Fatigue life prediction of solder material: effect of ramp time, hold time and temperature

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122235

S. Vaynman

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引用次数: 10

Abstract

The influence of factors such as ramp time, hold time, and temperature on isothermal fatigue of low-tin lead-based solder is investigated. Ways to extrapolate fatigue life are demonstrated. Decrease of frequency below 10/sup -2/ Hz is shown to lead to the reduction in the number of cycles to failure. The relation between N/sub f/ and frequency may be described by Eckel's relation. The effect of frequency is a function of strain range; therefore, the frequency-modified Coffin-Manson relation is not applicable to this solder at strains studied. Hold time dramatically reduces the number of cycles to failure and leads to the saturation in the N/sub f/. The method to calculate this limit is developed. The activation energy is a function of cycling conditions. High strain rates and high strain ranges lead to mixed transgranular-intergranular fracture. Activation energy, which is 24-26 kJ/mol. at low strain ranges and at all strain ranges with low strain rates (slow cycling or hold time in the cycle), can be used for isothermal fatigue data extrapolation of this solder.<>

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焊料疲劳寿命预测:斜坡时间、保温时间和温度的影响

研究了斜坡时间、保温时间和温度等因素对低锡铅基焊料等温疲劳的影响。论证了疲劳寿命的外推方法。将频率降低到10/sup -2/ Hz以下，可以减少故障的循环次数。N/下标f/与频率的关系可以用埃克尔关系来描述。频率的影响是应变范围的函数;因此，频率修正的Coffin-Manson关系不适用于所研究的焊料应变。保持时间大大减少了失效的循环次数，并导致N/sub f/饱和。提出了计算这一极限的方法。活化能是循环条件的函数。高应变速率和高应变范围导致了跨晶-沿晶混合断裂。活化能是24- 26kj /mol。在低应变范围和低应变速率的所有应变范围(慢循环或在循环中保持时间)，可用于该焊料的等温疲劳数据外推。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

发文量