M. Ker, Kei-Kang Hong, Tung-Yang Chen, H. Tang, S. Huang, S.-S. Chen, C. Huang, M. Wang, Y. Loh
{"title":"Investigation on ESD robustness of CMOS devices in a 1.8-V 0.15-/spl mu/m partially-depleted SOI salicide CMOS technology","authors":"M. Ker, Kei-Kang Hong, Tung-Yang Chen, H. Tang, S. Huang, S.-S. Chen, C. Huang, M. Wang, Y. Loh","doi":"10.1109/VTSA.2001.934478","DOIUrl":"https://doi.org/10.1109/VTSA.2001.934478","url":null,"abstract":"Electrostatic discharge (ESD) robustness of CMOS devices with four different layout structures fabricated in a 0.15-/spl mu/m partially-depleted silicon-on-insulator (SOI) salicide CMOS process are verified by an ESD tester. The second breakdown current (It2) of fabricated CMOS devices is also measured by the transmission line pulse generator (TLPG). The dependences of ESD robustness on the layout parameters of CMOS devices in this SOI CMOS process have been investigated to find the optimum layout rules for on-chip ESD protection design. The effectiveness of ESD clamp circuits designed with the gate-driven and substrate-triggered techniques are also compared in this SOI CMOS process.","PeriodicalId":388391,"journal":{"name":"2001 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers (Cat. No.01TH8517)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121342388","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"On-chip ESD protection design for GHz RF integrated circuits by using polysilicon diodes in sub-quarter-micron CMOS process","authors":"C. Chang, M. Ker","doi":"10.1109/VTSA.2001.934529","DOIUrl":"https://doi.org/10.1109/VTSA.2001.934529","url":null,"abstract":"ESD protection in RF integrated circuits has several considerations: low parasitic capacitance, constant input capacitance, and insensitive to substrate coupling noise. In this paper, a new ESD protection design with polysilicon diodes for RF IC applications is proposed and characterized. The proposed polysilicon diode is constructed by a polysilicon layer in a general CMOS process with a central un-doped region. The polysilicon diode with variation on the width of the central un-doped region is characterized at different temperatures. An on-chip ESD protection circuit realized with the stacked polysilicon diodes to reduce the total input capacitance for GHz RF application is demonstrated.","PeriodicalId":388391,"journal":{"name":"2001 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers (Cat. No.01TH8517)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125395037","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
H. Lin, D. Lee, C. Lee, T. Chao, T. Huang, T. Wang
{"title":"New insights into breakdown modes and their evolution in ultra-thin gate oxide","authors":"H. Lin, D. Lee, C. Lee, T. Chao, T. Huang, T. Wang","doi":"10.1109/VTSA.2001.934477","DOIUrl":"https://doi.org/10.1109/VTSA.2001.934477","url":null,"abstract":"By carefully analyzing post-breakdown current-voltage characteristics of MOS devices, it was found that the soft-breakdown mode typically induced in devices with oxide thinner than 3 nm is quite different from that with oxide thicker than 3 nm. Based on our findings, a unified model is proposed to explain the evolution of different breakdown modes. Impacts of each breakdown on the device's switching behavior are also discussed.","PeriodicalId":388391,"journal":{"name":"2001 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers (Cat. No.01TH8517)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127741850","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
B. Yu, H. Wang, C. Riccobene, Hyeon-Seag Kim, Q. Xiang, M. Lin, Leland Chang, C. Hu
{"title":"Nanoscale CMOS at low temperature: design, reliability, and scaling trend","authors":"B. Yu, H. Wang, C. Riccobene, Hyeon-Seag Kim, Q. Xiang, M. Lin, Leland Chang, C. Hu","doi":"10.1109/VTSA.2001.934473","DOIUrl":"https://doi.org/10.1109/VTSA.2001.934473","url":null,"abstract":"The semiconductor industry is not motivated to make practical use of cryogenic operation as long as IC performance could be improved at room temperature. However, as CMOS approaches the scaling limits, cooled chip operation becomes an attractive alternative. This paper explores the feasibility of IC temperature \"scaling\" and its implications to device performance and reliability for sub-50 nm CMOS generations.","PeriodicalId":388391,"journal":{"name":"2001 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers (Cat. No.01TH8517)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121557754","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
M. Houssa, M. Naili, V. Afanas'ev, M. Heyns, A. Stesmans
