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2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)最新文献

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2x-Thru De-embedding Uncertainty for On-Package High-Speed Interconnects 封装内高速互连的2 - thru脱嵌入不确定性
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9995177
C. S. Geyik, M. Hill, Zhichao Zhang, K. Aygün, J. Aberle
{"title":"2x-Thru De-embedding Uncertainty for On-Package High-Speed Interconnects","authors":"C. S. Geyik, M. Hill, Zhichao Zhang, K. Aygün, J. Aberle","doi":"10.1109/EDAPS56906.2022.9995177","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9995177","url":null,"abstract":"With the ever-increasing data rates, interconnect performance predictability becomes more and more challenging. Therefore, along with an accurate methodology, the quantification of measurement reproducibility and its impacts are essential in almost all aspects of high-speed interconnect validation. This paper investigates the reproducibility of S-parameter measurements before and after 2x-Thru de-embedding, and illustrates a multimetric correlation with uncertainty analysis.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127169060","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Novel High Capacitance Ratio RF MEMS Switch with Low Pull-in Voltage 一种新型低拉入电压高电容比射频MEMS开关
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9995638
Chen-Yen Lai, Z. Deng, Yucheng Wang
{"title":"A Novel High Capacitance Ratio RF MEMS Switch with Low Pull-in Voltage","authors":"Chen-Yen Lai, Z. Deng, Yucheng Wang","doi":"10.1109/EDAPS56906.2022.9995638","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9995638","url":null,"abstract":"An RF MEMS capacitive switch, which has a high capacitance ratio and low pull-in voltage, is designed and analyzed in this paper. The switch can change the switch’s up and down state (on and off state) capacitance by adding an H-shaped floating metal layer on the dielectric layer, which dramatically improves the capacitance ratio of the switch without changing the switch’s material and structure. The switch’s pull-in voltage is reduced by bending the spring beam to lower the switch spring coefficient. Finally, through theoretical analysis and finite element simulation, the obtained pull-in voltage is 4.7 V. When the switch is working at 33 GHz, the isolation is −60 dB, the insertion loss is −0.42 dB, and the capacitance ratio is 301. The switch shows good performance.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"86 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125018988","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Thermal solution for Co-Packaged Optics (CPO) modules 共封装光学(CPO)模块的热解决方案
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9994909
K. Matsumoto, M. Farooq, J. Knickerbocker
{"title":"Thermal solution for Co-Packaged Optics (CPO) modules","authors":"K. Matsumoto, M. Farooq, J. Knickerbocker","doi":"10.1109/EDAPS56906.2022.9994909","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9994909","url":null,"abstract":"In Co-Packaged Optics (CPO) where optical devices and ICs are attached to a common base substrate, there are requirements to keep the temperature of high-heat-dissipating ICs as low as possible and also to keep the temperature of optical devices constant. We propose two solutions to meet these two requirements and show the effect of two solutions by simulation.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122103129","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Small Wireless Module Consisting of Two Highly Isolated MIMO PIFAs 由两个高度隔离的MIMO pifa组成的小型无线模块
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9994994
Chi-Hau Yang, Yin-Ting Ciou, L. Hwang
{"title":"Small Wireless Module Consisting of Two Highly Isolated MIMO PIFAs","authors":"Chi-Hau Yang, Yin-Ting Ciou, L. Hwang","doi":"10.1109/EDAPS56906.2022.9994994","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9994994","url":null,"abstract":"(Multi-input Multi-output)MIMO technology employs multiple antennas to send and receive signals. Using the MIMO technology, we obtain more data than that using traditional single antennas. Evaluating performance of dual transmitter, isolation in multiple antennas is an important parameter. The coupling effect in MIMO antennas will not only affect the characteristics of the antenna itself, but also the pattern, which will be compressed. In this paper, the PIFA = 1/4λ wavelength is used and realize the miniaturization of the antenna body and the PIFA architecture is beneficial to current distribution, that direct improve the isolation to − 20dB. In this paper, we propose two wide band and high isolation small PIFAs printed on 5G module to cover the 5 GHz ISM band. The module dimensions is 40 mm × 30 mm, antenna area dimensions is 7 mm × 30 mm and has a 100% available wide bandwidth in the range of 5.5 GHz to 6.5 GHz","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129904994","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Passive Modeling of Interconnects Using Sum of Squares Partial Fraction Expansions 利用平方和部分分式展开的互连被动建模
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9995098
Francisco Coronado, A. Engin
{"title":"Passive Modeling of Interconnects Using Sum of Squares Partial Fraction Expansions","authors":"Francisco Coronado, A. Engin","doi":"10.1109/EDAPS56906.2022.9995098","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9995098","url":null,"abstract":"Vector fitting has been successfully applied for signal and power integrity design of interconnects and power distribution networks. It is based on a partial fraction expansion of rational functions, resulting in a well-conditioned algorithm applicable to large size problems. A major shortcoming of vector fitting is that the resulting model in many cases will not be passive. In this paper we introduce a sum-of-squares (SOS) partial fraction passivity enforcement algorithm for fitting residues of a passive network. We demonstrate that this new algorithm provides a necessary and sufficient condition for passivity enforcement of scalar networks.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121673240","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Radio Frequency Interference Characterization of 5G Device with Reciprocity Theorem 基于互易定理的5G设备射频干扰表征
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9994911
Michael Chang, Simon M. Kao, Stephen Chu, Bryant Hsu, Mark Ciou, Harrison Hu, Robby Ho
