{"title":"用于三维集成电路的锥形差分多比特玻璃通孔","authors":"Ajay Kumar, R. Dhiman","doi":"10.1109/EDAPS56906.2022.9995142","DOIUrl":null,"url":null,"abstract":"We present an electrical model of tapered differential-multibit through glass vias (DM-TGVs) for high density three-dimensional (3-D) integration. Analytical equations are developed to compute the impedance parasitics of tapered DM-TGVs. Simulations using the 3-D field solver with parameter modifications, such as slope angle of the TGV, type of filler material are used to confirm the scalability of the proposed model. We examine the electrical behavior of tapered TGVs in the frequency domain using the proposed model. Eye-diagram measurements are also used to verify the frequency dependent loss of capacitive-resistive TGV in the time domain.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Tapered Differential Multibit Through Glass Vias for Three-Dimensional Integrated Circuits\",\"authors\":\"Ajay Kumar, R. Dhiman\",\"doi\":\"10.1109/EDAPS56906.2022.9995142\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present an electrical model of tapered differential-multibit through glass vias (DM-TGVs) for high density three-dimensional (3-D) integration. Analytical equations are developed to compute the impedance parasitics of tapered DM-TGVs. Simulations using the 3-D field solver with parameter modifications, such as slope angle of the TGV, type of filler material are used to confirm the scalability of the proposed model. We examine the electrical behavior of tapered TGVs in the frequency domain using the proposed model. Eye-diagram measurements are also used to verify the frequency dependent loss of capacitive-resistive TGV in the time domain.\",\"PeriodicalId\":401014,\"journal\":{\"name\":\"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-12-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS56906.2022.9995142\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS56906.2022.9995142","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Tapered Differential Multibit Through Glass Vias for Three-Dimensional Integrated Circuits
We present an electrical model of tapered differential-multibit through glass vias (DM-TGVs) for high density three-dimensional (3-D) integration. Analytical equations are developed to compute the impedance parasitics of tapered DM-TGVs. Simulations using the 3-D field solver with parameter modifications, such as slope angle of the TGV, type of filler material are used to confirm the scalability of the proposed model. We examine the electrical behavior of tapered TGVs in the frequency domain using the proposed model. Eye-diagram measurements are also used to verify the frequency dependent loss of capacitive-resistive TGV in the time domain.
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