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2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)最新文献

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Fast Eye Diagram Simulation based on Latency Insertion Method 基于延迟插入法的快速眼图仿真
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9995484
Yi Zhou, Bobi Shi, Yixuan Zhao, J. Schutt-Ainé
{"title":"Fast Eye Diagram Simulation based on Latency Insertion Method","authors":"Yi Zhou, Bobi Shi, Yixuan Zhao, J. Schutt-Ainé","doi":"10.1109/EDAPS56906.2022.9995484","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9995484","url":null,"abstract":"Eye diagrams are used to assess the quality of high-speed channels. They are thus very important for signal integrity analysis. The voltage-in-current latency insertion method (VinC LIM) is a fast transient circuit simulation algorithm with superior stability properties. In this paper, VinC LIM is proven to be reliable for fast transient simulation of eye diagrams. The results and speed are compared with the transient simulation and channel simulation of commercial platforms.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125528557","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A Novel FSS for High/Low Frequency Band Beam Transparent Scanning/Grounding 一种新型高/低频波束透明扫描/接地FSS
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9994937
S.-H. Sun, Hong-li Peng, Hongan Zhou, Qingmian Wan
{"title":"A Novel FSS for High/Low Frequency Band Beam Transparent Scanning/Grounding","authors":"S.-H. Sun, Hong-li Peng, Hongan Zhou, Qingmian Wan","doi":"10.1109/EDAPS56906.2022.9994937","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9994937","url":null,"abstract":"5G antenna array covered by a novel frequency selective surface(FSS) is proposed in this paper for 5G antenna array applications. Proposed FSS has a pass-band between 3.3GHz to 3.8GHz with the transmission coefficient greater than −0.5dB, which has negligible impact on the antenna pattern, and the reflection coefficient of the FSS is greater than −1dB between 0.5GHz to 2.2GHz, which serves as a reflector for other band antennas. The antenna array below FSS consists of four elements operated in band of 3.3–3.6 GHz, and gains above 10dB are achieved with no pattern distortion.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"2 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120826398","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Latency Insertion Method for FinFET DC Operating Point Simulation Based on BSIM-CMG 基于BSIM-CMG的FinFET直流工作点仿真延迟插入方法
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9995055
Yi Zhou, J. Schutt-Ainé
{"title":"Latency Insertion Method for FinFET DC Operating Point Simulation Based on BSIM-CMG","authors":"Yi Zhou, J. Schutt-Ainé","doi":"10.1109/EDAPS56906.2022.9995055","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9995055","url":null,"abstract":"As the scaling of planar MOSFETs progresses, various short-channel effects become prominent. The 3-dimensional FinFET was invented to avoid these short-channel effects. Transistor-level simulation with FinFETs is traditionally conducted by SPICE which has super-linear computational complexity. We propose a new method for FinFET DC operating point simulation through the use of the latency insertion method (LIM) which exhibits linear computational complexity. The algorithm incorporates the BSIM-CMG industry-standard compact model. The method is tested on 10 nm and 20 nm FinFETs, and the results are compared with commercial simulators.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123074977","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Thermal Analysis of DDR5 DIMM with Forced Air Cooling Method 采用强制风冷方式的DDR5 DIMM热分析
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9994998
Keeyoung Son, Daehwan Lho, Seongguk Kim, Joonsang Park, Keunwoo Kim, N. Choi, Hyunsik Kim, Joungho Kim
{"title":"Thermal Analysis of DDR5 DIMM with Forced Air Cooling Method","authors":"Keeyoung Son, Daehwan Lho, Seongguk Kim, Joonsang Park, Keunwoo Kim, N. Choi, Hyunsik Kim, Joungho Kim","doi":"10.1109/EDAPS56906.2022.9994998","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9994998","url":null,"abstract":"In this paper, thermal analysis of double data rate 5 (DDR5) dual in-line memory module (DIMM) with forced air cooling was carried out. As the requirement of memory capacity and data speed of DIMMs increase, thermal reliability issues limit the overall system performance. Furthermore, with the development of DDR4 DIMMs to DDR5 DIMMs, a power management integrated circuit (PMIC) with high power density has been added for power reliability, exacerbating the thermal issues. Hence, to secure thermal reliability, thermal management design of the next-generation DIMM is essential. This research analyzed the DDR5 DIMM at forced air cooling conditions. By using 3D fluent solver, we analyzed the thermal gradients of DIMM depending on air velocity. The results showed that the increasing air velocity has higher cooling performance. However, it showed that forced air cooling begins to have limitations in terms of cooling performance.