C. S. Geyik, M. Hill, Zhichao Zhang, K. Aygün, J. Aberle
{"title":"2x-Thru De-embedding Uncertainty for On-Package High-Speed Interconnects","authors":"C. S. Geyik, M. Hill, Zhichao Zhang, K. Aygün, J. Aberle","doi":"10.1109/EDAPS56906.2022.9995177","DOIUrl":null,"url":null,"abstract":"With the ever-increasing data rates, interconnect performance predictability becomes more and more challenging. Therefore, along with an accurate methodology, the quantification of measurement reproducibility and its impacts are essential in almost all aspects of high-speed interconnect validation. This paper investigates the reproducibility of S-parameter measurements before and after 2x-Thru de-embedding, and illustrates a multimetric correlation with uncertainty analysis.","PeriodicalId":401014,"journal":{"name":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS56906.2022.9995177","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
With the ever-increasing data rates, interconnect performance predictability becomes more and more challenging. Therefore, along with an accurate methodology, the quantification of measurement reproducibility and its impacts are essential in almost all aspects of high-speed interconnect validation. This paper investigates the reproducibility of S-parameter measurements before and after 2x-Thru de-embedding, and illustrates a multimetric correlation with uncertainty analysis.