C. S. Geyik, M. Hill, Zhichao Zhang, K. Aygün, J. Aberle
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2x-Thru De-embedding Uncertainty for On-Package High-Speed Interconnects
With the ever-increasing data rates, interconnect performance predictability becomes more and more challenging. Therefore, along with an accurate methodology, the quantification of measurement reproducibility and its impacts are essential in almost all aspects of high-speed interconnect validation. This paper investigates the reproducibility of S-parameter measurements before and after 2x-Thru de-embedding, and illustrates a multimetric correlation with uncertainty analysis.