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"146 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126881351","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design and Analysis of Hierarchical Power Distribution Network (PDN) for Full Wafer Scale Chip (FWSC) Module 全晶圆级芯片(FWSC)模块分层配电网络(PDN)的设计与分析
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9995183
Hyunwoo Kim, Haeyeon Kim, Joonsang Park, Keeyoung Son, Hyunwook Park, Taein Shin, Keunwoo Kim, Jiwon Yoon, Jung-Hyun Lee, Jonghyun Hong, June-Kyoung Kim, Joungho Kim
{"title":"Design and Analysis of Hierarchical Power Distribution Network (PDN) for Full Wafer Scale Chip (FWSC) Module","authors":"Hyunwoo Kim, Haeyeon Kim, Joonsang Park, Keeyoung Son, Hyunwook Park, Taein Shin, Keunwoo Kim, Jiwon Yoon, Jung-Hyun Lee, Jonghyun Hong, June-Kyoung Kim, Joungho Kim","doi":"10.1109/EDAPS56906.2022.9995183","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9995183","url":null,"abstract":"In this paper, we design and analyze the hierarchical power distribution network (PDN) for full wafer scale chip (FWSC) module. With its high bandwidth and low latency, FWSC has been considered a promising solution in the artificial intelligence (AI) processor market. However, the huge size of FWSC inevitably leads to long current paths and high impedance that consequently cause large IR drop and power/ground noise. In an effort to overcome these issues, the hierarchical PDN of FWSC module is designed in a 3D structure that allows direct interconnection from PCB to chip to minimize the current path. Although there are several studies related to PDN design for FWSC module, they conducted limited analysis on a specific PDN only. We design the hierarchical PDN for FWSC module composed of PCB PDN, multi-array silicone rubber socket (SRS)-based PDN, multi-array through wafer via (TWV)-based PDN, and on-chip PDN. Each PDN component was modeled into equivalent circuit models. Then, we fully analyzed the overall hierarchical PDN impedance in the frequency domain.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"198 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130971562","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
An Approach of Designing High Angular Resolution Virtual MIMO Antennas for Radio System Applications 无线电系统中高角分辨虚拟MIMO天线的设计方法
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9995351
Xing Liao, Kuayue Liu, Qingmian Wan, Hongli Peng, Junfa Mao
{"title":"An Approach of Designing High Angular Resolution Virtual MIMO Antennas for Radio System Applications","authors":"Xing Liao, Kuayue Liu, Qingmian Wan, Hongli Peng, Junfa Mao","doi":"10.1109/EDAPS56906.2022.9995351","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9995351","url":null,"abstract":"In this paper, an approach of designing high angular resolution (AR) antennas system is presented. Based on the virtual antenna and ambiguity function theory, its AR is improved from our detailed design, including optimized beam patterns, 2D sparse array and electromagnetic band gap (EBG) structure techniques. High AR of 1.1°/3.5° in azimuth/elevation are obtained, and then verified by both the simulations and the experiments in our millimeter wave (MMw) system platform, showing the validity of the approach.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"15 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120878261","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Investigation of Chirp Stepped Signal Performance for 60GHz Millimeter Wave Radar 60GHz毫米波雷达啁啾阶跃信号性能研究
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9994927
Kuayue Liu, Xing Liao, Qingmian Wan, Hongli Peng, Junfa Mao
