使用时域技术的TAB包的宽带表征和建模

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122308

W. Su, S. Riad, T. Poulin, D. Fett, Z. Shen

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引用次数: 3

摘要

描述了一种使用时域技术的宽带表征和磁带自动键合(TAB)封装建模的方法。该方法利用时域反射数据和改进的暂态电路分析包(MTCAP)来建立基于物理的等效电路模型。该模型在宽频带(DC到>25 GHz)上精确地模拟了TAB。基于该模型进行了计算机模拟，以预测TAB的性能参数。给出了实验测量和计算机模拟的结果。

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Wideband characterization and modeling of TAB packages using time domain techniques

A method for wideband characterization and modeling of tape automated bonding (TAB) packages using time-domain techniques is described. The method uses time-domain reflectometry data along with the modified transient circuit analysis package (MTCAP) to develop a physically based equivalent circuit model. The model accurately simulates the TAB over a wide band of frequencies (DC to >25 GHz). Computer simulations based on the model were performed to predict TAB performance parameters. Results of both the experimental measurements and computer simulations are presented.<>

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来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

发文量