发布求助
文献互助 智能选刊 最新文献

EDFA Technical Articles最新文献

筛选
英文 中文
Triboelectric Charging Damage in Silicon-on-Insulator Devices 绝缘体上硅器件的摩擦充电损伤
EDFA Technical Articles Pub Date : 2021-08-01 DOI: 10.31399/asm.edfa.2021-3.p004
P. Tangyunyong
{"title":"Triboelectric Charging Damage in Silicon-on-Insulator Devices","authors":"P. Tangyunyong","doi":"10.31399/asm.edfa.2021-3.p004","DOIUrl":"https://doi.org/10.31399/asm.edfa.2021-3.p004","url":null,"abstract":"\u0000 Integrated circuits are subjected to various forms of friction during fabrication and packaging, creating potential problems due to the buildup of charge. This article looks at the distinct characteristics of triboelectric charging damage on silicon-on-insulator devices at the wafer and package level. Telltale signs of this type of damage include spatial dependency, distinct TIVA-signal patterns, and bimodal static current distributions with significant changes after burn-in.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134633729","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The EDFAS FA Technology Roadmap: A Path to the Future EDFAS FA技术路线图:通往未来的道路
EDFA Technical Articles Pub Date : 2021-08-01 DOI: 10.31399/asm.edfa.2021-3.p051
K. Serrels
{"title":"The EDFAS FA Technology Roadmap: A Path to the Future","authors":"K. Serrels","doi":"10.31399/asm.edfa.2021-3.p051","DOIUrl":"https://doi.org/10.31399/asm.edfa.2021-3.p051","url":null,"abstract":"\u0000 This column discusses past, present, and future activities associated with the development of the EDFAS FA Technology Roadmap.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123777484","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Threat of Malicious Circuit-Board Alteration: Attack Taxonomy and Examples 恶意篡改电路板的威胁:攻击分类与实例
EDFA Technical Articles Pub Date : 2021-08-01 DOI: 10.31399/asm.edfa.2021-3.p013
S. Russ
{"title":"The Threat of Malicious Circuit-Board Alteration: Attack Taxonomy and Examples","authors":"S. Russ","doi":"10.31399/asm.edfa.2021-3.p013","DOIUrl":"https://doi.org/10.31399/asm.edfa.2021-3.p013","url":null,"abstract":"\u0000 Circuit boards are vulnerable to a wide range of ill-intentioned modifications done to gain access to information or malevolently influence control. This article describes the various ways attacks on circuit board can occur and presents examples showing how such attacks might look. It also provides general guidelines for protecting circuit-board design integrity.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115862857","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Machine Learning for Time-Resolved Emission: Image Resolution Enhancement 时间分辨发射的机器学习:图像分辨率增强
EDFA Technical Articles Pub Date : 2021-08-01 DOI: 10.31399/asm.edfa.2021-3.p024
S. Chef, C. T. Chua, Chee Lip Gan
{"title":"Machine Learning for Time-Resolved Emission: Image Resolution Enhancement","authors":"S. Chef, C. T. Chua, Chee Lip Gan","doi":"10.31399/asm.edfa.2021-3.p024","DOIUrl":"https://doi.org/10.31399/asm.edfa.2021-3.p024","url":null,"abstract":"\u0000 This article describes a novel method for improving image resolution achieved using time-resolved photon emission techniques. Instead of directly generating images from photon counting, all detected photons are displayed as a point cloud in 3D space and a new higher-resolution image is generated based on probability density functions associated with photon distributions. Unsupervised learning algorithms identify photon distribution patterns as well as fainter emission sources.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122512649","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
TEM Study of Oxygen Partial Pressure Effect on Early LSM-YSZ Surface Interactions in Solid Oxide Fuel Cells 固体氧化物燃料电池中氧分压对LSM-YSZ早期表面相互作用影响的透射电镜研究
EDFA Technical Articles Pub Date : 2021-05-01 DOI: 10.31399/asm.edfa.2021-2.p022
H. Wang, M. Chen, Y.L. Liu, L. Theil Kuhn, J. Bowen
{"title":"TEM Study of Oxygen Partial Pressure Effect on Early LSM-YSZ Surface Interactions in Solid Oxide Fuel Cells","authors":"H. Wang, M. Chen, Y.L. Liu, L. Theil Kuhn, J. Bowen","doi":"10.31399/asm.edfa.2021-2.p022","DOIUrl":"https://doi.org/10.31399/asm.edfa.2021-2.p022","url":null,"abstract":"\u0000 Long-term stability studies indicate that cathode degradation is one of the main failure mechanisms in anode-supported SOFCs. In order to better understand the microstructural degradation mechanisms of the cathode and the influence of oxygen partial pressure at relevant operating temperatures, the authors of this article acquired TEM samples from technological cells to study cation interdiffusion mechanisms and LSM-YSZ interactions, particularly in areas where LSM grains are in contact with YSZ electrolyte. Here they present and interpret the results.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130825501","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Security Assessment of IC Packaging Against Optical Attacks 针对光攻击的IC封装安全评估