{"title":"Investigation of Chirp Stepped Signal Performance for 60GHz Millimeter Wave Radar","authors":"Kuayue Liu, Xing Liao, Qingmian Wan, Hongli Peng, Junfa Mao","doi":"10.1109/EDAPS56906.2022.9994927","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9994927","url":null,"abstract":"The performance of the chirp stepped signal (CSS) is investigated in this paper. Based on the ambiguity function theory, a 60GHz radar system performance with CSS, such as, distance, speed and angle detection are firstly analyzed and then simulated and experimental verified. Finally, using our designed CSS, a higher signal-to-noise ratio (SNR) and improved range detection capability are obtained under the condition of low instantaneous bandwidth when compared with the FMCW signal. Our results show that the CSS has a good potential for 60GHz millimeter radar applications.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"12 5 Suppl 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122508400","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Mode Matching Analysis of Partially Filled Waveguide for Determining Electrical Property Parameters of Penetrable Materials 部分填充波导模式匹配分析用于确定可穿透材料的电性能参数
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9995540
Bo O. Zhu, Xiao Yu Li, Min Ye, Yun Jing Zhang, M. Tong
{"title":"Mode Matching Analysis of Partially Filled Waveguide for Determining Electrical Property Parameters of Penetrable Materials","authors":"Bo O. Zhu, Xiao Yu Li, Min Ye, Yun Jing Zhang, M. Tong","doi":"10.1109/EDAPS56906.2022.9995540","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9995540","url":null,"abstract":"Determination of electrical property parameters like permittivity and permeability for penetrable materials is very important in many applications. There are several common techniques such as resonant cavity method, free space method, and waveguide method which can achieve the purpose. Partially filled waveguide method is another one that enjoys the feature of reduced fabrication precision requirement for the dielectric sample under test. In the original paper proposing the partially filled waveguide method, only TM modes are considered. Through mode matching analysis, we will show in this paper that both TM and TE modes shall be included in order to obtain a correct result.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125898540","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Analysis of the Slot on a Dual-Band Antenna 双频天线的缝隙分析
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9995688
Chi-Hau Yang, Yin-Ting Ciou, L. Hwang
{"title":"Analysis of the Slot on a Dual-Band Antenna","authors":"Chi-Hau Yang, Yin-Ting Ciou, L. Hwang","doi":"10.1109/EDAPS56906.2022.9995688","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9995688","url":null,"abstract":"In this paper, we propose a low-profile planar dual band WLAN antenna application on wireless audio. In order to offset with the frequency-shift effect caused by plastic material, the frequency was designed higher than the default application frequency to facilitate/enable the application with added plastic material. The Default application frequency 2.4 GHz & 5 GHz for BT and WIFI, adjust the impedance matching by adjusting the coupling using slot of the two structures on the dipole antenna, so that the energy can be transmitted most effectively.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124926544","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Novel 3-D Frequency Selective Structure for Radiation Leakage Suppression in Sub-6G Highly Integrated Package 一种用于Sub-6G高集成度封装抑制辐射泄漏的三维选频结构
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9995136
Yun Wu, Da Li, Yudi Fan, Hanzhi Ma, Erping Li
{"title":"A Novel 3-D Frequency Selective Structure for Radiation Leakage Suppression in Sub-6G Highly Integrated Package","authors":"Yun Wu, Da Li, Yudi Fan, Hanzhi Ma, Erping Li","doi":"10.1109/EDAPS56906.2022.9995136","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9995136","url":null,"abstract":"This paper presents a novel three-dimensional frequency selective surface (3-D FSS) dedicated to highly integrated package in Sub-6G communication applications. The structure operates between 3.3 GHz and 3.8 GHz with two stopbands on each side. A stable response under the incident angles up to 50° is shown through an electromagnetic simulator analysis. The in-band insertion loss is less than 0.65 dB and the out-of-band insertion loss is more than 10 dB for both TE and TM polarizations under the incident angle up to 50°. Moreover, this novel structure is insensitive to all polarization and has a unit cell size of 0.07λ. All these results indicate that the proposed FSS is a good candidate for radiation leakage suppression in Sub-6G highly integrated package.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121978688","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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