深亚微米工艺串扰噪声评价模型

Proceedings of the IEEE 2001. 2nd International Symposium on Quality Electronic Design Pub Date : 2001-03-26 DOI:10.1109/ISQED.2001.915218

P. Bazargan-Sabet, F. Ilponse

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引用次数: 13

摘要

在深亚微米技术中，为了证明设计的正确性，验证过程必须涵盖一些新的问题。通过串扰耦合在信号上引入的噪声就是这些新出现的问题之一。在本文中，我们提出了一个模型来评估在其相邻信号的过渡过程中注入到信号上的噪声的峰值。该模型已用于原型验证工具，在合理的计算延迟内显示出令人满意的精度。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A model for crosstalk noise evaluation in deep submicron processes

To certify, the correctness of a design, in deep submicron technologies, the verification process has to cover some new issues. The noise introduced on signals through the crosstalk coupling is one of these emerging problems. In this paper, we propose a model to evaluate the peak value of the noise injected on a signal during the transition of its neighboring signals. This model has been used in a prototype verification tool and has shown a satisfying accuracy within a reasonable computation delay.

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Proceedings of the IEEE 2001. 2nd International Symposium on Quality Electronic Design

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