{"title":"基于BSIM-CMG的FinFET直流工作点仿真延迟插入方法","authors":"Yi Zhou, J. Schutt-Ainé","doi":"10.1109/EDAPS56906.2022.9995055","DOIUrl":null,"url":null,"abstract":"As the scaling of planar MOSFETs progresses, various short-channel effects become prominent. The 3-dimensional FinFET was invented to avoid these short-channel effects. Transistor-level simulation with FinFETs is traditionally conducted by SPICE which has super-linear computational complexity. We propose a new method for FinFET DC operating point simulation through the use of the latency insertion method (LIM) which exhibits linear computational complexity. The algorithm incorporates the BSIM-CMG industry-standard compact model. The method is tested on 10 nm and 20 nm FinFETs, and the results are compared with commercial simulators.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Latency Insertion Method for FinFET DC Operating Point Simulation Based on BSIM-CMG\",\"authors\":\"Yi Zhou, J. Schutt-Ainé\",\"doi\":\"10.1109/EDAPS56906.2022.9995055\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As the scaling of planar MOSFETs progresses, various short-channel effects become prominent. The 3-dimensional FinFET was invented to avoid these short-channel effects. Transistor-level simulation with FinFETs is traditionally conducted by SPICE which has super-linear computational complexity. We propose a new method for FinFET DC operating point simulation through the use of the latency insertion method (LIM) which exhibits linear computational complexity. The algorithm incorporates the BSIM-CMG industry-standard compact model. The method is tested on 10 nm and 20 nm FinFETs, and the results are compared with commercial simulators.\",\"PeriodicalId\":401014,\"journal\":{\"name\":\"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"volume\":\"39 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-12-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS56906.2022.9995055\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS56906.2022.9995055","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Latency Insertion Method for FinFET DC Operating Point Simulation Based on BSIM-CMG
As the scaling of planar MOSFETs progresses, various short-channel effects become prominent. The 3-dimensional FinFET was invented to avoid these short-channel effects. Transistor-level simulation with FinFETs is traditionally conducted by SPICE which has super-linear computational complexity. We propose a new method for FinFET DC operating point simulation through the use of the latency insertion method (LIM) which exhibits linear computational complexity. The algorithm incorporates the BSIM-CMG industry-standard compact model. The method is tested on 10 nm and 20 nm FinFETs, and the results are compared with commercial simulators.