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2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)最新文献

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The Eccentrics of CPU FIVR AGS supply noise debug and learnings CPU FIVR AGS的偏心提供了噪声调试和学习
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9995668
Druvika Pandita, Veerendra K Jonna, Kim Meng Chin, Muzammil Peerjade, A. Singh, Anil Bindu Lingambudi
{"title":"The Eccentrics of CPU FIVR AGS supply noise debug and learnings","authors":"Druvika Pandita, Veerendra K Jonna, Kim Meng Chin, Muzammil Peerjade, A. Singh, Anil Bindu Lingambudi","doi":"10.1109/EDAPS56906.2022.9995668","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9995668","url":null,"abstract":"SoC design, validation, and manufacturing teams all need to work in tandem to ensure a successful product is released to the market. Pre-silicon and post-silicon validation is critical and is performed to ensure minimal Si re-spins at the fabrication and avoid any design bugs reaching the end customer. The post-silicon debug of various power failures issues related to analog supply exhibiting random signatures induced learnings that can help expedite changes in post-Si validation and high-volume screening, Discussed in detail are the debug efforts to identify one of the many Analog Generation Supply (AGS) noise failure and isolation. The paper elucidates reports of the proposed defects and their various bearings, issue root causes, and issue validation suite formation.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122847927","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Modeling Cascade-able Transceiver Blocks With Neural Network For High Speed Link Simulation 用于高速链路仿真的可级联收发模块神经网络建模
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9995074
Yixuan Zhao, Thong Nguyen, Hanzhi Ma, Erping Li, A. Cangellaris, J. Schutt-Ainé
{"title":"Modeling Cascade-able Transceiver Blocks With Neural Network For High Speed Link Simulation","authors":"Yixuan Zhao, Thong Nguyen, Hanzhi Ma, Erping Li, A. Cangellaris, J. Schutt-Ainé","doi":"10.1109/EDAPS56906.2022.9995074","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9995074","url":null,"abstract":"In this article, we present the methodology of developing cascade-able transceiver models using feed-forward neural network (FNN) for time-domain high speed link (HSL) simulation. Specifically, we focused on FNN assisted nonlinear modeling of transistor level buffers. At each cascading node, the FNN model is able to predict the corresponding voltage waveform and forward that prediction along the HSL link as input for the next available model. Compared to the industrial standard models like SPICE and IBIS, HSL simulation done through FNN models does not involve complicated converging iterations nor does it requires substantial domain knowledge. Furthermore, we demonstrated that by overlaying the high-correlation output responses from the FNN models, eye digram analysis can now be performed 20 times faster than using SPICE solvers.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132604238","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A Novel Dualband Patch Antenna with Liquid Metal and Flexible Packaging for Strain Sensing 一种新型液态金属柔性封装双波段贴片天线用于应变传感
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9994874
Peng Zhang, A. Poddar, U. Rohde, M. Tong
{"title":"A Novel Dualband Patch Antenna with Liquid Metal and Flexible Packaging for Strain Sensing","authors":"Peng Zhang, A. Poddar, U. Rohde, M. Tong","doi":"10.1109/EDAPS56906.2022.9994874","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9994874","url":null,"abstract":"This paper presents a novel microstrip patch antenna based on a Polydimethylsiloxane (PDMS) dielectric substrate and liquid metal for strain sensing applications. The dual broadband antenna operates from 1.0 GHz to 2.5 GHz for the strain sensing. Multi-physics field modeling and simulation are performed by the well-known software COMSOL and a linear numerical relationship between the resonant frequency and strain has been obtained. Base on the relationship, the antenna can be used as a strain sensor to detect the deformation of some structures from the change of resonant frequency.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133857352","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Analytical Models for Embedded Discrete and Thin Film Capacitors in Multilayered Printed Circuits 多层印刷电路中嵌入式离散电容器和薄膜电容器的分析模型
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9995666
I. Erdin
{"title":"Analytical Models for Embedded Discrete and Thin Film Capacitors in Multilayered Printed Circuits","authors":"I. Erdin","doi":"10.1109/EDAPS56906.2022.9995666","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9995666","url":null,"abstract":"Analytical models are proposed for accurate characterization of embedded capacitors in multilayered printed circuit stackups. In the proposed algorithm, a printed circuit board (PCB) is represented as a stack of resonant cavities with embedded thin film and discrete capacitors modeled as layers and components, respectively, in an inner cavity. This representation allows for a mathematical model in the form of finite continued fractions. The frequency domain response of the proposed model is observed in good agreement with data from numerical electromagnetic (EM) simulations, which validate its accuracy. The developed model is intended for quick and practical power integrity (PI) analysis of printed circuits with idefinite number of stackup layers.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123647977","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Tapered Differential Multibit Through Glass Vias for Three-Dimensional Integrated Circuits 用于三维集成电路的锥形差分多比特玻璃通孔
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9995142
Ajay Kumar, R. Dhiman
{"title":"Tapered Differential Multibit Through Glass Vias for Three-Dimensional Integrated Circuits","authors":"Ajay Kumar, R. Dhiman","doi":"10.1109/EDAPS56906.2022.9995142","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9995142","url":null,"abstract":"We present an electrical model of tapered differential-multibit through glass vias (DM-TGVs) for high density three-dimensional (3-D) integration. Analytical equations are developed to compute the impedance parasitics of tapered DM-TGVs. Simulations using the 3-D field solver with parameter modifications, such as slope angle of the TGV, type of filler material are used to confirm the scalability of the proposed model. We examine the electrical behavior of tapered TGVs in the frequency domain using the proposed model. Eye-diagram measurements are also used to verify the frequency dependent loss of capacitive-resistive TGV in the time domain.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133568279","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Deep Reinforcement Learning-based Decoupling Capacitor Optimization Method for Multi-Power Domain considering Transfer Noise in 3D-ICs 三维集成电路中基于深度强化学习的多功率域解耦电容优化方法
