap between technology capacity and design productivity. The paper briefly presents the design of a configurable microcomputer family model based on a VHDL soft core. Modeling process with emphasis on coding style is mentioned. The paper also proposes a virtual component configuration tool that gives the core user an effective way to set up the model of the microcomputer series, upon the need of particular end-users, and introduces the implementation of industrial microcomputer series based on the model. The work on the extension of the soft core with regard to its reusability as well as on the development of a configurable model of microcontroller class based on the soft core is being done.","PeriodicalId":110117,"journal":{"name":"Proceedings of the IEEE 2001. 2nd International Symposium on Quality Electronic Design","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122392644","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"RC power bus maximum voltage drop in digital VLSI circuits","authors":"G. Bai, S. Bobba, I. Hajj","doi":"10.1109/ISQED.2001.915228","DOIUrl":"https://doi.org/10.1109/ISQED.2001.915228","url":null,"abstract":"This paper presents an input-independent method for finding bounds on the voltage drop in RC power bus in combinational macro-block circuits. The voltage at power bus nodes is expressed in terms of gate currents using sensitivity analysis. Circuit timing information, functionality and logic dependencies are employed to find maximum simultaneous high-to-low, and low-to-high switching in a subinterval of a clock cycle. The sensitivity information together with an optimization procedure are applied to find bounds on the voltage drop in targeted bus nodes. The effects of signal statistical variations on the results are automatically included in our method. Comparisons to exhaustive HSPICE simulation of circuits extracted from layout are used to validate our approach.","PeriodicalId":110117,"journal":{"name":"Proceedings of the IEEE 2001. 2nd International Symposium on Quality Electronic Design","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122433647","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Diversity techniques for concurrent error detection","authors":"S. Mitra, E. McCluskey","doi":"10.1109/ISQED.2001.915234","DOIUrl":"https://doi.org/10.1109/ISQED.2001.915234","url":null,"abstract":"Concurrent error detection (CED) techniques are widely used to ensure data integrity in digital systems. Data integrity guarantees that the system outputs are either correct or an error is indicated when incorrect outputs are produced. This dissertation presents the results of theoretical and simulation studies of various CED techniques. The CED schemes studied are based on diverse duplication, simple duplication of identical implementations, and error-detection techniques like parity checking. The study aimed at [1] a quantitative comparison of the effectiveness different CED schemes, and (2) developing design techniques for efficient concurrent error detection.","PeriodicalId":110117,"journal":{"name":"Proceedings of the IEEE 2001. 2nd International Symposium on Quality Electronic Design","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127491564","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Acceleration of DAB chipset development by deployment of a real-time rapid prototyping approach based on behavioral synthesis","authors":"M. Speitel, M. Schlicht, Martin Leyh","doi":"10.1109/ISQED.2001.915262","DOIUrl":"https://doi.org/10.1109/ISQED.2001.915262","url":null,"abstract":"The development of a new digital communication system has the twofold goal to achieve all traditional requirements from the end user prospective and to offer a huge potential of additional services compared with existing analog systems. The extremely demanding time frame for the introduction of such a system requires a development approach reducing the design risk to a minimum especially for the end user receivers. As an integral part of the terminal the digital baseband processor is one of the most challenging receiver components in terms of development and validation effort. The complexity of the ASIC design with initially estimated 500,000 to 1,000,000 gate equivalents has driven the deployment of a real-time prototyping system. To assure real-time and identical functionality on both FPGA prototype and ASIC behavioral synthesis was used for timing-critical and computationally intensive building blocks. The design and validation methodology was successfully implemented. The ASIC will be introduced in the first generation of mobile radio receivers for digital audio broadcasting in the United States.","PeriodicalId":110117,"journal":{"name":"Proceedings of the IEEE 2001. 2nd International Symposium on Quality Electronic Design","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131634319","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A model for crosstalk noise evaluation in deep submicron processes","authors":"P. Bazargan-Sabet, F. Ilponse","doi":"10.1109/ISQED.2001.915218","DOIUrl":"https://doi.org/10.1109/ISQED.2001.915218","url":null,"abstract":"To certify, the correctness of a design, in deep submicron technologies, the verification process has to cover some new issues. The noise introduced on signals through the crosstalk coupling is one of these emerging problems. In this paper, we propose a model to evaluate the peak value of the noise injected on a signal during the transition of its neighboring signals. This model has been used in a prototype verification tool and has shown a satisfying accuracy within a reasonable computation delay.","PeriodicalId":110117,"journal":{"name":"Proceedings of the IEEE 2001. 2nd International Symposium on Quality Electronic Design","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132028282","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Models for interconnect capacitance extraction","authors":"A. Husain","doi":"10.1109/ISQED.2001.915222","DOIUrl":"https://doi.org/10.1109/ISQED.2001.915222","url":null,"abstract":"Commonly used numerical methods in capacitance extraction both for small and large circuit blocks are reviewed for a VLSI design. Boundary element based field solvers can effectively be used for small structures but can not be used for large structures because of large grid requirement. Field solvers based on random walk method are more appropriate for large structures but still they are quite slow in comparison to analytic capacitance models, which are generally applied for chip level extractions. Accounting for 3D fringing fields has become essential in analytic models for accurate extraction of current VLSI technologies.","PeriodicalId":110117,"journal":{"name":"Proceedings of the IEEE 2001. 2nd International Symposium on Quality Electronic Design","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126974959","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"VSIA quality metrics for IP and SoC","authors":"M. Birnbaum, Charlene C. Johnson","doi":"10.1109/ISQED.2001.915243","DOIUrl":"https://doi.org/10.1109/ISQED.2001.915243","url":null,"abstract":"A Study Group of the Virtual Socket Interface Alliance has produced a comprehensive approach to measuring IP and SoC quality. A highly usable tool, the Quality Evaluation Spreadsheet (QES) was developed with a large set of quality attributes, metrics for each attribute, and a user importance (weight) for each attribute. The metrics are designed for rapid assessment by the IP provider and the IP integrator. The spreadsheet can be extended and tailored for individual company and SoC application. The QES can be used by an IP provider for: a simple checklist of quality factors and metrics; individual IP quality evaluation; as an input to IP Integrators for evaluation. The QES can be used by the IP Integrator/customer for: evaluation of a single IP or comparison of IP from several IP providers, or for a whole SoC.","PeriodicalId":110117,"journal":{"name":"Proceedings of the IEEE 2001. 2nd International Symposium on Quality Electronic Design","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125913040","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}