Special Issue on Silicon Lifecycle Management

IF 16.4 1区 化学 Q1 CHEMISTRY, MULTIDISCIPLINARY
Mehdi Tahoori, Yervant Zorian
{"title":"Special Issue on Silicon Lifecycle Management","authors":"Mehdi Tahoori, Yervant Zorian","doi":"10.1109/mdat.2024.3392620","DOIUrl":null,"url":null,"abstract":"The Semiconductor Industry faces mounting challenges with the rapid advancement of device and system complexity. While increased transistor densities and smaller feature sizes present opportunities for enhanced capabilities, they also bring about significant hurdles such as heightened manufacturing variability and sensitivity to runtime and workload effects. Moreover, higher design densities result in elevated current and power densities, necessitating solutions for maintaining voltage supply levels and managing heat dissipation. Complicated factors like chip placement, system arrangements, and hardware–software interactions further elevate the risk of physical failure, making it challenging to model, mitigate, or identify issues during the design, manufacturing, and testing phases.","PeriodicalId":1,"journal":{"name":"Accounts of Chemical Research","volume":null,"pages":null},"PeriodicalIF":16.4000,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Accounts of Chemical Research","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1109/mdat.2024.3392620","RegionNum":1,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"CHEMISTRY, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

Abstract

The Semiconductor Industry faces mounting challenges with the rapid advancement of device and system complexity. While increased transistor densities and smaller feature sizes present opportunities for enhanced capabilities, they also bring about significant hurdles such as heightened manufacturing variability and sensitivity to runtime and workload effects. Moreover, higher design densities result in elevated current and power densities, necessitating solutions for maintaining voltage supply levels and managing heat dissipation. Complicated factors like chip placement, system arrangements, and hardware–software interactions further elevate the risk of physical failure, making it challenging to model, mitigate, or identify issues during the design, manufacturing, and testing phases.
硅生命周期管理特刊
随着设备和系统复杂性的快速发展,半导体行业面临着越来越多的挑战。晶体管密度的提高和更小的特征尺寸为增强功能带来了机遇,但同时也带来了巨大的障碍,例如制造变异性的增加以及对运行时间和工作负载影响的敏感性。此外,更高的设计密度会导致电流和功率密度升高,从而需要维持电压供应水平和管理散热的解决方案。芯片布局、系统安排和软硬件交互等复杂因素进一步提高了物理故障的风险,使得在设计、制造和测试阶段建模、缓解或识别问题变得十分困难。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
Accounts of Chemical Research
Accounts of Chemical Research 化学-化学综合
CiteScore
31.40
自引率
1.10%
发文量
312
审稿时长
2 months
期刊介绍: Accounts of Chemical Research presents short, concise and critical articles offering easy-to-read overviews of basic research and applications in all areas of chemistry and biochemistry. These short reviews focus on research from the author’s own laboratory and are designed to teach the reader about a research project. In addition, Accounts of Chemical Research publishes commentaries that give an informed opinion on a current research problem. Special Issues online are devoted to a single topic of unusual activity and significance. Accounts of Chemical Research replaces the traditional article abstract with an article "Conspectus." These entries synopsize the research affording the reader a closer look at the content and significance of an article. Through this provision of a more detailed description of the article contents, the Conspectus enhances the article's discoverability by search engines and the exposure for the research.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信