Latency Insertion Method for FinFET DC Operating Point Simulation Based on BSIM-CMG

Yi Zhou, J. Schutt-Ainé
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Abstract

As the scaling of planar MOSFETs progresses, various short-channel effects become prominent. The 3-dimensional FinFET was invented to avoid these short-channel effects. Transistor-level simulation with FinFETs is traditionally conducted by SPICE which has super-linear computational complexity. We propose a new method for FinFET DC operating point simulation through the use of the latency insertion method (LIM) which exhibits linear computational complexity. The algorithm incorporates the BSIM-CMG industry-standard compact model. The method is tested on 10 nm and 20 nm FinFETs, and the results are compared with commercial simulators.
基于BSIM-CMG的FinFET直流工作点仿真延迟插入方法
随着平面mosfet的缩放,各种短沟道效应变得突出。为了避免这些短沟道效应,发明了三维FinFET。传统的finfet晶体管级仿真是通过SPICE进行的,具有超线性的计算复杂度。我们提出了一种利用延迟插入法(LIM)进行FinFET直流工作点仿真的新方法,该方法具有线性计算复杂度。该算法结合了BSIM-CMG工业标准的紧凑模型。该方法在10 nm和20 nm的finfet上进行了测试,并与商用模拟器进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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