A new draft specification for surface mounting components

A specification which develops tests to assess the ability of an SMD (surface-mount device), regardless of shape, size, or component family, to withstand the various surface-mount assembly processes is described. The specification identifies these process steps and assesses the stresses which they place upon the SMD. For each type of solder process, a detailed consideration is made of the time/temperature profile. This allows the derivation of severity classifications and the formulation of test methods for solderability, resistance to solder heat, and resistance to dissolution of metallization which are applicable to one or more of the solder attachment techniques. The specification considers substrate cleaning and develops test methods to assess the ability of the SMD to withstand the various cleaning techniques available. Attention is also given to resistance to mechanical forces, including the ability of the SMD to withstand pick and placement forces, substrate bending, and shear test.<>