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Optimal Sampling and Reconstruction Strategies for Scanning Microscopes 扫描显微镜的最佳采样和重建策略
EDFA Technical Articles Pub Date : 2022-02-01 DOI: 10.31399/asm.edfa.2022-1.p011
N. Browning, D. Nicholls, J. Wells, Alex W Robinson
{"title":"Optimal Sampling and Reconstruction Strategies for Scanning Microscopes","authors":"N. Browning, D. Nicholls, J. Wells, Alex W Robinson","doi":"10.31399/asm.edfa.2022-1.p011","DOIUrl":"https://doi.org/10.31399/asm.edfa.2022-1.p011","url":null,"abstract":"\u0000 This article discusses the tradeoffs associated with minimizing beam dose in a scanning transmission electron microscope (STEM) and explains how to reduce beam exposure through subsampling and inpainting, a signal reconstruction technique that optimizes image quality and resolution. Although the method is described in the context of STEM imaging, it applies to any scanned imaging system.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128068838","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Scanning Nitrogen Vacancy Magnetometry: A Quantum Technology for Device Failure Analysis 扫描氮空位磁强计:一种用于器件失效分析的量子技术
EDFA Technical Articles Pub Date : 2022-02-01 DOI: 10.31399/asm.edfa.2022-1.p029
P. Rickhaus, P. Maletinsky
{"title":"Scanning Nitrogen Vacancy Magnetometry: A Quantum Technology for Device Failure Analysis","authors":"P. Rickhaus, P. Maletinsky","doi":"10.31399/asm.edfa.2022-1.p029","DOIUrl":"https://doi.org/10.31399/asm.edfa.2022-1.p029","url":null,"abstract":"\u0000 This article describes the basic measurement physics of scanning nitrogen vacancy (NV) microscopy and the various ways it can be used in semiconductor device failure analysis. Scanning NV microscopy can measure topography as well as magnetic fields, local current density, ac noise, and local temperature variations.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114788015","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Determination of Indenter Crack Probability on Multilayer Stacks using an Acoustic Emission Test Method 用声发射试验方法测定多层堆叠压头裂纹概率
EDFA Technical Articles Pub Date : 2022-02-01 DOI: 10.31399/asm.edfa.2022-1.p003
M. Unterreitmeier, O. Nagler
{"title":"Determination of Indenter Crack Probability on Multilayer Stacks using an Acoustic Emission Test Method","authors":"M. Unterreitmeier, O. Nagler","doi":"10.31399/asm.edfa.2022-1.p003","DOIUrl":"https://doi.org/10.31399/asm.edfa.2022-1.p003","url":null,"abstract":"\u0000 Engineers at Infineon Technologies have developed a way to detect probing-induced fracture in semiconductor wafers in real-time using acoustic emission sensing and burst-signal energy filtering techniques. In this article, they describe the measurement procedure and demonstrate its use on complex semiconductor pad stacks. They also present experimental results that shed new light on the relationship between probe tip contact force and crack probability in thin, brittle layers typical of BEOL layer stacks in CMOS ICs.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117199082","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Chiplets: A New Era in Advanced Packaging Emerges 小晶片:先进封装的新时代来临
EDFA Technical Articles Pub Date : 2021-11-01 DOI: 10.31399/asm.edfa.2021-4.p002
Jan Vardaman
{"title":"Chiplets: A New Era in Advanced Packaging Emerges","authors":"Jan Vardaman","doi":"10.31399/asm.edfa.2021-4.p002","DOIUrl":"https://doi.org/10.31399/asm.edfa.2021-4.p002","url":null,"abstract":"\u0000 This editorial discusses the emergence of chiplets and its potential impact on IC design, fabrication, and failure analysis.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131202108","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Reliability Implications of Energy-Efficient Analog Processing 节能模拟处理的可靠性影响
EDFA Technical Articles Pub Date : 2021-11-01 DOI: 10.31399/asm.edfa.2021-4.p057
M. Marinella
{"title":"Reliability Implications of Energy-Efficient Analog Processing","authors":"M. Marinella","doi":"10.31399/asm.edfa.2021-4.p057","DOIUrl":"https://doi.org/10.31399/asm.edfa.2021-4.p057","url":null,"abstract":"\u0000 Analog computing is an important step in taking neural net processing to the next level. However, as this column explains, reliability is intimately linked to performance and efficiency in analog systems, more so than in any modern digital system, and further work is required to understand the relationship.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122905159","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Sample Preparation Workflow for Delayering a 45 nm Node Serial Peripheral Interface Module 45nm节点串行外设接口模块脱层样例制备流程
EDFA Technical Articles Pub Date : 2021-11-01 DOI: 10.31399/asm.edfa.2021-4.p004
Y. Patel, Joshua Baur, Jonathan Scholl, Adam R. Waite, Adam G. Kimura, J. Kelley, Richard Ott, G. Via
