Communications engineering最新文献_第10页

Harnessing the full potential of RRAMs through scalable and distributed in-memory computing with integrated error correction. 通过集成纠错的可扩展和分布式内存计算，充分利用rram的潜力。

IF 7

Communications engineering Pub Date : 2026-04-22 DOI: 10.1038/s44172-026-00654-z

Huynh Q N Vo, Md Tawsif Rahman Chowdhury, Paritosh Ramanan, Murat Yildirim, Gozde Tutuncuoglu

{"title":"Harnessing the full potential of RRAMs through scalable and distributed in-memory computing with integrated error correction.","authors":"Huynh Q N Vo, Md Tawsif Rahman Chowdhury, Paritosh Ramanan, Murat Yildirim, Gozde Tutuncuoglu","doi":"10.1038/s44172-026-00654-z","DOIUrl":"10.1038/s44172-026-00654-z","url":null,"abstract":"Exponential growth in global computing demand is further exacerbated by the high energy requirements of conventional architectures, which are dominated by costly data movement requirements. In-memory computing with Resistive Random Access Memory (RRAM) addresses this challenge by co-integrating memory and processing, but faces tremendous hurdles related to device-level non-idealities and offers poor scalability in large computing tasks. Here, we introduce MELISO+ (In-Memory Linear Solver), a full-stack, distributed framework for energy-efficient in-memory computing. MELISO+ proposes a novel two-tier error correction mechanism to mitigate device non-idealities, and develops a distributed RRAM computing framework to enable matrix computations exceeding dimensions of 65,000 × 65,000. This approach reduces first- and second-order arithmetic errors due to device non-idealities by over 90%, enhances energy efficiency by three to five orders of magnitude, and decreases latency 100-fold. Hence, MELISO+ allows lower-precision RRAM devices to outperform high-precision device alternatives in accuracy, energy and latency metrics. By unifying algorithm-hardware co-design with scalable architecture, MELISO+ considerably advances sustainable, high-dimensional computing suitable for applications like large language models and generative artificial intelligence.","PeriodicalId":72644,"journal":{"name":"Communications engineering","volume":" ","pages":""},"PeriodicalIF":7.0,"publicationDate":"2026-04-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC13316154/pdf/","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147790846","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Minimizing interface defects and enhancing optical brightness of µLEDs through polymeric encapsulants. 通过聚合物封装减少界面缺陷，提高µled的光学亮度。

IF 7

Communications engineering Pub Date : 2026-04-21 DOI: 10.1038/s44172-026-00661-0

Pranav P Gavirneni, William S Wong

{"title":"Minimizing interface defects and enhancing optical brightness of µLEDs through polymeric encapsulants.","authors":"Pranav P Gavirneni, William S Wong","doi":"10.1038/s44172-026-00661-0","DOIUrl":"10.1038/s44172-026-00661-0","url":null,"abstract":"The need for high resolution microLED arrays, for applications in chip-level optical interconnects and augmented/virtual reality displays, requires the continuing miniaturization of the LED to reduce the pixel size and enable high pixel density. Miniaturization typically degrades brightness because of surface-related non-radiative recombination. Here we demonstrate a combined dry/wet etching process with polymeric encapsulation to construct InGaN-based microLEDs that show negligible degradation due to sidewall effects for devices having diameters as small as 6 µm. The microLEDs exhibit low surface recombination velocities ( <10 cm s-1) and high wall plug efficiencies of 20.3% at a current density of <math><mn>2.5</mn> <mi>A c</mi> <msup><mrow><mi>m</mi></mrow> <mrow><mo>-</mo> <mn>2</mn></mrow> </msup> </math> . A simple numerical model is developed to explain the dependence of the microLED performance as a function of the microLED geometry. The model determines the critical microLED diameter at which surface recombination becomes comparable to bulk recombination, marking the onset of surface-limited behaviour.","PeriodicalId":72644,"journal":{"name":"Communications engineering","volume":" ","pages":""},"PeriodicalIF":7.0,"publicationDate":"2026-04-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC13287465/pdf/","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147790796","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

