共封装光学(CPO)模块的热解决方案

2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 2022-12-12 DOI:10.1109/EDAPS56906.2022.9994909

K. Matsumoto, M. Farooq, J. Knickerbocker

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引用次数: 0

摘要

在Co-Packaged Optics (CPO)中，光学器件和集成电路连接在共同的基片上，要求保持高散热集成电路的温度尽可能低，并保持光学器件的温度恒定。我们提出了两种解决方案来满足这两种要求，并通过仿真展示了两种解决方案的效果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Thermal solution for Co-Packaged Optics (CPO) modules

In Co-Packaged Optics (CPO) where optical devices and ICs are attached to a common base substrate, there are requirements to keep the temperature of high-heat-dissipating ICs as low as possible and also to keep the temperature of optical devices constant. We propose two solutions to meet these two requirements and show the effect of two solutions by simulation.

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2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

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