2007 IEEE International Workshop on Memory Technology, Design and Testing最新文献

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The polarity dependence of ONO thickness for wrapped-select-gate (WSG) SONOS memory 包裹选择门(WSG) SONOS存储器ONO厚度的极性依赖性
2007 IEEE International Workshop on Memory Technology, Design and Testing Pub Date : 2007-12-03 DOI: 10.1109/MTDT.2007.4547617
Kuan-Ti Wang, T. Chao, Woei-Cherng Wu, Chao‐Sung Lai
{"title":"The polarity dependence of ONO thickness for wrapped-select-gate (WSG) SONOS memory","authors":"Kuan-Ti Wang, T. Chao, Woei-Cherng Wu, Chao‐Sung Lai","doi":"10.1109/MTDT.2007.4547617","DOIUrl":"https://doi.org/10.1109/MTDT.2007.4547617","url":null,"abstract":"2-bits/cell operation characteristics of WSG-SONOS memory has been fully studied in different ONO thickness. The 2-bits/cell characteristics of WSG-SONOS memory will be determined by tunneling oxide and total ONO thicknesses. Besides, thicker top oxide thickness will contribute to better gate disturbance performance while maintaining the same drain disturbance. We also found that the excellent endurance can be performed for the device with thinner tunneling oxide thickness. Optimized ONO thickness for WSG-SONOS memory will be demonstrated in this paper.","PeriodicalId":422226,"journal":{"name":"2007 IEEE International Workshop on Memory Technology, Design and Testing","volume":"201 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134188315","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Future challenges and opportunities of the memory industry 记忆体产业未来的挑战与机遇
2007 IEEE International Workshop on Memory Technology, Design and Testing Pub Date : 2007-12-03 DOI: 10.1109/MTDT.2007.4547602
Changhyun Kim
{"title":"Future challenges and opportunities of the memory industry","authors":"Changhyun Kim","doi":"10.1109/MTDT.2007.4547602","DOIUrl":"https://doi.org/10.1109/MTDT.2007.4547602","url":null,"abstract":"The still ongoing digital revolution of the 21st century has changed the daily life of a great number of people. The explosive growth of the semiconductor industry, which reached about 16% per year in the past, was based on two pillars; the incessant demand for information-related goods and the advance in process & device integration technology, which satisfied the need for enhancing system performance and reducing production costs.","PeriodicalId":422226,"journal":{"name":"2007 IEEE International Workshop on Memory Technology, Design and Testing","volume":"313 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116281640","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A novel poly-Si nanowire TFT for nonvolatile memory applications 用于非易失性存储器的新型多晶硅纳米线TFT
2007 IEEE International Workshop on Memory Technology, Design and Testing Pub Date : 2007-12-03 DOI: 10.1109/MTDT.2007.4547618
H. Hsu, Horng-Chih Lin, Jian-Fu Huang, Tiao-Yuan Huang
{"title":"A novel poly-Si nanowire TFT for nonvolatile memory applications","authors":"H. Hsu, Horng-Chih Lin, Jian-Fu Huang, Tiao-Yuan Huang","doi":"10.1109/MTDT.2007.4547618","DOIUrl":"https://doi.org/10.1109/MTDT.2007.4547618","url":null,"abstract":"A novel ploy-Si nanowire TFT-SONOS device configured with independent double-gate structure was fabricated and characterized. The electrical characteristics including programming and erasing properties were studied. Adding an adequate top-gate bias was found to improve the programming efficiency, resulting in larger memory window.","PeriodicalId":422226,"journal":{"name":"2007 IEEE International Workshop on Memory Technology, Design and Testing","volume":"79 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124845247","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Controllable low-power dual-port embedded SRAM for DSP processor 一种用于DSP处理器的可控低功耗双端口嵌入式SRAM
2007 IEEE International Workshop on Memory Technology, Design and Testing Pub Date : 2007-12-03 DOI: 10.1109/MTDT.2007.4547610
Hao-I Yang, Ming-Hung Chang, Tay-Jyi Lin, Shih-Hao Ou, Siang-Sen Deng, Chih-Wei Liu, W. Hwang
{"title":"A Controllable low-power dual-port embedded SRAM for DSP processor","authors":"Hao-I Yang, Ming-Hung Chang, Tay-Jyi Lin, Shih-Hao Ou, Siang-Sen Deng, Chih-Wei Liu, W. Hwang","doi":"10.1109/MTDT.2007.4547610","DOIUrl":"https://doi.org/10.1109/MTDT.2007.4547610","url":null,"abstract":"In this paper, a low-power embedded memory module is designed for a multi-threaded DSP processor. A co-design of circuit and architecture technique is proposed. The technique includes three circuit schemes: controllable pre-charged bit-line, low voltage bit-line, and controllable data-retention power gating. Because the low-power control signals are generated by the DSP engine, the operating condition of the memory module can be arbitrarily adjusted by using software programming. The integration of low-power dual-port 8KB SRAM and the multi-threaded DSP engine is implemented in TSMC 130 nm CMOS technology. By using these techniques, the overall access power reduction of the DSP core is around 15.30%-16.84%.","PeriodicalId":422226,"journal":{"name":"2007 IEEE International Workshop on Memory Technology, Design and Testing","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123759598","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Logic-compatible embedded NVM for RFID application 用于RFID应用的逻辑兼容嵌入式NVM
