IEEE microwave and wireless technology letters最新文献_第5页

150 GHz-Band Compact Phased-Array AiP Module for XR Applications Toward 6G 面向6G的XR应用的150ghz频段紧凑型相控阵AiP模块

IEEE microwave and wireless technology letters Pub Date : 2025-06-04 DOI: 10.1109/LMWT.2025.3565729

Yohei Morishita;Ken Takahashi;Ryosuke Hasaba;Akihiro Egami;Tomoki Abe;Masatoshi Suzuki;Tomohiro Murata;Yoichi Nakagawa;Yudai Yamazaki;Sunghwan Park;Takaya Uchino;Chenxin Liu;Jun Sakamaki;Takashi Tomura;Hiroyuki Sakai;Hiroshi Taneda;Kei Murayama;Yoko Nakabayashi;Shinsuke Hara;Issei Watanabe;Akifumi Kasamatsu;Kenichi Okada;Koji Takinami

{"title":"150 GHz-Band Compact Phased-Array AiP Module for XR Applications Toward 6G","authors":"Yohei Morishita;Ken Takahashi;Ryosuke Hasaba;Akihiro Egami;Tomoki Abe;Masatoshi Suzuki;Tomohiro Murata;Yoichi Nakagawa;Yudai Yamazaki;Sunghwan Park;Takaya Uchino;Chenxin Liu;Jun Sakamaki;Takashi Tomura;Hiroyuki Sakai;Hiroshi Taneda;Kei Murayama;Yoko Nakabayashi;Shinsuke Hara;Issei Watanabe;Akifumi Kasamatsu;Kenichi Okada;Koji Takinami","doi":"10.1109/LMWT.2025.3565729","DOIUrl":"https://doi.org/10.1109/LMWT.2025.3565729","url":null,"abstract":"To realize the practical application of sub-THz band wireless communication toward 6G, it is necessary to develop AiP modules with compact size and low cost. This letter discusses the design of a miniaturized AiP module for high-speed wireless communication targeting extended reality (XR) applications in medical operating rooms as an example of 6G use cases. By integrating waveguide antenna array along with a compact divider/combiner within the multilayer substrates, the module achieves a small form factor of <inline-formula> <tex-math>$8.42times 20.0times 1.37$ </tex-math></inline-formula> mm while integrating radio frequency integrated circuit (RFIC) and peripheral surface mount components. The measurement shows a data rate of 40 Gb/s at a 3 m distance in the 150 GHz band with an excellent transmission energy efficiency of 35.7 pJ/bit.","PeriodicalId":73297,"journal":{"name":"IEEE microwave and wireless technology letters","volume":"35 6","pages":"920-923"},"PeriodicalIF":0.0,"publicationDate":"2025-06-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11023526","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144299278","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A Wideband Continuously-Tunable Quasi-Reflectionless Filtering Attenuator 宽带连续可调谐准无反射滤波衰减器

IF 3.4

IEEE microwave and wireless technology letters Pub Date : 2025-06-04 DOI: 10.1109/LMWT.2025.3574206

Jianxing Li;Jitao Chen;Weiyu He;Yi Song;Zhongxian Zheng;Kai-Da Xu

引用次数: 0

High-Efficiency High-Power Wideband Power Amplifier Design With Hybrid Class AB 混合AB类高效大功率宽带功率放大器设计

IF 3.4

IEEE microwave and wireless technology letters Pub Date : 2025-06-02 DOI: 10.1109/LMWT.2025.3555003

Engin Cagdas;Oguzhan Kizilbey;Metin Yazgi

引用次数: 0

Novel Waveguide Matched Load Based on Spoof Surface Plasmon Polaritons 基于欺骗表面等离子激元的新型波导匹配负载

IF 3.4

IEEE microwave and wireless technology letters Pub Date : 2025-04-30 DOI: 10.1109/LMWT.2025.3563449

Huali Zhu;Yong Zhang;Zhang Dang;Bo Yan

引用次数: 0

Knowledge-Based Extrapolation of Neural Network Model for Transistor Modeling 晶体管建模中基于知识的神经网络模型外推

IEEE microwave and wireless technology letters Pub Date : 2025-04-30 DOI: 10.1109/LMWT.2025.3562538

Jinyuan Cui;Lei Zhang;Humayun Kabir;Zhihao Zhao;Rick Sweeney;Qi-Jun Zhang

引用次数: 0

Predistortion of GaN Power Amplifier Transient Responses in Time-Division Duplex Using Machine Learning 基于机器学习的GaN功率放大器时分双工瞬态响应预失真

IEEE microwave and wireless technology letters Pub Date : 2025-04-30 DOI: 10.1109/LMWT.2025.3561227

Arne Fischer-Bühner;Lauri Anttila;Alberto Brihuega;Manil Dev Gomony;Mikko Valkama

引用次数: 0

An Enhanced Space-Mapping Neural Network Incorporating a Dynamic Scaling Layer for Parametric Modeling of Microwave Components 基于动态缩放层的增强空间映射神经网络微波元件参数化建模

