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IC Phone Home! IC 电话主页！
IF 2 4区 工程技术
IEEE Design & Test Pub Date : 2024-06-20 DOI: 10.1109/mdat.2024.3393829
Scott Davidson
{"title":"IC Phone Home!","authors":"Scott Davidson","doi":"10.1109/mdat.2024.3393829","DOIUrl":"https://doi.org/10.1109/mdat.2024.3393829","url":null,"abstract":"Many who have worked for vertically integrated companies making both ICs and computer equipment have experience in tracking ICs in the field. This is the subject of this issue of <italic xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">IEEE Design&amp;Test</i> on Silicon Lifecycle Management. If your company dealt with high-end equipment, where every failure mattered, you could close the loop on IC quality and see the failure rate of parts in use.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":null,"pages":null},"PeriodicalIF":2.0,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141529430","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
TechRxiv: Share Your Preprint Research With the World! TechRxiv：与世界分享您的预印本研究成果！
IF 2 4区 工程技术
IEEE Design & Test Pub Date : 2024-06-20 DOI: 10.1109/mdat.2024.3405059
{"title":"TechRxiv: Share Your Preprint Research With the World!","authors":"","doi":"10.1109/mdat.2024.3405059","DOIUrl":"https://doi.org/10.1109/mdat.2024.3405059","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":null,"pages":null},"PeriodicalIF":2.0,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141507569","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Design & Test Publication Information IEEE 设计与测试出版物信息
IF 2 4区 工程技术
IEEE Design & Test Pub Date : 2024-06-20 DOI: 10.1109/mdat.2024.3405053
{"title":"IEEE Design & Test Publication Information","authors":"","doi":"10.1109/mdat.2024.3405053","DOIUrl":"https://doi.org/10.1109/mdat.2024.3405053","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":null,"pages":null},"PeriodicalIF":2.0,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141507570","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Foundation 电气和电子工程师学会基金会
IF 2 4区 工程技术
IEEE Design & Test Pub Date : 2024-06-20 DOI: 10.1109/mdat.2024.3405057
{"title":"IEEE Foundation","authors":"","doi":"10.1109/mdat.2024.3405057","DOIUrl":"https://doi.org/10.1109/mdat.2024.3405057","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":null,"pages":null},"PeriodicalIF":2.0,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141529429","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Special Issue on Silicon Lifecycle Management 硅生命周期管理特刊
IF 2 4区 工程技术
IEEE Design & Test Pub Date : 2024-06-20 DOI: 10.1109/mdat.2024.3392620
Mehdi Tahoori, Yervant Zorian
{"title":"Special Issue on Silicon Lifecycle Management","authors":"Mehdi Tahoori, Yervant Zorian","doi":"10.1109/mdat.2024.3392620","DOIUrl":"https://doi.org/10.1109/mdat.2024.3392620","url":null,"abstract":"The Semiconductor Industry faces mounting challenges with the rapid advancement of device and system complexity. While increased transistor densities and smaller feature sizes present opportunities for enhanced capabilities, they also bring about significant hurdles such as heightened manufacturing variability and sensitivity to runtime and workload effects. Moreover, higher design densities result in elevated current and power densities, necessitating solutions for maintaining voltage supply levels and managing heat dissipation. Complicated factors like chip placement, system arrangements, and hardware–software interactions further elevate the risk of physical failure, making it challenging to model, mitigate, or identify issues during the design, manufacturing, and testing phases.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":null,"pages":null},"PeriodicalIF":2.0,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141507572","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Membership IEEE 会员
IF 2 4区 工程技术
IEEE Design & Test Pub Date : 2024-06-20 DOI: 10.1109/mdat.2024.3405051
{"title":"IEEE Membership","authors":"","doi":"10.1109/mdat.2024.3405051","DOIUrl":"https://doi.org/10.1109/mdat.2024.3405051","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":null,"pages":null},"PeriodicalIF":2.0,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141529428","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Silicon Lifecycle Management 硅生命周期管理