2007 IEEE International Workshop on Memory Technology, Design and Testing Pub Date : 2007-12-03 DOI: 10.1109/MTDT.2007.4547621
C. Kuo, J. Wang, Y. Chih, J. Wang, T. Yew, D. Shyu, J. Huang, K. Liu
{"title":"Logic-compatible embedded NVM for RFID application","authors":"C. Kuo, J. Wang, Y. Chih, J. Wang, T. Yew, D. Shyu, J. Huang, K. Liu","doi":"10.1109/MTDT.2007.4547621","DOIUrl":"https://doi.org/10.1109/MTDT.2007.4547621","url":null,"abstract":"In this paper, we described the design of logic-process compatible embedded non-volatile memory (NVM) macro for the application of radio frequency identification (RFID). A prototype 1024-bits NVM test chip fabricated by 0.18 mum standard CMOS process is described and characterized. The characterization result shows write power is only 90 uW for write operation and 2 uW @0.5 MHz for read operation. The minimum VCC for read operation can be as low as 0.68 V at -40degC. Macro size of 1024-bits IP is only 0.215 mm2.","PeriodicalId":422226,"journal":{"name":"2007 IEEE International Workshop on Memory Technology, Design and Testing","volume":"101 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133305255","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Variability, margins, and unpredictability: Dealing with uncertainty in SRAM design 可变性、边际和不可预测性:处理SRAM设计中的不确定性
2007 IEEE International Workshop on Memory Technology, Design and Testing Pub Date : 2007-12-03 DOI: 10.1109/MTDT.2007.4547605
R. Aitken
{"title":"Variability, margins, and unpredictability: Dealing with uncertainty in SRAM design","authors":"R. Aitken","doi":"10.1109/MTDT.2007.4547605","DOIUrl":"https://doi.org/10.1109/MTDT.2007.4547605","url":null,"abstract":"As process technology continues to advance, SRAM design is becoming increasingly critical. Not only does memory occupy a large portion of the design, but memory structures are increasingly susceptible to yield and variability issues than. Classical design validation and margining methods must be extended to cope with new challenges, including low power operation, accurate modeling, blurring lines between defects and variability, and limits of classical scaling. This talk addresses these issues and discusses new approaches they require.","PeriodicalId":422226,"journal":{"name":"2007 IEEE International Workshop on Memory Technology, Design and Testing","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134570484","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
High-performance SRAM in nanoscale CMOS: Design challenges and techniques 纳米级CMOS中的高性能SRAM:设计挑战和技术
2007 IEEE International Workshop on Memory Technology, Design and Testing Pub Date : 2007-12-03 DOI: 10.1109/MTDT.2007.4547603
C. Chuang, S. Mukhopadhyay, Jae-Joon Kim, Keunwoo Kim, R. Rao
{"title":"High-performance SRAM in nanoscale CMOS: Design challenges and techniques","authors":"C. Chuang, S. Mukhopadhyay, Jae-Joon Kim, Keunwoo Kim, R. Rao","doi":"10.1109/MTDT.2007.4547603","DOIUrl":"https://doi.org/10.1109/MTDT.2007.4547603","url":null,"abstract":"This paper reviews the design challenges and techniques of high-performance SRAM in the \"End of Scaling\" nanoscale CMOS technologies. The impacts of technology scaling, such as signal loss due to leakage, degradation of noise margin due to VT scatter caused by process variations and random dopant fluctuation, and long term reliability degradation such as NBTI, are addressed. Design directions and leakage/variation/degradation tolerant SRAM circuit techniques to mitigate various performance and reliability constraints in conventional planar CMOS technology are discussed. Examples are given and merits discussed for cell isolation and strength preservation, thin cell layout, bit-line and word-line leakage mitigation, migration to large signal read-out, undamped bit-line, dual-supply, dynamic Read/Write supply, floating power-line, header/footer power-gating structures, Read- and Write-assist circuits, leakage/variation detection and compensation techniques, word-line and bit-line pulsing schemes, gate leakage tolerant design, and NBTI tolerant design. Alternative cell structures, such as asymmetrical SRAM, 7T, and 8T SRAMs, which decouple the cell storage node from the Read-disturb and half-select disturb to improve the SNM are discussed. Finally, some design issues and opportunities in emerging technologies such as FD/SOI and multi-gate FinFET are illustrated.","PeriodicalId":422226,"journal":{"name":"2007 IEEE International Workshop on Memory Technology, Design and Testing","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130320521","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 63
