{"title":"量子信息科学微制造离子阱器件的失效模式","authors":"M. Blain, R. Haltli, M. Revelle","doi":"10.31399/asm.edfa.2021-4.p028","DOIUrl":null,"url":null,"abstract":"\n Trapped ion systems are one of the leading technology platforms for quantum computing. This article describes the construction and operation of ion trap devices and the various modes of failure that have been observed. Examples of failure in either the rendering or use of packaged trap chips are presented, including electrode shorts and opens, detached bond wires, and RF breakdown damage.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":"59 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Failure Modes in Microfabricated Ion Trap Devices for Quantum Information Science\",\"authors\":\"M. Blain, R. Haltli, M. Revelle\",\"doi\":\"10.31399/asm.edfa.2021-4.p028\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n Trapped ion systems are one of the leading technology platforms for quantum computing. This article describes the construction and operation of ion trap devices and the various modes of failure that have been observed. Examples of failure in either the rendering or use of packaged trap chips are presented, including electrode shorts and opens, detached bond wires, and RF breakdown damage.\",\"PeriodicalId\":431761,\"journal\":{\"name\":\"EDFA Technical Articles\",\"volume\":\"59 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"EDFA Technical Articles\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.31399/asm.edfa.2021-4.p028\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"EDFA Technical Articles","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31399/asm.edfa.2021-4.p028","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Failure Modes in Microfabricated Ion Trap Devices for Quantum Information Science
Trapped ion systems are one of the leading technology platforms for quantum computing. This article describes the construction and operation of ion trap devices and the various modes of failure that have been observed. Examples of failure in either the rendering or use of packaged trap chips are presented, including electrode shorts and opens, detached bond wires, and RF breakdown damage.
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