40th Conference Proceedings on Electronic Components and Technology最新文献_第9页

Automatic optical inspection (AOI) 自动光学检测(AOI)

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122259

O. Hecht, G. Dishon

引用次数: 12

A new draft specification for surface mounting components 表面安装组件的新规范草案

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122200

J. Lynch

引用次数: 0

Analytical and experimental study for designing molding compounds for surface mounting devices 表面贴装装置成型材料设计的分析与实验研究

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122254

S. Ohizumi, M. Ngasawa, K. Igarashi, M. Kohmoto, S. Ito

引用次数: 38

Creep-fatigue modelling for solder-joint reliability predictions including the microstructural evolution of the solder 蠕变疲劳模型的焊接可靠性预测，包括焊料的微观组织演变

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122232

H. Frost, R. Howard

引用次数: 19

Dynamic analysis of impact pinning AL203 ceramic substrates 冲击钉扎AL203陶瓷基板的动力学分析

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122221

B. Campbell, D. W. Henderson, J. Lee, L. Lehman, W.T. Pimbley

引用次数: 0

Physical design of the ODL-250H militarized surface mount optical data link ODL-250H军用表面贴装光数据链路的物理设计

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122192

M.S. Acarlar, J. Plourde, G. Steiner, M. Voitek

{"title":"Physical design of the ODL-250H militarized surface mount optical data link","authors":"M.S. Acarlar, J. Plourde, G. Steiner, M. Voitek","doi":"10.1109/ECTC.1990.122192","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122192","url":null,"abstract":"It is noted that many new military programs for data communications on mobile platforms require the use of fiber-optic systems. The advantages of fiber-optic systems for these applications include EMI (electromagnetic interference) immunity, increased security, reduced weight, and increased information bandwidth. The electrooptic components for these systems must operate over the full military temperature range of -55 degrees C to +125 degrees C. To meet these requirements, a 250-Mb/s hybrid optical data link has been designed and developed for harsh-environment military applications. The transmitter and receiver operate at an optical wavelength of 1.3 mu m and use either 62.5/125- or 100/140- mu m multimode optical fiber. In the absence of any military standards governing fiber-optic digital transmitters and receivers, the materials, processes, and design criteria for the data link were based on the custom hybrid microcircuit requirements of MIL-M-38510 Appendix G, class B. Screening and quality-conformance test procedures were implemented using a modified fiber-optic custom hybrid version of method 5008 of MIL-STD-883. Design criteria, mechanical and optical design, and analysis techniques used to achieve the above performance goals are discussed.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123655732","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Parylene encapsulation of ceramic packages for liquid nitrogen application 用于液氮应用的聚对二甲苯封装陶瓷包装

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122213

H. Tong, L. Mok, K. Grebe, H. Yeh, K. Srivastava, J. Coffin

{"title":"Parylene encapsulation of ceramic packages for liquid nitrogen application","authors":"H. Tong, L. Mok, K. Grebe, H. Yeh, K. Srivastava, J. Coffin","doi":"10.1109/ECTC.1990.122213","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122213","url":null,"abstract":"A study was undertaken to determine the effectiveness of a thin layer (9.4 mu m in thickness) of a chemical-vapor-deposited polymer, Parylene, in enhancing the solder lifetime of IBM ceramic packages containing large-DNP (distance to neutral point) test chips during liquid-nitrogen operation. Coated and uncoated (control) packages with chips joined using C4 (controlled collapse chip connection) Pb/Sn solder technology were thermally cycled between near room temperature and liquid-nitrogen temperature. At every 50 or 100 cycles, the electrical resistances of solder joints were measured at room temperature for the nondestructive detection of solder failures based on a solder electrical-resistance criterion. The thermal cycling experiment and electrical measurement were continued until solder failure was first noticed in coated packages. The number of cycles to first failure was twice the corresponding number for uncoated packages. To help interpret this two-fold solder-life enhancement associated with parylene, an elastoplastic finite-element model was developed and used to determine the thermal strain and stress distributions near failed solder joints for coated and uncoated packages during thermal cycling. Based on the results provided by this model and a low-temperature solder lifetime model, the extended solder life was attributed to the ability of Parylene to modify the strain and stress fields in the solder joint as well as to its barrier and conformal-coating properties.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128738737","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Miniaturization of thin cantilever-like contacts 细长悬臂式触点的小型化

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122309

H. Fluss

{"title":"Miniaturization of thin cantilever-like contacts","authors":"H. Fluss","doi":"10.1109/ECTC.1990.122309","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122309","url":null,"abstract":"One consequence of connector miniaturization is the increased sensitivity of the contact normal force to tolerances in geometric and material parameters. This effect is studied for contacts that can be modeled structurally as thin cantilevers, where the tip load corresponds to the normal force. Design curves are developed showing the change in sensitivity as a function of reduction in size for tolerances in length, width, thickness, and Young's modulus. The complementary problem of determining the reduction in tolerance needed to maintain a given normal force variation as the contact is reduced is also solved. The contact that is stressed into the elastic-plastic regime in the reduced configuration is considered. It is found that, for thin cantilever-like contacts, the sensitivity of normal forces is increased most for tolerances in length, followed by tolerances in thickness. However, since the percentage tolerance in thickness is greater than the tolerance in length for most designs, thickness will likely be the critical parameter in reducing a design. It is also found that to maintain a given normal force range as one scales down, the tolerances allowed have to be reduced by the scaling factor.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128947723","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Wideband characterization and modeling of TAB packages using time domain techniques 使用时域技术的TAB包的宽带表征和建模

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122308

W. Su, S. Riad, T. Poulin, D. Fett, Z. Shen

引用次数: 3

Large scale multilayer glass-ceramic substrate for supercomputer 用于超级计算机的大型多层玻璃陶瓷衬底

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122171

Y. Shimada, Y. Kobayashi, K. Kata, M. Kurano, H. Takamizawa

引用次数: 11