IF 3.4

IEEE microwave and wireless technology letters Pub Date : 2025-04-30 DOI: 10.1109/LMWT.2025.3562616

Shuxia Yan;Yuxing Li;Xiaotong Lu;Jia Nan Zhang

{"title":"An Enhanced Space-Mapping Neural Network Incorporating a Dynamic Scaling Layer for Parametric Modeling of Microwave Components","authors":"Shuxia Yan;Yuxing Li;Xiaotong Lu;Jia Nan Zhang","doi":"10.1109/LMWT.2025.3562616","DOIUrl":"https://doi.org/10.1109/LMWT.2025.3562616","url":null,"abstract":"Space-mapping neural network (SMNN) technology has been widely applied for parametric modeling of microwave components. However, existing SMNN technologies struggle to address the challenges posed by the unknown and unevenly distributed numerical outputs of the mapping neural network (MNN). This letter proposes an enhanced SMNN structure that incorporates a dynamic scaling layer to tackle with this challenge. In the proposed structure, the equivalent circuit model is used as a coarse model. The relationship between the geometrical parameters and circuit element values is learned by an MNN. The numerical distribution of the MNN’s outputs is adjusted by the dynamic scaling layer with additional scaling factors for the circuit element values. A two-stage modeling method is proposed to train the enhanced SMNN structure. Using the proposed enhanced SMNN structure allows us to integrate the regulation of the numerical distribution of the MNN’s outputs into an automated framework, avoiding the risk of gradient vanishing or explosion during the training process, consequently achieving a higher modeling accuracy. Two microwave modeling examples are used to demonstrate the advantages of the proposed method.","PeriodicalId":73297,"journal":{"name":"IEEE microwave and wireless technology letters","volume":"35 8","pages":"1102-1105"},"PeriodicalIF":3.4,"publicationDate":"2025-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144867627","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Real-Time Flexible Temporal Sequence RF Spectrum Sniffer With RF Processing Group Delay Network 基于射频处理群延迟网络的实时柔性时序射频频谱嗅探器

IF 3.4

IEEE microwave and wireless technology letters Pub Date : 2025-04-30 DOI: 10.1109/LMWT.2025.3560563

Hanxiang Zhang;Hao Yan;Powei Liu;Saeed Zolfaghary Pour;Bayaner Arigong

引用次数: 0

Compact Ku-Band Diplexer With Additive Manufactured Multimaterial Dielectric Resonator Insets 紧凑型ku波段双工器与添加剂制造的多材料介电谐振器嵌套

IEEE microwave and wireless technology letters Pub Date : 2025-04-30 DOI: 10.1109/LMWT.2025.3562691

Patrick Boe;Dominik Brouczek;Lisa Mikiss;Marc Hofbauer;Daniel Miek;Michael Höft

引用次数: 0

A 38-GHz Differential Transimpedance Amplifier With Unbalanced Neutralizing Technique 采用不平衡中和技术的38ghz差分跨阻放大器

IF 3.4

IEEE microwave and wireless technology letters Pub Date : 2025-04-30 DOI: 10.1109/LMWT.2025.3561787

Zexin Su;Chang Liu;Xuan Zhang;Qian Luo;Liu Wang;Sheng Hu;Xiao Ma;Bo Li

{"title":"A 38-GHz Differential Transimpedance Amplifier With Unbalanced Neutralizing Technique","authors":"Zexin Su;Chang Liu;Xuan Zhang;Qian Luo;Liu Wang;Sheng Hu;Xiao Ma;Bo Li","doi":"10.1109/LMWT.2025.3561787","DOIUrl":"https://doi.org/10.1109/LMWT.2025.3561787","url":null,"abstract":"In this letter, a broadband, low-noise and low-mismatch differential transimpedance amplifier (TIA) is proposed. In the classical single-ended-to-differential (S2D) strategy of TIA for mismatch reduction, the strong path and the weak path compensate each other, which results in low mismatch output differential signals. However, due to the different input strength of the strong and weak signals but the same gains of amplifier’s differential branches, mismatches could not eliminate well. To address this problem, an unbalanced neutralizing technique (UNT) is proposed. A single-sided negative capacitance feedback capacitor is introduced to strengthen the weak-side signal. Additionally, the design employs a combination of the high-gain input-stage and gain peaking in the subsequent stage to achieve improved bandwidth and noise performance simultaneously. Fabricated by 28-nm CMOS process, the chip achieves a transimpedance (TI) gain of 66.4 dB<inline-formula> <tex-math>$Omega $ </tex-math></inline-formula> across a 3-dB bandwidth of 38.8 GHz. The power consumption is 49 mW (including buffer). The averaged input-referred current noise density is 16.3 pA/<inline-formula> <tex-math>$sqrt {mathrm {Hz}}$ </tex-math></inline-formula>. The total active area of the chip is 0.08 mm<sup>2</sup>.","PeriodicalId":73297,"journal":{"name":"IEEE microwave and wireless technology letters","volume":"35 8","pages":"1218-1221"},"PeriodicalIF":3.4,"publicationDate":"2025-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144867754","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0