高速低成本ASIC芯片的封装设计

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122319

K. Otsuka, Y. Shirai, T. Miwa, T. Nakano, A. Yamagiwa, T. Hatada, T. Tsuboi

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引用次数: 2

摘要

在电学和热特性以及成本方面，比较了共烧氧化铝陶瓷、氧化铝基Cu/聚酰亚胺薄膜和塑料PGAs(引脚网格阵列)。具有空腔和三层结构的塑料PGA被证明是满足50 mhz以上信号传输、热阻和成本要求的最佳方式。描述了592引脚塑料PGA封装的最佳效果及其仿真结果

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Package design for high-speed low-cost ASIC LSIs

Cofired alumina ceramic, alumina-based Cu/polyimide thin films, and plastic PGAs (pin-grid-arrays) are compared in terms of electrical and thermal characteristics and cost. Plastic PGA with the cavity down and a three-layer structure is shown to be the best way to meet the requirement of over 50-MHz signal transmission, thermal resistance and cost. The best results on the 592-pin plastic PGA package and its simulation results are described.<>

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来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

发文量