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Fatigue life prediction of solder material: effect of ramp time, hold time and temperature 焊料疲劳寿命预测:斜坡时间、保温时间和温度的影响
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122235
S. Vaynman
{"title":"Fatigue life prediction of solder material: effect of ramp time, hold time and temperature","authors":"S. Vaynman","doi":"10.1109/ECTC.1990.122235","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122235","url":null,"abstract":"The influence of factors such as ramp time, hold time, and temperature on isothermal fatigue of low-tin lead-based solder is investigated. Ways to extrapolate fatigue life are demonstrated. Decrease of frequency below 10/sup -2/ Hz is shown to lead to the reduction in the number of cycles to failure. The relation between N/sub f/ and frequency may be described by Eckel's relation. The effect of frequency is a function of strain range; therefore, the frequency-modified Coffin-Manson relation is not applicable to this solder at strains studied. Hold time dramatically reduces the number of cycles to failure and leads to the saturation in the N/sub f/. The method to calculate this limit is developed. The activation energy is a function of cycling conditions. High strain rates and high strain ranges lead to mixed transgranular-intergranular fracture. Activation energy, which is 24-26 kJ/mol. at low strain ranges and at all strain ranges with low strain rates (slow cycling or hold time in the cycle), can be used for isothermal fatigue data extrapolation of this solder.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122071275","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
Advanced military multilayer thick film hybrid design 先进的军用多层厚膜混合设计
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122320
D. Drummond
{"title":"Advanced military multilayer thick film hybrid design","authors":"D. Drummond","doi":"10.1109/ECTC.1990.122320","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122320","url":null,"abstract":"The author examines design criteria and material issues connected with the production of high-quality nine-layer hybrids for GE Aerospace and their advanced IR sensors. Attention is given to density issues, via design, tiered bonding with thick film, and thick-film materials. These hybrids were manually routed and checked. Subsequent investigations into recent CAD (computer-aided design) technology showed that substantial savings could have been achieved in design time.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125811479","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Advances in military hybrids 军用杂交技术的进展
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122329
R. Jones
{"title":"Advances in military hybrids","authors":"R. Jones","doi":"10.1109/ECTC.1990.122329","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122329","url":null,"abstract":"The author discusses changes in the requirements and specifications of military hybrids, some of the changes occurring in their design, and some of the newer materials and techniques used in their manufacture. Particular attention is given to the computer-aided design of hybrids, substrate materials, thick-film materials and processes, thin-film materials and processes, the tape-transfer process, and assembly processes.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126029688","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Optical components-the new challenge in packaging 光学元件——封装的新挑战
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122190
M. Matthews, B. Macdonald, K. Preston
{"title":"Optical components-the new challenge in packaging","authors":"M. Matthews, B. Macdonald, K. Preston","doi":"10.1109/ECTC.1990.122190","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122190","url":null,"abstract":"Recent developments in the packaging technology for optical components used in fiber transmission systems are reviewed. Topics covered include fiber coupling and fixing techniques, modular packaging concepts, high-speed component design, and advanced-function components. A high-performance package for lithium niobate modulators that illustrates the packaging concepts outlined is described. It is noted that the greatest challenge to date has been the need to develop new packaging techniques for the precision alignment and fixing of optical devices and fiber to tolerances that are at least an order of magnitude more critical than those encountered in the packaging of conventional electronic devices. The development of new die-bonding techniques has been required for handling unusual materials and large chips, and very-high-speed packaging and interconnection technique are evolving to meet the requirements of high-capacity systems. Other developments include the use of modular techniques for increasing the versatility of packaging technology, and the development of single-package advanced-function devices that simplify the use of optoelectronic devices by incorporating interface and control circuits. Likely future trends in optical communications are discussed, and the implications for component packaging are considered.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127434488","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 59
Package design for high-speed low-cost ASIC LSIs 高速低成本ASIC芯片的封装设计
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122319
K. Otsuka, Y. Shirai, T. Miwa, T. Nakano, A. Yamagiwa, T. Hatada, T. Tsuboi
{"title":"Package design for high-speed low-cost ASIC LSIs","authors":"K. Otsuka, Y. Shirai, T. Miwa, T. Nakano, A. Yamagiwa, T. Hatada, T. Tsuboi","doi":"10.1109/ECTC.1990.122319","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122319","url":null,"abstract":"Cofired alumina ceramic, alumina-based Cu/polyimide thin films, and plastic PGAs (pin-grid-arrays) are compared in terms of electrical and thermal characteristics and cost. Plastic PGA with the cavity down and a three-layer structure is shown to be the best way to meet the requirement of over 50-MHz signal transmission, thermal resistance and cost. The best results on the 592-pin plastic PGA package and its simulation results are described.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127439386","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Special properties of molding compound for surface mounting devices 表面贴装装置用成型化合物的特殊性能
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122253
T. Nishioka, M. Nagasaqa, K. Igarashi, M. Kohmoto, S. Ito
