Special Issue on Silicon Lifecycle Management

The Semiconductor Industry faces mounting challenges with the rapid advancement of device and system complexity. While increased transistor densities and smaller feature sizes present opportunities for enhanced capabilities, they also bring about significant hurdles such as heightened manufacturing variability and sensitivity to runtime and workload effects. Moreover, higher design densities result in elevated current and power densities, necessitating solutions for maintaining voltage supply levels and managing heat dissipation. Complicated factors like chip placement, system arrangements, and hardware–software interactions further elevate the risk of physical failure, making it challenging to model, mitigate, or identify issues during the design, manufacturing, and testing phases.