40th Conference Proceedings on Electronic Components and Technology最新文献_第10页

Grain boundary sliding in surface mount solders during thermal cycling 表面贴装焊料在热循环过程中的晶界滑动

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122233

S. Lee, D. Stone

引用次数: 15

Design of HWSI multichip modules for quick prototyping and manufacturing 设计HWSI多芯片模块的快速原型和制造

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122247

Y. Lee

引用次数: 2

The performance and reliability of a new plated copper technology on ceramic 陶瓷镀铜新工艺的性能和可靠性

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122324

J. Fudala, M. Beke

引用次数: 0

Laser/infrared evaluation of TAB innerlead bond integrity TAB内铅键完整性的激光/红外评价

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122227

Hongbee Teoh, Michael McGearyt, Jamin Ling

{"title":"Laser/infrared evaluation of TAB innerlead bond integrity","authors":"Hongbee Teoh, Michael McGearyt, Jamin Ling","doi":"10.1109/ECTC.1990.122227","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122227","url":null,"abstract":"The feasibility of using laser/infrared technology as a noncontact and nondestructive inspection technique to assess tape automated bonded (TAB) inner-lead bond integrity was studied. Chip-on-tape samples with well-bonded inner leads and opens or lifted leads were evaluated. The peak thermal signals obtained during thermal decay after the laser was shut off were evaluated. For a given laser power and exposure time, good bonds and opens generated distinctly different infrared (IR) signatures during thermal decay. Typically, good bonds emitted peak amplitudes which were nominally two to five times lower than those for opens. These were attributed to the superior thermal dissipation properties of well-bonded interconnects as well as to the IR detector configuration in the inspector system. The IR signal modulations observed for well-bonded samples could be explained by the thermal mass/conductance variation associated with circuit metallization patterns on the silicon chip. The results showed that the technique investigated in this study could be adapted as an inprocess inspection scheme for detection of opens or lifted leads. However, refinements are still needed to improve the technique's capability.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"254 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126156993","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Strength and reliability of ceramic modules soldered to flexible cables 焊接在软电缆上的陶瓷模块的强度和可靠性

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122217

N. T. Panousis, J. F. Prosser, A. T. Wang, Y.N. Yong

{"title":"Strength and reliability of ceramic modules soldered to flexible cables","authors":"N. T. Panousis, J. F. Prosser, A. T. Wang, Y.N. Yong","doi":"10.1109/ECTC.1990.122217","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122217","url":null,"abstract":"The strength and reliability of soldered interconnections between module pins and flexible cables are discussed. A quantitative measure of the strength of the connection is described. Individual pins were mechanically tested by measuring the force required to push them through the cable, and force and failure mode were recorded. The push-through test was used to determine optimum solder volume for maximum initial strength and to measure degradation following exposure to environmental stresses. The first reliability stress was to store units at constant elevated temperature of 80, 100, and 125 degrees C for up to 8500 h. Analysis of these results was done with a nonlinear regression model. For the dominant mode, the results of this model are: PS/sub i/(t,T)=3.05-58*exp(-2629/T)*t/sup 0.38/+ epsilon /sub i/, where PS(t,T) is the push-through strength as a function of time, t, and Kelvin temperature, T. epsilon /sub i/ represents the random part and is distributed normally with 0 mean. These results give an effective activation energy of 0.6 eV. The second reliability test was to thermally cycle units between -40 and +100 degrees C for up to 1000 cycles. There was no degradation. A simple first-order estimate indicates that this is equivalent to about five lifetimes.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127477644","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Relation between inner voids of plastic IC packages and non-Newtonian flow characteristics of resin encapsulant 塑料IC封装内部空隙与树脂封装剂非牛顿流动特性的关系

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122255

S. Ichimura, K. Kinashi, T. Urano

引用次数: 7

Development of ultra-thin surface mounting IC package (0.8 mm thick TQFP) 超薄表面贴装IC封装(0.8 mm厚TQFP)的研制

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122206

K. Fujita, S. Oomi, K. Toyozawa, S. Minamide, T. Maeda

{"title":"Development of ultra-thin surface mounting IC package (0.8 mm thick TQFP)","authors":"K. Fujita, S. Oomi, K. Toyozawa, S. Minamide, T. Maeda","doi":"10.1109/ECTC.1990.122206","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122206","url":null,"abstract":"A TQFP (thin quad flat package) with a package size of 10*10 mm and a maximum package thickness of 0.8 mm has been developed to meet the need for lower profiles in surface-mounting packages. For a package thickness of 1.0 mm, the conventional lead-frame thickness and chip thickness are sufficient. However, when the package thickness is reduced to 0.8 mm, a reduction in at least one of the conventional thicknesses is absolutely essential. Therefore, by reducing the thickness of only part of the die-pad portion of the lead frame through the use of chemical etching to approximately 1/2 to 2/3, the resin thickness above the chip and below the die pad is ensured. A low-loop wire bond with a maximum of 0.14 mm was achieved by optimizing the wire material and wire-bond conditions. Ultrathin molding was achieved by improving the fluid characteristics of the resin and by ensuring the resin-fluid balance within the cavity. Package cracking and degraded moisture resistance were evaluated using a 4-Mbit mask ROM. After subjecting it to 85 degrees C and 75% RH for 72 h, no problems were noticed while soldering at 240 degrees C maximum with infrared reflow.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130726417","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Silicones with improved thermal conductivity for thermal management in electronic packaging 用于电子封装热管理的导热系数提高的有机硅

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122251

A. L. Peterson

引用次数: 19

Production of MCP chip carriers MCP芯片载体的生产

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122222

M. E. Williams

引用次数: 5

An aramid/epoxy substrates increased the facility of rigid-flexible substrates for high performance use 芳纶/环氧基板增加了刚性-柔性基板的高性能使用设施

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI: 10.1109/ECTC.1990.122296

E. Tsunashima, A. Okuno, N. Oyama, T. Hirakawa, K. Nishimura

{"title":"An aramid/epoxy substrates increased the facility of rigid-flexible substrates for high performance use","authors":"E. Tsunashima, A. Okuno, N. Oyama, T. Hirakawa, K. Nishimura","doi":"10.1109/ECTC.1990.122296","DOIUrl":"https://doi.org/10.1109/ECTC.1990.122296","url":null,"abstract":"A material has been developed for fabricating rigid-flexible printed boards. The material includes copper-clad laminates (TL-01) and prepregs (ET-100) consisting of a recently developed aramid paper made of an aramid fiber from poly-paraphenylene 3,4' diphenilether terephthalamid (PPDETA) as a reinforcement, and a sophisticated epoxy resin system having high affinity to an aramid fiber as an impregnant. The dimensional stability of the multilayer system has been shown to surpass that of the conventional lamination system of FR-4, polyimide films, and acrylic adhesives. A flexural fatigue test on the flexible printed wiring has been carried out, and the flexible material revealed a higher flexibility than FR-4. Copper migration has been observed after full absorption of moisture by a pressure cooker test (PCT). TL-01 has shown an excellent resistance to migration for more than 50 h, while polyimide film with an acrylic adhesive has shown a heavy migration. It is concluded that this material may be useful for advanced rigid-flex multilayer printed boards suitable for surface mount technologies.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131688575","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1