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9994990
Seonghi Lee, Hyunwoong Kim, Dongryul Park, Jangyong Ahn, Seung-Han Ryu, Gagyeong Park, Seungyoung Ahn
{"title":"Deep Reinforcement Learning-based Decoupling Capacitor Optimization Method for Multi-Power Domain considering Transfer Noise in 3D-ICs","authors":"Seonghi Lee, Hyunwoong Kim, Dongryul Park, Jangyong Ahn, Seung-Han Ryu, Gagyeong Park, Seungyoung Ahn","doi":"10.1109/EDAPS56906.2022.9994990","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9994990","url":null,"abstract":"In this paper, we propose a deep reinforcement learning (DRL)-based multi-power distribution network (PDN) decoupling capacitor design optimization method considering transfer noise in 3D-ICs. The transfer noise from multi-PDN with vertical structures could cause system failure, the entire simultaneous switching noise (SSN) with the combined transfer noise should be considered. To address the multi-PDN problem, we use reinforcement learning suitable for solving complex optimization problems. The input dataset and Markov decision process (MDP) were designed to optimize various multi-PDN cases. The 5x4 size of two PDNs with a vertically stacked structure was used for verification. The proposed method successfully optimizes the decoupling capacitors of multi-PDN. In addition, the proposed method was compared to genetic algorithm (GA), the proposed method perfomed better optimization and reduced the time by about 99% compared to GA to 0.08 seconds.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"33 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127982198","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Electromagnetic-Thermal Co-simulation of a Patch Antenna 贴片天线的电磁-热联合仿真
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9995117
Xin Yi Liu, Z. Jia, H. Zhang, Ying Liu, M. Tong
{"title":"Electromagnetic-Thermal Co-simulation of a Patch Antenna","authors":"Xin Yi Liu, Z. Jia, H. Zhang, Ying Liu, M. Tong","doi":"10.1109/EDAPS56906.2022.9995117","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9995117","url":null,"abstract":"In order to simulate the influence of the thermal effects of a patch antenna on its electromagnetic radiation performance, the discontinuous Galerkin time domain (DGTD) method and finite element time domain (FETD) method are employed to implement electromagnetic-thermal co-simulation. The Maxwell equation is solved by DGTD method, while the heat conduction equation is solved by FETD method. The electromagnetic and thermal simulation are linked by loss power of material and temperature dependent conductivity. Numerical results show that the radiation pattern will change if we consider the thermal effects of the patch antenna.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115175798","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Novel Miniaturized Aperture Hexagonal Frequency Selective Surface 一种新型小型化孔径六角形频率选择表面
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9994858
Xiaodong An, Da Li, Yudi Fan, Erping Li
{"title":"A Novel Miniaturized Aperture Hexagonal Frequency Selective Surface","authors":"Xiaodong An, Da Li, Yudi Fan, Erping Li","doi":"10.1109/EDAPS56906.2022.9994858","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9994858","url":null,"abstract":"In this paper, a novel miniaturized hexagonal frequency selective surface (FSS) element is proposed, where the structure has a dual-polarized angular stable passband. The simulated results show that the resonant frequency of the FSS is at 2.994 GHz and the 3dB passband is 2.45 GHz–3.58 GHz for both TE and TM polarization. In the range of 70° incident angle, the transmission zero of TE polarized wave is only shifted by 0.2%, which has high angle stability and good polarization stability.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129536233","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Resonant subsurface terahertz absorber based on patterned graphene 基于图案化石墨烯的谐振次表面太赫兹吸收体
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9995661
Xuanye Wang, Yuxian Zhang, Lixia Yang, Zhixiang Huang, M. Tong, N. Feng
{"title":"Resonant subsurface terahertz absorber based on patterned graphene","authors":"Xuanye Wang, Yuxian Zhang, Lixia Yang, Zhixiang Huang, M. Tong, N. Feng","doi":"10.1109/EDAPS56906.2022.9995661","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9995661","url":null,"abstract":"In this paper, we simulate and demonstrate a patterned graphene resonant subsurface terahertz absorber using the finite element method. By adjustment of the parameters of the geometry of the structure, the absorber’s absorption can be tuned well. The structure’s angle of incidence is also evaluated. The structure can be optimally tuned to achieve over 92% absorption at any frequency point in the 1.40 THz to 3.44 THz frequency band. The structure designed by introducing two-dimensional materials has promising applications in terahertz detection and sensing, and can also be used to make filter components.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130702130","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Development and Comparative Analysis of Delay Fault Models for Variants of High Speed CNT Interconnects at Submicron Technology 亚微米级高速碳纳米管互连延迟故障模型的开发与比较分析
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9995394
Urmi Shah, U. Mehta
{"title":"Development and Comparative Analysis of Delay Fault Models for Variants of High Speed CNT Interconnects at Submicron Technology","authors":"Urmi Shah, U. Mehta","doi":"10.1109/EDAPS56906.2022.9995394","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9995394","url":null,"abstract":"Copper (Cu) has been meticulously used as an onchip connectivity material in VLSI chip design. This paper explores and investigates characteristics of carbon nanotubes (CNT) as high-speed VLSI interconnects. Delay faults are comparatively reduced in CNT interconnects with respect to Cu interconnects. It has been observed that variants of CNT interconnects experiences delay fault at quite later stage compared to Cu interconnects. SPICE based delay fault model has been considered here for fault analysis in on-chip interconnects. It has been depicted that SWCNT interconnect outperform compare to other CNT interconnects in terms of delay fault model analysis. The length of interconnect is varied from 1 μm to 100 μm for delay fault analysis at 16 nm technology node.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124865412","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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