Benzocyclobutene as a dielectric for multichip module fabrication

Abstract

Data compiled for an experimental nonsilicon-containing benzocyclobutene (BCBII) are presented. The results are compared with those obtained from the standard silicon-containing benzocyclobutene (BCBI). The comparison is based on results obtained from studies of properties such as planarization, stress, adhesion, and pinhole density on both spin and spray coatings of the BCB materials. Planarization studies were performed using a test pattern containing a variety of linewidth and space dimensions. A single-beam laser deflection method was utilized for the measurement of stress. Adhesion properties were determined using a Sebastian III adherence tester. A summary of these results and their implications for the use of BCB as a dielectric material for multichip module (MCM) fabrication is presented.<>