IF 2 4区 工程技术
IEEE Design & Test Pub Date : 2024-06-20 DOI: 10.1109/mdat.2024.3393834
Partha Pratim Pande
{"title":"Silicon Lifecycle Management","authors":"Partha Pratim Pande","doi":"10.1109/mdat.2024.3393834","DOIUrl":"https://doi.org/10.1109/mdat.2024.3393834","url":null,"abstract":"<fig orientation=\"portrait\" position=\"float\" xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\"> <graphic orientation=\"portrait\" position=\"float\" xlink:href=\"pande-3393834.tif\"/> </fig>\u0000The focus of this issue is the special issue on the broad topic of silicon lifecycle management (SLM). Additionally, we have the interview with Janusz Rajski, who is the vice president of engineering at Siemens Tessent Wilsonville, Wilsonville, OR, USA.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":null,"pages":null},"PeriodicalIF":2.0,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141507571","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Interview With Janusz Rajski 专访雅努什-拉斯基
IF 2 4区 工程技术
IEEE Design & Test Pub Date : 2024-06-20 DOI: 10.1109/mdat.2024.3386106
Nicola Nicolici
{"title":"Interview With Janusz Rajski","authors":"Nicola Nicolici","doi":"10.1109/mdat.2024.3386106","DOIUrl":"https://doi.org/10.1109/mdat.2024.3386106","url":null,"abstract":"Nicola Nicolici: Good evening and I would like to welcome Janusz Rajski, a Life Fellow of IEEE, who received the Ph.D. degree in electrical engineering from Poznan textasciiacute University of Technology, Poland, in 1982. He is currently the vice president of engineering at Siemens Tessent Wilsonville, Wilsonville, OR, USA. During his tenure at Siemens, he has built a strong international research and development organization with a focus on innovative DFT technologies. His team has developed several revolutionary products widely adopted by the semiconductor industry: TestKompress, cell-aware test, and streaming scan networks. He has published 300 IEEE research papers and is a co-inventor of 130 U.S. and international patents. His papers won prestigious awards, including two best paper awards published in IEEE Transactions on CAD, one on logic synthesis and another on test compression. In 2009, Janusz received the Stephen Swerling Innovation Award from Mentor Graphics for his breakthrough innovation TestKompress and revitalizing Mentor’s DFT business to its current position as the number one test business in EDA. In 2018, he received the Siemens Inventor of the Year Lifetime Achievement Award for his extensive contributions to DFT. In 2023, he received the prestigious Bob Madge Innovation Award. Welcome, Janusz.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":null,"pages":null},"PeriodicalIF":2.0,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141507573","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
CaSA: End-to-end Quantitative Security Analysis of Randomly Mapped Caches CaSA：随机映射缓存的端到端定量安全分析
IF 2 4区 工程技术
IEEE Design & Test Pub Date : 2024-06-18 DOI: 10.1109/mdat.2024.3416250
Thomas Bourgeat, Jules Drean, Yuheng Yang, Lillian Tsai, Joel Emer, Mengjia Yan
{"title":"CaSA: End-to-end Quantitative Security Analysis of Randomly Mapped Caches","authors":"Thomas Bourgeat, Jules Drean, Yuheng Yang, Lillian Tsai, Joel Emer, Mengjia Yan","doi":"10.1109/mdat.2024.3416250","DOIUrl":"https://doi.org/10.1109/mdat.2024.3416250","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":null,"pages":null},"PeriodicalIF":2.0,"publicationDate":"2024-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141938731","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Quantum Safe Internet-of-Things (IoT) 量子安全物联网（IoT）
IF 2 4区 工程技术
IEEE Design & Test Pub Date : 2024-06-17 DOI: 10.1109/mdat.2024.3408748
Anupam Chattopadhyay, Shivam Bhasin, Tim Güneysu, Swarup Bhunia
{"title":"Quantum Safe Internet-of-Things (IoT)","authors":"Anupam Chattopadhyay, Shivam Bhasin, Tim Güneysu, Swarup Bhunia","doi":"10.1109/mdat.2024.3408748","DOIUrl":"https://doi.org/10.1109/mdat.2024.3408748","url":null,"abstract":"","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":null,"pages":null},"PeriodicalIF":2.0,"publicationDate":"2024-06-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141938733","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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