2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献_第8页

Electrical characteristics evolution of the Deep Trench Termination diode based on a finite elements simulation approach 基于有限元模拟方法的深沟槽终端二极管电特性演化

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813814

F. Baccar, F. Le Henaff, L. Théolier, S. Azzopardi, E. Woirgard

引用次数: 3

Combined experimental- and FE-studies on sinter-Ag behaviour and effects on IGBT-module reliability 烧结银行为及其对igbt模块可靠性影响的实验与有限元结合研究

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813870

R. Dudek, R. Doring, P. Sommer, B. Seiler, K. Kreyssig, H. Walter, M. Becker, M. Gunther

{"title":"Combined experimental- and FE-studies on sinter-Ag behaviour and effects on IGBT-module reliability","authors":"R. Dudek, R. Doring, P. Sommer, B. Seiler, K. Kreyssig, H. Walter, M. Becker, M. Gunther","doi":"10.1109/EUROSIME.2014.6813870","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813870","url":null,"abstract":"For high temperature interconnection sintered silver can be used, however, it induces new demands on the thermo-mechanical design. That issue requires knowledge on the thermo-mechanical reliability of silver sintered devices, the subject of this paper. Material characteristics of the sinter layers are needed for simulation, which are addressed in the first part of the paper. Based on material properties of pure silver, for sintered silver with different porosities effective material characteristics have been derived by use of a micromechanical cell model. Shear loadings with in-situ deformation analyses have also been made to investigate sintered silver behavior. A complicated dependence on processing, temperature, and deformation rate is seen. Based on different effective constitutive models for the sintered interconnects, stress loadings are studied for a power module, an IGBT on DCB substrate, for passive and active thermal cycling. For the passive cycle complex interactions of the different layers of the stack are observed, which are not seen in a module with soft solder bonding. This result can be attributed to the missing decoupling by the soft soldering layer. Failure risks are evaluated by both conventional FEA and cohesive zone modeling. A quite different stress situation is depicted for active power cycling. The situation is even more complex and it is obvious from the simulations, that active power cycling can induce failure modes different from passive cycling.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125226612","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 27

Drop impact simulations for lifetime assessment of PCB/BGA assemblies regarding pad cratering 用于PCB/BGA组件的寿命评估的跌落冲击模拟

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813789

Grace L. Tsebo Simo, H. Shirangi, M. Nowottnick, R. Dudek, E. Kaulfersch, S. Rzepka, B. Michel

{"title":"Drop impact simulations for lifetime assessment of PCB/BGA assemblies regarding pad cratering","authors":"Grace L. Tsebo Simo, H. Shirangi, M. Nowottnick, R. Dudek, E. Kaulfersch, S. Rzepka, B. Michel","doi":"10.1109/EUROSIME.2014.6813789","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813789","url":null,"abstract":"In automotive electronics, complex automotive functionalities are managed by car's computers such as electronic control units (ECU). Albeit extremely rare, accidental drop impacts may occur during transportation or mounting ECUs on automobiles, damaging the built-in printed circuit board (PCB)/ball grid array (BGA) package assembly. However, due to larger package dimensions together with heavy components such as capacitors mounted on the board surface, higher acceleration and stress levels can be achieved on ECU electronic components than on hand-held electronic devices during a drop impact. In such cases, the board level drop test methodology defined in the Joint Electron Device Engineering Council (JEDEC) standard needs to be modified in order to match the requirements in automotive applications. The experimental setup used in this study includes a test board clamped between two aluminum frames with the help of screws, in order to reproduce the real clamping conditions of the PCB in an ECU. Furthermore, the new board design allows mounting additional masses at the center of the PCB to take into account the effect of the mass of electronic components present in real ECUs. In this work, the mechanical behavior of PCB/BGA assemblies used in automotive applications when subjected to drop events is assessed. Numerical simulations of the board behavior are performed in order to analyze the transient structural response of the PCB and evaluate the local stresses on the board/joint interface responsible for pad cratering. By varying the loading conditions, different stress levels can be achieved on the PCB laminate directly under the solder joints and a stress-life curve for predicting the assembly lifetime is hence established.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116544803","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Determination of cyclic mechanical properties of thin copper layers for PCB applications PCB用薄铜层循环机械性能的测定