{"title":"Electrical and physical characterization of high-k dielectric layers","authors":"M. Houssa, M. Naili, V. Afanas'ev, M. Heyns, A. Stesmans","doi":"10.1109/VTSA.2001.934518","DOIUrl":"https://doi.org/10.1109/VTSA.2001.934518","url":null,"abstract":"The continuous reduction of the gate insulator (SiO/sub 2/) layer thickness in advanced complementary metal-oxide-semiconductor (MOS) devices leads to excessive gate leakage currents and device reliability problems. Consequently, alternative gate insulators with higher electrical permittivity than SiO/sub 2/ are currently widely investigated for the future generations of MOS transistors. The use of dielectric layers with higher electrical permittivity should allow us to use thicker films with electrical thickness equivalent to ultra-thin SiO/sub 2/ (as far as gate capacitance is concerned), and one would thus expect to reduce the leakage current and improve the reliability of the gate dielectric layer. In this paper, we investigate the electrical properties of MOS capacitors with ultra-thin high permittivity gate stacks consisting of an ultra-thin interfacial oxynitride (SiON) layer and a metal oxide layer. The frequency dispersion in the capacitance-voltage characteristics is first studied. Next, the polarity dependence of the current through the gate stack is addressed. Finally, the generation of traps during constant gate voltage stress of capacitors is investigated.","PeriodicalId":388391,"journal":{"name":"2001 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers (Cat. No.01TH8517)","volume":"99 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125033734","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
M. Wang, C. Chen, M.C. Yu, T. Hou, Y.M. Lin, S.C. Chcn, Y. Fang, C. Yu, M. Liang
{"title":"Ultrathin ox/nitride gate stack for sub-quarter-micron CMOS devices prepared by RTCVD","authors":"M. Wang, C. Chen, M.C. Yu, T. Hou, Y.M. Lin, S.C. Chcn, Y. Fang, C. Yu, M. Liang","doi":"10.1109/VTSA.2001.934521","DOIUrl":"https://doi.org/10.1109/VTSA.2001.934521","url":null,"abstract":"The paper gives a short overview of ox/nitride gate stack prepared by rapid thermal chemical vapor deposition (RTCVD) for sub-quarter-micron CMOS process. The main portion is focused on the dissimilar characteristics of different interfacial oxide in ox/nitride gate stack. Post deposition annealing is also investigated including NH/sub 3/ and N/sub 2/O treatment. Excellent improvements are available including lower gate leakage current, comparable driving current, suitable interface density of states and stable gate dielectric reliability.","PeriodicalId":388391,"journal":{"name":"2001 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers (Cat. No.01TH8517)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117033077","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"ESD protection strategy for sub-quarter-micron CMOS technology: gate-driven design versus substrate-triggered design","authors":"Tung-Yang Chen, M. Ker","doi":"10.1109/VTSA.2001.934527","DOIUrl":"https://doi.org/10.1109/VTSA.2001.934527","url":null,"abstract":"The operation principles of gate-driven design and substrate-triggered design for ESD (Electrostatic Discharge) protection are first explained by energy-band diagrams in this paper. The on-chip ESD protection devices realized in 0.18 /spl mu/m and 0.35 /spl mu/m CMOS processes are used to verify the efficiency of gate-driven or substrate-triggered designs. The substrate-triggered design can effectively and continually improve ESD robustness of protection devices and is better than the gate-driven design. The HBM (Human-Body-Model) ESD level of NMOS with a W/L of 300 /spl mu/m/0.3 /spl mu/m can be improved from the original 0.8 kV to become 3.3 kV by the substrate-triggered design. But, the gate-driven design cannot continually improve the ESD level of the same device in the subquarter-micron CMOS process.","PeriodicalId":388391,"journal":{"name":"2001 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers (Cat. No.01TH8517)","volume":"95 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126832123","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
P. Verheyen, N. Collaert, M. Caymax, R. Loo, M. Van Rossum, K. De Meyer
{"title":"A 50 nm vertical Si/sub 0.70/Ge/sub 0.30//Si/sub 0.85/Ge/sub 0.15/ pMOSFET with an oxide/nitride gate dielectric","authors":"P. Verheyen, N. Collaert, M. Caymax, R. Loo, M. Van Rossum, K. De Meyer","doi":"10.1109/VTSA.2001.934470","DOIUrl":"https://doi.org/10.1109/VTSA.2001.934470","url":null,"abstract":"Vertical Reduced Pressure Chemical Vapour Deposition (RP-CVD) grown heterojunction pMOS transistors with a Si/sub 0.70/Ge/sub 0.30//Si/sub 0.85/Ge/sub 0.15/ source stack have been fabricated with channel lengths down to 50 nm on a strain relaxed Si/sub 0.85/Ge/sub 0.15/ buffer layer. This paper reports on the viability of this source stack to suppress short channel effects in this channel length region. This is done by comparing the electrical characteristics of vertical Si/sub 0.85/Ge/sub 0.15/ homojunction transistors, and vertical Si/sub 0.70/Ge/sub 0.30//Si/sub 0.85/Ge/sub 0.15/ heterojunction transistors, with channel lengths of 90 nm and 50 nm.","PeriodicalId":388391,"journal":{"name":"2001 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers (Cat. No.01TH8517)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134109270","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}