How bio-inspired is your design? A transparent reporting framework. 你的设计有多少生物灵感？透明的报告框架。

IF 7

Communications engineering Pub Date : 2026-04-13 DOI: 10.1038/s44172-026-00641-4

Christina Harvey

引用次数: 0

High-capacity optical communication relayed by multi-core amplifier on deployed submarine seven-core fiber cable. 在部署的海底七芯光缆上采用多芯放大器中继的大容量光通信。

IF 7

Communications engineering Pub Date : 2026-04-11 DOI: 10.1038/s44172-026-00664-x

Yingyu Chen, Jinkai Zhou, Yaolin Wu, Hanyu Gao, Yongguang Xiao, Bofan Guo, Jinpei Li, Wenhao Li, Ruqi Chen, Runzhou Qiu, Jiajing Tu, Cheng Du, Lei Shen, Xiaozhen Xie, Yuelin Yan, Guangquan Wang, Ying Yu, Zhengyong Liu, Shecheng Gao, Zhaohui Li, Chao Lu

{"title":"High-capacity optical communication relayed by multi-core amplifier on deployed submarine seven-core fiber cable.","authors":"Yingyu Chen, Jinkai Zhou, Yaolin Wu, Hanyu Gao, Yongguang Xiao, Bofan Guo, Jinpei Li, Wenhao Li, Ruqi Chen, Runzhou Qiu, Jiajing Tu, Cheng Du, Lei Shen, Xiaozhen Xie, Yuelin Yan, Guangquan Wang, Ying Yu, Zhengyong Liu, Shecheng Gao, Zhaohui Li, Chao Lu","doi":"10.1038/s44172-026-00664-x","DOIUrl":"10.1038/s44172-026-00664-x","url":null,"abstract":"Space division multiplexing (SDM), particularly multi-core fiber (MCF) technology, represents a promising solution for high-density cabling in duct-constrained scenarios such as submarine cable systems. Although recent laboratory experiments and prototype trials have demonstrated the feasibility of MCF-based submarine cables, a complete optical communication validation of a real-world MCF submarine cable link incorporating optical amplifiers has remained a critical necessity. Here, we demonstrate a field validation of the MCF submarine cable communication with an end-to-end system. Based on a field-deployed 7-core fiber submarine cable infrastructure, we achieved a record-breaking net transmission rate of 410.5 Tbit·s-1 over a 140 km 7-core fiber cable link by employing the matched C + L Band cladding-pumped 7-core MC-EDFA. The measurements indicate slight variation in attenuation and crosstalk compared to the pre-cabling conditions, confirming the MCF's robustness to deployment and submarine disturbances. Furthermore, the developed 7-core MC-EDFAs maintain gains above ~18 dB and ~21 dB over the full C and L Bands, respectively, at an input power of -5 dBm, effectively compensating for span losses of submarine fiber cable. This successful field demonstration marks a crucial step towards the commercial implementation of integrated MC-EDFA SDM submarine optical communication systems for practical high-capacity applications.","PeriodicalId":72644,"journal":{"name":"Communications engineering","volume":" ","pages":""},"PeriodicalIF":7.0,"publicationDate":"2026-04-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC13254359/pdf/","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147655541","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Predictive correlation of optimum phase change material for thermal energy storage. 最佳相变储热材料的预测相关性。