An automatic design for flash memory testing 一种闪存测试的自动设计
2007 IEEE International Workshop on Memory Technology, Design and Testing Pub Date : 2007-12-03 DOI: 10.1109/MTDT.2007.4547615
Wei-Lun Wang, Zheng-Wei Song
{"title":"An automatic design for flash memory testing","authors":"Wei-Lun Wang, Zheng-Wei Song","doi":"10.1109/MTDT.2007.4547615","DOIUrl":"https://doi.org/10.1109/MTDT.2007.4547615","url":null,"abstract":"Due to the easy implementation and high fault coverage, the march-like algorithms have been used for the flash memory testing. However, the testing complexity of the flash memory testing is mainly dominated by the memory address spaces. Many tremendous human efforts are required to design a built-in self-test test pattern generator for a large capacity of flash memory. To save the design overhead, an automatic design for any size of flash memory testing has been proposed in this paper. By using the Microsoft Visual Basic (VB) programming tool, a graphical user interface (GUI) has been designed for the user to apply the specification of flash memory. Then the test pattern generator of the embedded march-like algorithms for testing the flash memory has been designed automatically and converted to the hardware description language (HDL) file. Under the control of the VB, without any manual labor, the HDL file can be compiled and simulated by the Altera FPGA tool - Quartus II and converted to the specific files for applying the Data Generator Instruments to generate the test signals.","PeriodicalId":422226,"journal":{"name":"2007 IEEE International Workshop on Memory Technology, Design and Testing","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115280532","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
How far can we go in wireless testing of memory chips and wafers? 在存储芯片和晶圆的无线测试方面,我们能走多远?
2007 IEEE International Workshop on Memory Technology, Design and Testing Pub Date : 2007-12-03 DOI: 10.1109/MTDT.2007.4547611
Cheng-Wen Wu
{"title":"How far can we go in wireless testing of memory chips and wafers?","authors":"Cheng-Wen Wu","doi":"10.1109/MTDT.2007.4547611","DOIUrl":"https://doi.org/10.1109/MTDT.2007.4547611","url":null,"abstract":"Summary form only given. Test cost has become a significant portion of the cost structure in advanced semiconductor memory products. To address this issue at both the wafer and packaged-chip levels, we propose HOY - a novel wireless test system with enhanced embedded test features. In this talk we will briefly outline Project HOY and the test systems and applications it defines, with focus on memory chips and wafers. Our vision is that high-end memory IC testing can go wireless in a few years. Therefore, HOY is intended as a next-generation memory test system, with wireless communication and enhanced embedded test features, such as built-in self test (BIST) and built-in self-repair (BISR).","PeriodicalId":422226,"journal":{"name":"2007 IEEE International Workshop on Memory Technology, Design and Testing","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124902788","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Embedded SRAM trend in nano-scale CMOS 纳米级CMOS的嵌入式SRAM趋势
2007 IEEE International Workshop on Memory Technology, Design and Testing Pub Date : 2007-12-03 DOI: 10.1109/MTDT.2007.4547608
H. Yamauchi
{"title":"Embedded SRAM trend in nano-scale CMOS","authors":"H. Yamauchi","doi":"10.1109/MTDT.2007.4547608","DOIUrl":"https://doi.org/10.1109/MTDT.2007.4547608","url":null,"abstract":"This paper describes an SRAM scaling trend in terms of bit-cell size and operating voltage (Vdd) in a nano-scale process generation. The key design solutions to extend a 6T SRAM lifetime are reviewed and discussed including a possible bit cell scaling trend comparing with an 8T SRAM as one of the successors. Each dependency of 3 key margins of write margin (WRM), static noise margin (SNM), and cell current (Icell) on the scaling ratio of Vdd and MOSFET channel feature size has been shown to clarify the real issues in the scaling. The bit cell area scaling trends of 6T and 8T SRAMs are predicted. It has been shown that the area of 6T will be getting closer to that of 8T at 32 nm and should cross over around 22 nm.","PeriodicalId":422226,"journal":{"name":"2007 IEEE International Workshop on Memory Technology, Design and Testing","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-12-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134038296","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 21
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