{"title":"Special properties of molding compound for surface mounting devices","authors":"T. Nishioka, M. Nagasaqa, K. Igarashi, M. Kohmoto, S. Ito","doi":"10.1109/ECTC.1990.122253","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122253","url":null,"abstract":"An equation was developed for use in the design of a molding compound with increased resistance to the popcorn (package cracking) phenomenon. After evaluating many kinds of raw materials to achieve the goal, the authors chose two resin systems; one resin system is low glass transition temperature, Tg, while the other is high T/sub g/. High-density filling with silica helped improve the antipopcorn properties. It is concluded that low-Tg molding compounds have obvious advantages over high-Tg molding compounds in terms of the antipopcorn property. From this study, the authors recommend low-Tg molding compounds that have low-S, low-E, low-Df, and high- sigma properties to protect surface-mount devices from the popcorn phenomenon.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129956241","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 21
Benzocyclobutene as a dielectric for multichip module fabrication 苯并环丁烯作为多芯片模组制造的电介质
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122272
M. Berry, T. Tessier, I. Turlik, G. Adema, D.C. Burdeaux, J. Carr, P. Garrou
{"title":"Benzocyclobutene as a dielectric for multichip module fabrication","authors":"M. Berry, T. Tessier, I. Turlik, G. Adema, D.C. Burdeaux, J. Carr, P. Garrou","doi":"10.1109/ECTC.1990.122272","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122272","url":null,"abstract":"Data compiled for an experimental nonsilicon-containing benzocyclobutene (BCBII) are presented. The results are compared with those obtained from the standard silicon-containing benzocyclobutene (BCBI). The comparison is based on results obtained from studies of properties such as planarization, stress, adhesion, and pinhole density on both spin and spray coatings of the BCB materials. Planarization studies were performed using a test pattern containing a variety of linewidth and space dimensions. A single-beam laser deflection method was utilized for the measurement of stress. Adhesion properties were determined using a Sebastian III adherence tester. A summary of these results and their implications for the use of BCB as a dielectric material for multichip module (MCM) fabrication is presented.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"104 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122527342","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
A nonlinear thermal stress analysis of surface mount solder joints 表面贴装焊点的非线性热应力分析
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122305
Burhan Ozmat
{"title":"A nonlinear thermal stress analysis of surface mount solder joints","authors":"Burhan Ozmat","doi":"10.1109/ECTC.1990.122305","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122305","url":null,"abstract":"A set of nonlinear finite-element (FE) cyclic thermal stress analyses of leaded ceramic chip carriers (LCCC) was performed. The FE models included the geometric and elastic compliance effects associated with the LCCC cavity, Kovar lid, copper solder pads and thermal joints, the orthotropic printed wiring board (PWB), and a constraining thermal core. The effect of nonlinear and rate-dependent constitutive characteristics of the solder alloy on the distribution of cyclic stress, strain, and energy-dissipation behavior was studied. It is shown that the inclusion of rate effects in the material behavior has a paramount effect on the stress, strain, and energy-dissipation predictions. The difference is due to the creep relaxation leading to redistribution of the load, which was not predicted by an elastic-plastic material model alone. Acceleration factors were calculated from the results of analyses performed for an accelerated thermal test cycle case and a specific real-life thermal cycle case.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131106326","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 20
Lead inductance of ferromagnetic materials and a method to reduce inductance at low frequencies 铁磁材料的引线电感及低频电感的减小方法
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122323
C.C. Huang
{"title":"Lead inductance of ferromagnetic materials and a method to reduce inductance at low frequencies","authors":"C.C. Huang","doi":"10.1109/ECTC.1990.122323","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122323","url":null,"abstract":"Data on the inductance of Alloy 42 and Kovar and its relationship to frequency are presented. The domain theory is applied to explain the relaxation phenomena of ferromagnetic materials vs. ferrites. The measured inductance of ferromagnetic materials and copper strips is compared with theoretical calculations. Also, a method of reducing the inductance of ferromagnetic materials at low frequencies is discussed. A transition state between 1 and 10 MHz in Alloy 42 and Kovar is found. Non-ferromagnetic materials (copper, solder, gold, silver, etc.) can be plated over the entire ferromagnetic material to reduce the inductance at low and high frequency. It is shown that there is no way to find the quantitative value of magnetic permeability of ferromagnetic material by measuring the inductance and employing the analytical formula at low-current (mA) and low-voltage (mV) conditions.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"124 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128115812","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Reliability of infrared surface light emitting diodes suitable for military and avionic wavelength division multiplexing systems 适用于军用和航空电子波分复用系统的红外表面发光二极管的可靠性
40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122166
C. E. Lindsay, R. Conlon
{"title":"Reliability of infrared surface light emitting diodes suitable for military and avionic wavelength division multiplexing systems","authors":"C. E. Lindsay, R. Conlon","doi":"10.1109/ECTC.1990.122166","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122166","url":null,"abstract":"A comparative study of the reliability of high-power double-heterojunction surface light-emitting diodes (SLEDs) operating at 750 nm, 1060 nm, and 1300 nm is reported. A data analysis from 9000 h of fully automated life testing is included. Degradation and failure characteristics specific to each operating wavelength are described and related to structural and performance data on each device batch. Median life and activation energies are calculated. The devices examined have shown impressive reliability at very high current densities and temperature (23 kA/cm/sup 2/ and 135 degrees C). The 1300-nm devices, which in common with all three wavelengths received no pretest burn in, registered 0/60 failures after 9000 h of testing. Based on the calculated activation energies, the best batches at each wavelength produce MTTF (mean time to failure) figures in excess of 10/sup 6/ h at 25 degrees C ambient and full DC drive.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116928229","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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