IF 7

Communications engineering Pub Date : 2026-04-09 DOI: 10.1038/s44172-026-00655-y

Ayushman Singh, Srikanth Rangarajan, Bahgat Sammakia

{"title":"Predictive correlation of optimum phase change material for thermal energy storage.","authors":"Ayushman Singh, Srikanth Rangarajan, Bahgat Sammakia","doi":"10.1038/s44172-026-00655-y","DOIUrl":"10.1038/s44172-026-00655-y","url":null,"abstract":"Organic phase change material and high thermal conductivity filler composites are effective in thermal energy storage, but their performance can be highly dependent on the volume fraction of the phase change material/filler. In these composites, energy density (energy storage capacity of the composite) can be enhanced by increasing the phase change material volume fraction; in contrast, power density (rate at which the energy is accessed) can be improved by increasing the filler volume fraction. However, both characteristics cannot be increased simultaneously; therefore, the optimum volume fraction is crucial for maximizing the composite's thermal performance. In this work, we leverage the analogy of the thermal energy storage in phase change material with electrochemical energy storage in batteries through the Ragone framework to determine the optimum design. Furthermore, this paper proposes relationships for the optimum volume fraction as a function of thermal load, geometry, and cutoff temperature during the melting process. The proposed correlations provide a practical tool for designing and optimizing organic phase change material-filler composites and reduce reliance on computationally intensive numerical or experimental trials.","PeriodicalId":72644,"journal":{"name":"Communications engineering","volume":" ","pages":""},"PeriodicalIF":7.0,"publicationDate":"2026-04-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC13427826/pdf/","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147647508","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Seamless integration of distributed acoustic sensing and passive optical networks for human intrusion monitoring. 分布式声传感与无源光网络的无缝集成，用于人类入侵监测。

IF 7

Communications engineering Pub Date : 2026-04-08 DOI: 10.1038/s44172-026-00662-z

Rong Tang, Yunjiang Rao, Huijuan Wu, Yong Geng, Qiang Jing, Lang Xie, Peng He, Zhaoyu Li, Shengtao Zou, Tianyu Hua, Sijin Zheng, Yu Wu

{"title":"Seamless integration of distributed acoustic sensing and passive optical networks for human intrusion monitoring.","authors":"Rong Tang, Yunjiang Rao, Huijuan Wu, Yong Geng, Qiang Jing, Lang Xie, Peng He, Zhaoyu Li, Shengtao Zou, Tianyu Hua, Sijin Zheng, Yu Wu","doi":"10.1038/s44172-026-00662-z","DOIUrl":"10.1038/s44172-026-00662-z","url":null,"abstract":"Passive optical networks (PONs) serve as the backbone of modern all-optical communication infrastructures, while fiber-optic distributed acoustic sensing (DAS) is being applied to various fields as a revolutionary technology. Here we present a study on seamless integration of PONs and DAS for human intrusion monitoring by designing an intensity time-varying frequency shift keying with subcarrier composite spectrum modulation (ITVFS-SCSM) scheme, allowing us to overcome the limitations imposed by the high transmission loss of optical splitters and the low extinction ratio of electro-optic modulators in PONs to the performances of DAS. The ITVFS-SCSM scheme designed can simultaneously realize communication and sensing functions with excellent component and modulation compatibilities within a single channel. Assisted by a time difference of arrival algorithm, the localization of human intrusion with sub-meter accuracy with a high DAS sensitivity of 36.5 pε Hz-1/2 over 25.45 km fiber are achieved. This work represents a breakthrough in transforming PONs into distributed sensing networks that can accurately localize human intrusions with wide coverage, offering great potential to redefine next-generation PONs with both communication and security functions.","PeriodicalId":72644,"journal":{"name":"Communications engineering","volume":" ","pages":""},"PeriodicalIF":7.0,"publicationDate":"2026-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC13237137/pdf/","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147640863","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Void-free Cu/dielectric hybrid bonding at low-temperature enabled by ultrathin metal passivation engineering for 3D-IC applications. 通过超薄金属钝化工程实现3D-IC应用的低温无空隙Cu/介电杂化键合。

IF 7

Communications engineering Pub Date : 2026-04-08 DOI: 10.1038/s44172-026-00649-w

Hemanth Kumar Cheemalamarri, Masahisa Fujino, Tanmay Ghosh, Ratan Bhimrao Umralkar, Chandra Rao B S S, Navab Singh, Srinivasa Rao Vempati