{"title":"Radio Frequency Interference Characterization of 5G Device with Reciprocity Theorem","authors":"Michael Chang, Simon M. Kao, Stephen Chu, Bryant Hsu, Mark Ciou, Harrison Hu, Robby Ho","doi":"10.1109/EDAPS56906.2022.9994911","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9994911","url":null,"abstract":"This article describes radio frequency interference (RFI) engineering analysis method to interpreting the coupling noise distribution and contribution of each noise component in the complex system. In this paper, a generic co-design flow for complex system and antenna is proposed. Frequency domain response of simulation with reciprocity theorem is correlated well with spectrum analyzer (SA) and vector network analyzer (VNA). An efficient approach achieves the validity and feasibility of RFI analysis of commercial 5G devices. The goal is to provide sufficient performance in a cost-effective solution and to be successful.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114738928","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A High-Sensitive Resonant Cavity for Measuring Concentration of Aqueous Solutions 用于测量水溶液浓度的高灵敏度谐振腔
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9995151
Ying Tian, Yun Jing Zhang, M. Tong
{"title":"A High-Sensitive Resonant Cavity for Measuring Concentration of Aqueous Solutions","authors":"Ying Tian, Yun Jing Zhang, M. Tong","doi":"10.1109/EDAPS56906.2022.9995151","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9995151","url":null,"abstract":"This paper presents a small size cylinder resonant cavity with metal posts embedded for detecting the concentration of aqueous solutions. Compared with a regular cylinder cavity operating in the same mode TM011, the electrical field is more focused on near the tube containing materials under test (MUT), hence, the sensitivity of the cavity is enhanced. Three types of solutions are simulated including glucose, NaCl, and ethanol, varying in concentration from 0 to 5%, the results show that sensitivity is generally improved compared to the regular cavity, with glucose/water from 14 MHz/1% to 46.5 MHz/1%, NaCl/water from 36 MHz/1% to 162.5 MHz/1%, and ethanol/water from 20 MHz/1% to 66 MHz/1%.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130093352","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design and Analysis of Power Integrity of DDR5 Dual In-Line Memory Modules DDR5双列存储模块电源完整性设计与分析
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9995596
Shinyoun Park, Vinod Arjun Huddar
{"title":"Design and Analysis of Power Integrity of DDR5 Dual In-Line Memory Modules","authors":"Shinyoun Park, Vinod Arjun Huddar","doi":"10.1109/EDAPS56906.2022.9995596","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9995596","url":null,"abstract":"In today’s high speed design space, speed is the main factor determining the performance of the product. Dual In-line memory modules (DIMM) designs for DDR5 are packed with many high-speed DRAMs with signal speeds high enough that stack-up of the printed circuit board (PCB) play a critical role in the overall DIMM performance. At speeds of 6400 Mbps, power integrity becomes as important as signal integrity. On a first order approximation, power integrity basically involves PCB stack-up and decoupling capacitors design. This paper covers significance of power distribution network (PDN) symmetry in a symmetric stack-up for two-sided component mounted PCBs like DIMM modules running at multi-Gbps speeds.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"2010 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131540081","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design of 915 MHz Phased Conformal Antenna Array for Deep Tumor Hyperthermia Based on Realistic Breast Model and SAR Optimization 基于真实乳房模型和SAR优化的915 MHz深部肿瘤热疗相控阵设计
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9995091
Hongan Zhou, Rui Zhang, Ye Tian, Hongli Peng, Hong Wang, Junfa Mao
{"title":"Design of 915 MHz Phased Conformal Antenna Array for Deep Tumor Hyperthermia Based on Realistic Breast Model and SAR Optimization","authors":"Hongan Zhou, Rui Zhang, Ye Tian, Hongli Peng, Hong Wang, Junfa Mao","doi":"10.1109/EDAPS56906.2022.9995091","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9995091","url":null,"abstract":"In this paper, we describe a specially designed 915MHz phased conformal patch antenna array for clinical deep breast tumor treatment. Firstly, its element is optimized near a realistic breast model, and a 20-element hemispherical conformal array is designed aiming for the specific absorption rate (SAR) within the tumor optimization. Then, the hyperthermia quality of the antenna array is evaluated for 10 mm tumors in radius within the breast under three depths, i.e., 65 mm (deep), 45 mm (medium), and 35 mm (shallow). Our simulation results showed that this array can heat the tumors to more than 43°C for the above three depths. Moreover, healthy tissue near the breast surface can be kept at a low temperature by using water. Based on this study, we conclude that this phased conformal antenna array has the potential for breast tumors hyperthermia.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133448196","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Training Set Optimization with Uncertainty Quantification for Machine Learning Models of Electromagnetic Structures 电磁结构机器学习模型的不确定性量化训练集优化
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI: 10.1109/EDAPS56906.2022.9994897
Yiliang Guo, O. W. Bhatti, Madhavan Swaminathan
{"title":"Training Set Optimization with Uncertainty Quantification for Machine Learning Models of Electromagnetic Structures","authors":"Yiliang Guo, O. W. Bhatti, Madhavan Swaminathan","doi":"10.1109/EDAPS56906.2022.9994897","DOIUrl":"https://doi.org/10.1109/EDAPS56906.2022.9994897","url":null,"abstract":"Neural Networks surrogate modeling for EM simulations saves computational and design time. Introducing uncertainty estimates into deterministic prediction models provides insight into the reliability and confidence of the model. However, gathering training data to train models is a very time-consuming and resource-consuming task. In this paper, we introduce a method to harness useful insights from confidence bounds to reduce the training set size required to train a model with reasonable accuracy and latency. Using a high-speed differential via structure, we show that the training samples required are 35% less with a slight trade-off in accuracy using the proposed method.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115192605","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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