{"title":"Latency Insertion Method for FinFET DC Operating Point Simulation Based on BSIM-CMG","authors":"Yi Zhou, J. Schutt-Ainé","doi":"10.1109/EDAPS56906.2022.9995055","DOIUrl":null,"url":null,"abstract":"As the scaling of planar MOSFETs progresses, various short-channel effects become prominent. The 3-dimensional FinFET was invented to avoid these short-channel effects. Transistor-level simulation with FinFETs is traditionally conducted by SPICE which has super-linear computational complexity. We propose a new method for FinFET DC operating point simulation through the use of the latency insertion method (LIM) which exhibits linear computational complexity. The algorithm incorporates the BSIM-CMG industry-standard compact model. The method is tested on 10 nm and 20 nm FinFETs, and the results are compared with commercial simulators.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS56906.2022.9995055","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
As the scaling of planar MOSFETs progresses, various short-channel effects become prominent. The 3-dimensional FinFET was invented to avoid these short-channel effects. Transistor-level simulation with FinFETs is traditionally conducted by SPICE which has super-linear computational complexity. We propose a new method for FinFET DC operating point simulation through the use of the latency insertion method (LIM) which exhibits linear computational complexity. The algorithm incorporates the BSIM-CMG industry-standard compact model. The method is tested on 10 nm and 20 nm FinFETs, and the results are compared with commercial simulators.