{"title":"Void-free Cu/dielectric hybrid bonding at low-temperature enabled by ultrathin metal passivation engineering for 3D-IC applications.","authors":"Hemanth Kumar Cheemalamarri, Masahisa Fujino, Tanmay Ghosh, Ratan Bhimrao Umralkar, Chandra Rao B S S, Navab Singh, Srinivasa Rao Vempati","doi":"10.1038/s44172-026-00649-w","DOIUrl":"10.1038/s44172-026-00649-w","url":null,"abstract":"Copper (Cu) surface topography, galvanic corrosion at the Cu-barrier interface and Cu-to-dielectric bonding primarily due to the misalignment are the present critical challenges in achieving void-free hybrid bonding. Additionally, Cu surface oxidation and dishing remain key bottlenecks in enabling reliable Cu interconnections at low temperatures in Cu/dielectric (SiO₂) hybrid bonding. To overcome these limitations, here we introduced a fabrication strategy that integrates an ultrathin metal (titanium (Ti)) passivation layer selectively engineered for Cu bond pads while maintaining compatibility with the damascene process. Despite the presence of the passivation layer, the observed Cu diffusion across the bonding interface and improved electrical contact resistance provides direct evidence of enhanced interfacial interdiffusion and oxidation resistance. This approach offers a scalable and effective solution for mitigating fundamental challenges in Cu/SiO₂ hybrid bonding and holds strong potential for integration into three-dimensional heterogeneous packaging technologies, enabling low thermal budget processing at ≤ 250 °C for ≤ 1-2 hour.","PeriodicalId":72644,"journal":{"name":"Communications engineering","volume":" ","pages":""},"PeriodicalIF":7.0,"publicationDate":"2026-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC13237021/pdf/","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147640893","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Mechanical energy storage of planar spiral structures based on two-dimensional nanomaterials. 基于二维纳米材料的平面螺旋结构的机械能存储。

IF 7

Communications engineering Pub Date : 2026-04-07 DOI: 10.1038/s44172-026-00658-9

Shangchun Jiang, Jiaming Yan, Yihan Nie, Haifei Zhan, Chaofeng Lü

{"title":"Mechanical energy storage of planar spiral structures based on two-dimensional nanomaterials.","authors":"Shangchun Jiang, Jiaming Yan, Yihan Nie, Haifei Zhan, Chaofeng Lü","doi":"10.1038/s44172-026-00658-9","DOIUrl":"10.1038/s44172-026-00658-9","url":null,"abstract":"Electrochemical batteries currently serve as the primary power source for a wide range of daily applications, yet they present substantial risks to human health and environmental sustainability. Drawing inspiration from clockwork springs and carbon nanoscrolls, this work proposes a planar spiral structure (PSS) using 2D materials (graphene, MoS₂, diamane) for mechanical energy storage, offering an eco-friendly alternative to conventional electrochemical systems. Molecular dynamics simulations reveal that elastic torsional deformation of the PSS occurs in two stages, including a delamination-wrapping process driven by bending strain and van der Waals interactions, followed by tensile deformation. Energy storage predominantly arises from the first stage, where strain energy increases almost linearly with rotation angle. A theoretical model is developed, correlating strain energy with torsional angle and quantifying contributions from bending and surface energy. Simulations show that materials with higher bending stiffness exhibit superior energy storage capacity due to dominant bending strain energy. The model validates that diamane PSS can achieve a high energy storage capacity, with bending energy governing its entire delamination-wrapping process. This work provides a low-carbon design for nanoscale energy storage, applicable to biomedical micro/nanodevices, and establishes a framework for optimizing 2D nanomaterial-based spiral architectures.","PeriodicalId":72644,"journal":{"name":"Communications engineering","volume":" ","pages":""},"PeriodicalIF":7.0,"publicationDate":"2026-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC13234358/pdf/","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147629383","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Optimized T-shaped resonator via local enhancement model integration within a cell for enhanced Rydberg-atom receiver sensing. 通过单元内局部增强模型集成优化的t形谐振器，用于增强里德堡-原子接收器传感。