EDFA Technical Articles Pub Date : 2021-05-01 DOI: 10.31399/asm.edfa.2021-2.p004
Chengjie Xi, Aslam A. Khan, M. Tanjidur Rahman, N. Asadizanjani
{"title":"Security Assessment of IC Packaging Against Optical Attacks","authors":"Chengjie Xi, Aslam A. Khan, M. Tanjidur Rahman, N. Asadizanjani","doi":"10.31399/asm.edfa.2021-2.p004","DOIUrl":"https://doi.org/10.31399/asm.edfa.2021-2.p004","url":null,"abstract":"\u0000 The inverted orientation of a flip-chip packaged die makes it vulnerable to optical attacks from the backside. This article discusses the nature of that vulnerability, assesses the threats posed by optical inspection tools and techniques, and provides insights on effective countermeasures.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131767974","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Failure Analysis from a Customer Point of View 从顾客的角度分析故障
EDFA Technical Articles Pub Date : 2021-05-01 DOI: 10.31399/asm.edfa.2021-2.p051
Ted Kolasa
{"title":"Failure Analysis from a Customer Point of View","authors":"Ted Kolasa","doi":"10.31399/asm.edfa.2021-2.p051","DOIUrl":"https://doi.org/10.31399/asm.edfa.2021-2.p051","url":null,"abstract":"\u0000 This column addresses the different perspectives of providers and customers of semiconductor failure analysis laboratories. The columnist, after having seen both sides of the electronics industry, as a supplier and customer, sheds light on how the two sides interact when entangled with reliability issues and failures.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122449974","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Master FA Technique: Artifact-Free Cross Sectioning of High Aspect Ratio Etch Cavities Using Ink 掌握FA技术:使用墨水进行高纵横比蚀刻空腔的无伪影横截面
EDFA Technical Articles Pub Date : 2021-05-01 DOI: 10.31399/asm.edfa.2021-2.p038
Travis Mitchell, Brian Popielarski, Frieder Baumann
{"title":"Master FA Technique: Artifact-Free Cross Sectioning of High Aspect Ratio Etch Cavities Using Ink","authors":"Travis Mitchell, Brian Popielarski, Frieder Baumann","doi":"10.31399/asm.edfa.2021-2.p038","DOIUrl":"https://doi.org/10.31399/asm.edfa.2021-2.p038","url":null,"abstract":"\u0000 This Master FA Technique column describes an easy and inexpensive solution to the problem of preparing TEM cross-sectional samples from etched wafers with large aspect ratio vias.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128611251","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
State-of-the-Art High-Resolution 3D X-ray Microscopy for Imaging of Integrated Circuits 用于集成电路成像的最先进的高分辨率3D x射线显微镜
EDFA Technical Articles Pub Date : 2021-05-01 DOI: 10.31399/asm.edfa.2021-2.p013
M. Holler, M. Guizar‐Sicairos, J. Raabe
{"title":"State-of-the-Art High-Resolution 3D X-ray Microscopy for Imaging of Integrated Circuits","authors":"M. Holler, M. Guizar‐Sicairos, J. Raabe","doi":"10.31399/asm.edfa.2021-2.p013","DOIUrl":"https://doi.org/10.31399/asm.edfa.2021-2.p013","url":null,"abstract":"\u0000 X-ray ptychography, as recent studies show, has the potential to bridge the gap that currently exists between conventional X-ray imaging and electron microscopy. This article covers the evolution of the technology from basic 2D imaging to computed tomography to 3D ptychographic X-ray laminography (PyXL) with zoom. To demonstrate the capabilities of PyXL, a 16-nm FinFET logic IC was mechanically polished to a thickness of 20 µm and several regions were imaged at various levels of resolution.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115206551","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
EDFAS User Groups Series 2021 Highlights EDFAS用户组系列2021亮点
EDFA Technical Articles Pub Date : 2021-05-01 DOI: 10.31399/asm.edfa.2021-2.p033
Tejinder Gandhi, Anita Madan, Ted Kolasa
{"title":"EDFAS User Groups Series 2021 Highlights","authors":"Tejinder Gandhi, Anita Madan, Ted Kolasa","doi":"10.31399/asm.edfa.2021-2.p033","DOIUrl":"https://doi.org/10.31399/asm.edfa.2021-2.p033","url":null,"abstract":"\u0000 This article provides a recap and summaries of the EDFAS Virtual User Group Workshop held in January 2021. The summaries cover key participants, presentation topics, and discussion highlights from the Focused Ion Beam, Sample Preparation, Contactless Probing and Nanoprobing, and System on Package virtual group meetings.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2021-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130950142","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
首页 上一页 下一页 尾页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信