硅生命周期管理

IF 1.9 4区工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE

IEEE Design & Test Pub Date : 2024-06-20 DOI:10.1109/mdat.2024.3393834

Partha Pratim Pande

引用次数: 0

摘要

本期的重点是关于硅生命周期管理 (SLM) 这一广泛主题的特刊。此外，我们还采访了 Janusz Rajski，他是美国俄勒冈州威尔逊维尔市西门子泰森特威尔逊维尔公司的工程副总裁。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Silicon Lifecycle Management

The focus of this issue is the special issue on the broad topic of silicon lifecycle management (SLM). Additionally, we have the interview with Janusz Rajski, who is the vice president of engineering at Siemens Tessent Wilsonville, Wilsonville, OR, USA.

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来源期刊

IEEE Design & Test COMPUTER SCIENCE, HARDWARE & ARCHITECTURE-ENGINEERING, ELECTRICAL & ELECTRONIC

CiteScore

3.80

自引率

5.00%

发文量

期刊介绍： IEEE Design & Test offers original works describing the models, methods, and tools used to design and test microelectronic systems from devices and circuits to complete systems-on-chip and embedded software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. The magazine seeks to bring to its readers not only important technology advances but also technology leaders, their perspectives through its columns, interviews, and roundtable discussions. Topics include semiconductor IC design, semiconductor intellectual property blocks, design, verification and test technology, design for manufacturing and yield, embedded software and systems, low-power and energy-efficient design, electronic design automation tools, practical technology, and standards.