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813788

Klaus Fellner, P. Fuchs, T. Antretter, G. Pinter, R. Schongrundner

{"title":"Determination of cyclic mechanical properties of thin copper layers for PCB applications","authors":"Klaus Fellner, P. Fuchs, T. Antretter, G. Pinter, R. Schongrundner","doi":"10.1109/EUROSIME.2014.6813788","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813788","url":null,"abstract":"The overall objective of this research work is the characterization of the mechanical behavior of Printed Circuit Boards (PCBs) under cyclic thermal loads. The conducting traces in PCBs are made from thin copper layers in an etching process. Hence, thin copper layers are characterized experimentally and subsequently cyclic material parameters are determined. The experimental characterization is conducted using cyclic tensile-compression tests at different temperatures and loading conditions. For these tests composite specimens made of five layers of copper and four layers of glass fiber reinforced epoxy resin are used. The obtained material response is modeled using the “Nonlinear isotropic/kinematic hardening model” built-in in the Finite Element Analysis-software Abaqus. For every loading case the optimal set of parameters is determined using an optimization procedure. Based on the known parameter sets of the individual loading cases the calibration of a “Nonlinear isotropic/kinematic hardening model” for all R-ratios and temperatures is attempted and the findings are discussed.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126212358","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 12

Methodology for supporting electronic system prototyping through semiautomatic component selection 通过半自动元件选择支持电子系统原型的方法学

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813792

R. Świerczyński, K. Urbanski, A. Wymyslowski

引用次数: 1

Structure design and reliability assessment of double-sided with double-chip stacking packaging 双面双片堆叠封装结构设计及可靠性评估

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813809

Yen-Fu Su, Chun-Te Lin, T. Kuo, K. Chiang

{"title":"Structure design and reliability assessment of double-sided with double-chip stacking packaging","authors":"Yen-Fu Su, Chun-Te Lin, T. Kuo, K. Chiang","doi":"10.1109/EUROSIME.2014.6813809","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813809","url":null,"abstract":"Recently, consumer electronics demand has been geared towards lightweight, high efficiency, and small form factor devices. These characteristics can be accomplished by using three-dimensional (3D) integrated circuit (IC) technology. This study proposes a double-chip stacking structure in an embedded fan-out wafer level packaging (WLP) with double-sided interconnections. Regarding to the proposed structure, the finite element (FE) model is established to investigate the actual thermo-mechanical behavior during thermal cycling loading. The suitable geometry design of buffer layer and carrier can enhance the reliability of solder joint. The application of soft filler and passivation materials can increase the predicted fatigue life to more than 2,500 cycles. However, the high coefficient of thermal expansion (CTE) of soft filler material will induce significant deformation and excessive strain on the trace layer. Based on the above simulation methodology and life prediction model, the development of the proposed structure can be optimized within a feasible time. This effective methodology is necessary in the electronic packaging industry to reduce time-to-market and fabrication cost when a new packaging structure is being developed.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"95 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126877799","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Understanding delamination for fast development of reliable packages for automotive applications. A consideration of robustness for new packages based on simulation 了解分层以快速开发汽车应用的可靠封装。基于仿真的新包鲁棒性研究

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813784

R. Pufall, M. Goroll, G. M. Reuther

{"title":"Understanding delamination for fast development of reliable packages for automotive applications. A consideration of robustness for new packages based on simulation","authors":"R. Pufall, M. Goroll, G. M. Reuther","doi":"10.1109/EUROSIME.2014.6813784","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813784","url":null,"abstract":"Thermo-mechanical stress caused by the mismatch of coefficients of thermal expansion (CTE) and temperature variations remain a major concern for the reliability of semiconductor components. This issue is usually addressed by exposing the component to temperature cycling stress tests for a certain number of cycles, followed by e.g. scanning acoustic microscopy (SAM) to investigate delamination. Discussions about specific cycling conditions, e.g. using -65°C/+175°C instead of -55°C/+150°C for the minimum and maximum temperatures of the cycles or even using liquid-liquid cycling instead of air to air to speed up investigations [1], are often moot, because no real understanding of the effect of the cycling conditions on the component is available. Furthermore, it is almost a truism that testing alone does not suffice to ensure the reliability of a component. Reliability has to be built into the components from the beginning. As a consequence, the question should be turned around: It is not enough to look at delamination after a certain number of cycles in a stress test. The question is rather how the component should be designed and how the materials should be chosen to prevent delamination. Thus, the focus is changed from measuring delamination to measuring adhesion. This paper presents an approach for a better understanding of adhesion in terms of possible material combinations, temperature influence (ageing, delamination due to critical induced stress) and topology of interfaces.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122081822","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Electromigration reliability of cylindrical Cu pillar SnAg3.0Cu0.5 bumps SnAg3.0Cu0.5圆柱铜柱的电迁移可靠性

