Special Issue on Silicon Lifecycle Management

IF 1.9 4区工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE

IEEE Design & Test Pub Date : 2024-06-20 DOI:10.1109/mdat.2024.3392620

Mehdi Tahoori, Yervant Zorian

引用次数: 0

Abstract

The Semiconductor Industry faces mounting challenges with the rapid advancement of device and system complexity. While increased transistor densities and smaller feature sizes present opportunities for enhanced capabilities, they also bring about significant hurdles such as heightened manufacturing variability and sensitivity to runtime and workload effects. Moreover, higher design densities result in elevated current and power densities, necessitating solutions for maintaining voltage supply levels and managing heat dissipation. Complicated factors like chip placement, system arrangements, and hardware–software interactions further elevate the risk of physical failure, making it challenging to model, mitigate, or identify issues during the design, manufacturing, and testing phases.

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硅生命周期管理特刊

随着设备和系统复杂性的快速发展，半导体行业面临着越来越多的挑战。晶体管密度的提高和更小的特征尺寸为增强功能带来了机遇，但同时也带来了巨大的障碍，例如制造变异性的增加以及对运行时间和工作负载影响的敏感性。此外，更高的设计密度会导致电流和功率密度升高，从而需要维持电压供应水平和管理散热的解决方案。芯片布局、系统安排和软硬件交互等复杂因素进一步提高了物理故障的风险，使得在设计、制造和测试阶段建模、缓解或识别问题变得十分困难。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Design & Test COMPUTER SCIENCE, HARDWARE & ARCHITECTURE-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

3.80

自引率

5.00%

发文量

期刊介绍： IEEE Design & Test offers original works describing the models, methods, and tools used to design and test microelectronic systems from devices and circuits to complete systems-on-chip and embedded software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. The magazine seeks to bring to its readers not only important technology advances but also technology leaders, their perspectives through its columns, interviews, and roundtable discussions. Topics include semiconductor IC design, semiconductor intellectual property blocks, design, verification and test technology, design for manufacturing and yield, embedded software and systems, low-power and energy-efficient design, electronic design automation tools, practical technology, and standards.