{"title":"军用杂交技术的进展","authors":"R. Jones","doi":"10.1109/ECTC.1990.122329","DOIUrl":null,"url":null,"abstract":"The author discusses changes in the requirements and specifications of military hybrids, some of the changes occurring in their design, and some of the newer materials and techniques used in their manufacture. Particular attention is given to the computer-aided design of hybrids, substrate materials, thick-film materials and processes, thin-film materials and processes, the tape-transfer process, and assembly processes.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Advances in military hybrids\",\"authors\":\"R. Jones\",\"doi\":\"10.1109/ECTC.1990.122329\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The author discusses changes in the requirements and specifications of military hybrids, some of the changes occurring in their design, and some of the newer materials and techniques used in their manufacture. Particular attention is given to the computer-aided design of hybrids, substrate materials, thick-film materials and processes, thin-film materials and processes, the tape-transfer process, and assembly processes.<<ETX>>\",\"PeriodicalId\":102875,\"journal\":{\"name\":\"40th Conference Proceedings on Electronic Components and Technology\",\"volume\":\"42 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-05-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"40th Conference Proceedings on Electronic Components and Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1990.122329\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"40th Conference Proceedings on Electronic Components and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1990.122329","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The author discusses changes in the requirements and specifications of military hybrids, some of the changes occurring in their design, and some of the newer materials and techniques used in their manufacture. Particular attention is given to the computer-aided design of hybrids, substrate materials, thick-film materials and processes, thin-film materials and processes, the tape-transfer process, and assembly processes.<>