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813775

L. Meinshausen, K. Weide-Zaage, B. Goldbeck, A. Moujbani, J. Kludt, H. Frémont

{"title":"Electromigration reliability of cylindrical Cu pillar SnAg3.0Cu0.5 bumps","authors":"L. Meinshausen, K. Weide-Zaage, B. Goldbeck, A. Moujbani, J. Kludt, H. Frémont","doi":"10.1109/EUROSIME.2014.6813775","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813775","url":null,"abstract":"The main trends in consumer electronics are increasing performances of their products and a reduction of the costs. These trends lead to an ongoing integration on package level which leads to a decreasing size of the solder contacts. This goes along with a higher sensibility to thermal-mechanical stress and void formation due to electromigration (EM). Against this background copper pillar bumps were introduced, because they combine the robustness of metal wire bonds with the low bonding pressure of reflow soldering. Experimental results have shown a longer lifetime of Cu pillar bumps during EM tests, but a continuative analysis is still needed for design optimization. Against this background a finite element analysis (FEA) was performed to compare the EM induced mass flux in conventional solder bumps and in two different designs for Cu pillar bumps. The thermal electrical simulations were performed with ANSYS®. Afterwards a user routine was used to calculate the EM induced mass fluxes and mass flux divergences. The simulation results are used to identify possible reasons for the increased EM performance of Cu pillar bumps and they enable the identification of preferable designs.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132480832","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Investigation of a finned baseplate material and thickness variation for thermal performance of a SiC power module SiC功率模块翅片基板材料及厚度变化对热性能影响的研究

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813817

Yafan Zhang, I. Belov, M. Bakowski, Jang-Kwon Lim, P. Leisner, H. Nee

{"title":"Investigation of a finned baseplate material and thickness variation for thermal performance of a SiC power module","authors":"Yafan Zhang, I. Belov, M. Bakowski, Jang-Kwon Lim, P. Leisner, H. Nee","doi":"10.1109/EUROSIME.2014.6813817","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813817","url":null,"abstract":"A simplified transient computational fluid dynamics model of an automotive three-phase double-side liquid cooled silicon carbide power inverter, including pin-fin baseplates, has been developed and qualified for parametric studies. Effective heat transfer coefficients have been extracted from the detailed pin-fin baseplate model for two coolant volume flow rates 2 l/min and 6 l/min, at the coolant temperature 105°C. The inverter model includes temperature dependent heat losses of SiC transistors and diodes, calculated for two driving cycles. Baseplate materials such as copper, aluminum-silicon carbide metal matrix composite, aluminium alloy 6061 as well as virtual materials have been evaluated in the parametric studies. Thermal conductivity, specific heat and density have been varied as well as thickness of the finned baseplates (1 to 3 mm). A trade-off between temperature of SiC chips and baseplate weight has been investigated by means of Pareto optimization. The main results of the parametric studies include a weak dependence (1 to 3°C) of the chip temperature on baseplate thickness. Furthermore, switching e.g. between copper and AlSiC results in 5 to 8°C increase of the chip temperature, at 65 to 70% baseplate weight reduction.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131612514","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Design, technology, numerical simulation and optimization of building blocks of a micro and nano scale tensile testing platform with focus on a piezoresistive force sensor 微纳米尺度拉伸测试平台的设计、工艺、数值模拟与优化，重点是压阻式力传感器

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2014-04-07 DOI: 10.1109/EUROSIME.2014.6813843

P. Meszmer, K. Hiller, D. May, S. Hartmann, A. Shaporin, J. Mehner, B. Wunderle

{"title":"Design, technology, numerical simulation and optimization of building blocks of a micro and nano scale tensile testing platform with focus on a piezoresistive force sensor","authors":"P. Meszmer, K. Hiller, D. May, S. Hartmann, A. Shaporin, J. Mehner, B. Wunderle","doi":"10.1109/EUROSIME.2014.6813843","DOIUrl":"https://doi.org/10.1109/EUROSIME.2014.6813843","url":null,"abstract":"In this paper, building blocks of a MEMS tensile testing platform are presented. The building blocks include a thermo-mechanical MEMS actuator, driven by an aluminum thin-film heater on a thermal oxide for electrical insulation, a capacitative displacement sensor and a piezoresistive force sensor, capable of measuring forces on a nano-newton scale. It is shown, that the presented building blocks fulfill the requirements for the use in a tensile loading stage for thermo-mechanical material characterization of one dimensional material samples on a micro- and nanoscopic scale under different environmental conditions, as varying temperatures, pressure, moisture. All components are realized in BDRIE technology, following a specimen centered approach. In extension to previous presented actuators and sensors, the authors are aiming for high flexibility and full integratability of all components on the wafer-level and require for all building blocks the capability of electrical drive and electrical in situ readout, respectively.","PeriodicalId":359430,"journal":{"name":"2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131762307","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5