{"title":"Interview With Janusz Rajski","authors":"Nicola Nicolici","doi":"10.1109/mdat.2024.3386106","DOIUrl":null,"url":null,"abstract":"Nicola Nicolici: Good evening and I would like to welcome Janusz Rajski, a Life Fellow of IEEE, who received the Ph.D. degree in electrical engineering from Poznan textasciiacute University of Technology, Poland, in 1982. He is currently the vice president of engineering at Siemens Tessent Wilsonville, Wilsonville, OR, USA. During his tenure at Siemens, he has built a strong international research and development organization with a focus on innovative DFT technologies. His team has developed several revolutionary products widely adopted by the semiconductor industry: TestKompress, cell-aware test, and streaming scan networks. He has published 300 IEEE research papers and is a co-inventor of 130 U.S. and international patents. His papers won prestigious awards, including two best paper awards published in IEEE Transactions on CAD, one on logic synthesis and another on test compression. In 2009, Janusz received the Stephen Swerling Innovation Award from Mentor Graphics for his breakthrough innovation TestKompress and revitalizing Mentor’s DFT business to its current position as the number one test business in EDA. In 2018, he received the Siemens Inventor of the Year Lifetime Achievement Award for his extensive contributions to DFT. In 2023, he received the prestigious Bob Madge Innovation Award. Welcome, Janusz.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"162 1","pages":""},"PeriodicalIF":1.9000,"publicationDate":"2024-06-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Design & Test","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1109/mdat.2024.3386106","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
Nicola Nicolici: Good evening and I would like to welcome Janusz Rajski, a Life Fellow of IEEE, who received the Ph.D. degree in electrical engineering from Poznan textasciiacute University of Technology, Poland, in 1982. He is currently the vice president of engineering at Siemens Tessent Wilsonville, Wilsonville, OR, USA. During his tenure at Siemens, he has built a strong international research and development organization with a focus on innovative DFT technologies. His team has developed several revolutionary products widely adopted by the semiconductor industry: TestKompress, cell-aware test, and streaming scan networks. He has published 300 IEEE research papers and is a co-inventor of 130 U.S. and international patents. His papers won prestigious awards, including two best paper awards published in IEEE Transactions on CAD, one on logic synthesis and another on test compression. In 2009, Janusz received the Stephen Swerling Innovation Award from Mentor Graphics for his breakthrough innovation TestKompress and revitalizing Mentor’s DFT business to its current position as the number one test business in EDA. In 2018, he received the Siemens Inventor of the Year Lifetime Achievement Award for his extensive contributions to DFT. In 2023, he received the prestigious Bob Madge Innovation Award. Welcome, Janusz.
期刊介绍:
IEEE Design & Test offers original works describing the models, methods, and tools used to design and test microelectronic systems from devices and circuits to complete systems-on-chip and embedded software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. The magazine seeks to bring to its readers not only important technology advances but also technology leaders, their perspectives through its columns, interviews, and roundtable discussions. Topics include semiconductor IC design, semiconductor intellectual property blocks, design, verification and test technology, design for manufacturing and yield, embedded software and systems, low-power and energy-efficient design, electronic design automation tools, practical technology, and standards.