{"title":"A Sample Preparation Workflow for Delayering a 45 nm Node Serial Peripheral Interface Module","authors":"Y. Patel, Joshua Baur, Jonathan Scholl, Adam R. Waite, Adam G. Kimura, J. Kelley, Richard Ott, G. Via","doi":"10.31399/asm.edfa.2021-4.p004","DOIUrl":"https://doi.org/10.31399/asm.edfa.2021-4.p004","url":null,"abstract":"\u0000 Further development of SEM-based feature extraction tools for design validation and failure analysis is contingent on reliable sample preparation methods. This article describes how a delayering framework for 130 nm technology was adapted and used on a 45 nm SPI module consisting of 11 metal layers, 10 via layers, two layers of polysilicon, and an active silicon layer. It explains how different polishing and etching methods are used to expose each layer with sufficient contrast for SEM imaging and subsequent feature extraction. By combining polygon sets representing each layer, the full design of the device was reconstructed as shown in one of the images.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122791470","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Failure Modes in Microfabricated Ion Trap Devices for Quantum Information Science 量子信息科学微制造离子阱器件的失效模式
EDFA Technical Articles Pub Date : 2021-11-01 DOI: 10.31399/asm.edfa.2021-4.p028
M. Blain, R. Haltli, M. Revelle
{"title":"Failure Modes in Microfabricated Ion Trap Devices for Quantum Information Science","authors":"M. Blain, R. Haltli, M. Revelle","doi":"10.31399/asm.edfa.2021-4.p028","DOIUrl":"https://doi.org/10.31399/asm.edfa.2021-4.p028","url":null,"abstract":"\u0000 Trapped ion systems are one of the leading technology platforms for quantum computing. This article describes the construction and operation of ion trap devices and the various modes of failure that have been observed. Examples of failure in either the rendering or use of packaged trap chips are presented, including electrode shorts and opens, detached bond wires, and RF breakdown damage.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127795280","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Methods to Enable Fault Isolation on 2.5D Molded Interposer Packages 2.5D模制中间层封装的故障隔离方法
EDFA Technical Articles Pub Date : 2021-11-01 DOI: 10.31399/asm.edfa.2021-4.p014
D. Hunt, Dan Bader, P. Limbecker, Heiko Barth
{"title":"Methods to Enable Fault Isolation on 2.5D Molded Interposer Packages","authors":"D. Hunt, Dan Bader, P. Limbecker, Heiko Barth","doi":"10.31399/asm.edfa.2021-4.p014","DOIUrl":"https://doi.org/10.31399/asm.edfa.2021-4.p014","url":null,"abstract":"\u0000 This article discusses the failure analysis challenges associated with large overmolded 2.5D packages and explains how laser decapsulation followed by microwave-induced plasma (MIP) spot etching removes overmold while keeping everything else intact. It also describes a defect isolation procedure in which the sample is analyzed in a large chamber environmental SEM with its ball grid array directly wired to an EBAC amplifier.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133926862","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Brief Overview of Scanning Transmission Electron Microscopy in a Scanning Electron Microscope 扫描电子显微镜中扫描透射电子显微镜的概述
EDFA Technical Articles Pub Date : 2021-11-01 DOI: 10.31399/asm.edfa.2021-4.p018
Jason Holm
{"title":"A Brief Overview of Scanning Transmission Electron Microscopy in a Scanning Electron Microscope","authors":"Jason Holm","doi":"10.31399/asm.edfa.2021-4.p018","DOIUrl":"https://doi.org/10.31399/asm.edfa.2021-4.p018","url":null,"abstract":"\u0000 This article provides a brief overview of STEM-in-SEM, discussing the pros and cons, recent advancements in detector technology, and the emergence of 4D STEM-in-SEM, a relatively new method that uses diffraction patterns recorded at different raster positions to enhance images offline in selected regions of interest.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121598541","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Evaluation of a Co-Simulation Approach for Functional Verification of Analog and Mixed Signal Devices 模拟和混合信号器件功能验证的联合仿真方法评估
EDFA Technical Articles Pub Date : 2021-08-01 DOI: 10.31399/asm.edfa.2021-3.p008
Mathias Heitauer, M. Versen
{"title":"Evaluation of a Co-Simulation Approach for Functional Verification of Analog and Mixed Signal Devices","authors":"Mathias Heitauer, M. Versen","doi":"10.31399/asm.edfa.2021-3.p008","DOIUrl":"https://doi.org/10.31399/asm.edfa.2021-3.p008","url":null,"abstract":"\u0000 This article presents an automation workflow for the development of analog and mixed-signal devices similar to the two-stage process used for the design and verification of logic ICs. The use of a co-simulation interface makes it possible to build and verify failure models.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122530024","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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