Analytical Models for Embedded Discrete and Thin Film Capacitors in Multilayered Printed Circuits

Abstract

Analytical models are proposed for accurate characterization of embedded capacitors in multilayered printed circuit stackups. In the proposed algorithm, a printed circuit board (PCB) is represented as a stack of resonant cavities with embedded thin film and discrete capacitors modeled as layers and components, respectively, in an inner cavity. This representation allows for a mathematical model in the form of finite continued fractions. The frequency domain response of the proposed model is observed in good agreement with data from numerical electromagnetic (EM) simulations, which validate its accuracy. The developed model is intended for quick and practical power integrity (PI) analysis of printed circuits with idefinite number of stackup layers.