IF 7

Communications engineering Pub Date : 2026-04-07 DOI: 10.1038/s44172-026-00631-6

Bo Wu, Zhanshan Sun, Di Sang, Yi Liu, Qiang An, Yi Lin, Yunqi Fu

{"title":"Optimized T-shaped resonator via local enhancement model integration within a cell for enhanced Rydberg-atom receiver sensing.","authors":"Bo Wu, Zhanshan Sun, Di Sang, Yi Liu, Qiang An, Yi Lin, Yunqi Fu","doi":"10.1038/s44172-026-00631-6","DOIUrl":"10.1038/s44172-026-00631-6","url":null,"abstract":"Rydberg atom with resonators is regarded as promising atomic receivers to surpass conventional receivers' sensitivity. However, previous research has presented diverse open resonator structures, focusing on design yet lacking in theoretical guidance. Here we bridge this gap by elucidating the fundamental principles of local enhancement in open resonators, which guides us to adopt positive countermeasures aimed at maximizing the electric-field local enhancement ability and avoid blindly modifications. To overcome limitations of injection-type cylindrical resonators, which require external antennas and lack mobility, we propose an enclosed T-shaped resonator (TSR) integrated within a vapor cell for direct C-band coupling. Simulations show that the enhancement factor rises from 27 times of the basic parallel-plate resonator (PPR) to 57 times of the TSR at the same resonant frequency. An experimental validation was performed with an TSR. The TSR has 32.5 dB at 7.83 GHz electric-field local enhancement ability and an electrical size of 0.18 λ.","PeriodicalId":72644,"journal":{"name":"Communications engineering","volume":"5 1","pages":""},"PeriodicalIF":7.0,"publicationDate":"2026-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC13057118/pdf/","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147635239","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thermal runaway-induced short-circuit arc in highly integrated lithium-ion battery systems: mechanisms, thresholds, and mitigation strategies. 高度集成锂离子电池系统中热失控引起的短路电弧：机制、阈值和缓解策略

IF 7

Communications engineering Pub Date : 2026-04-06 DOI: 10.1038/s44172-026-00657-w

Zhenxing Yu, Chuan Chen, Pengfei Zhao, Yantao Qiao, Yu Cao, Binwei He, Zhimin Liu

{"title":"Thermal runaway-induced short-circuit arc in highly integrated lithium-ion battery systems: mechanisms, thresholds, and mitigation strategies.","authors":"Zhenxing Yu, Chuan Chen, Pengfei Zhao, Yantao Qiao, Yu Cao, Binwei He, Zhimin Liu","doi":"10.1038/s44172-026-00657-w","DOIUrl":"10.1038/s44172-026-00657-w","url":null,"abstract":"Thermal runaway-induced short-circuit arc in battery cell blocks or modules pose severe risks to electric vehicle safety; Despite this risk, however, their failure mechanisms, path and safety thresholds remain insufficiently understood. This study addresses these gaps by investigating short-circuit arc in commercial battery systems. Three short-circuit arc modes (case-to-case, case-to-busbar, and busbar-to-busbar) and corresponding failure paths were identified, with the case-to-case mode confirmed as the most hazardous. Experimental characterization reveals three phenomena during the case-to-case mode: weak Joule heating, intrinsic breakdown, and thermal breakdown with temperatures exceeding 1400 °C under 117 V and 7.2 mm, capable of triggering adjacent cell thermal runaway. A quadratic correlation between the critical breakdown voltage and electrode spacing was established, and a risk map was proposed. This study clarifies the mechanisms of thermal runaway-induced short-circuit arc, providing a quantitative safety design tool for highly integrated/high-voltage battery systems.","PeriodicalId":72644,"journal":{"name":"Communications engineering","volume":" ","pages":""},"PeriodicalIF":7.0,"publicationDate":"2026-04-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC13234359/pdf/","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147629303","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0